公开(公告)号：US20120211780A1

公开(公告)日：2012-08-23

申请号：US13404924

申请日：2012-02-24

申请人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

发明人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

IPC分类号： H01L33/50

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

摘要翻译： 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

公开(公告)号：US08084778B2

公开(公告)日：2011-12-27

申请号：US12571751

申请日：2009-10-01

申请人： Ho Sun Paek ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

发明人： Ho Sun Paek ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

摘要： There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

摘要翻译： 提供了具有高散热效率的LED封装。 根据本发明的一个方面的LED封装可以包括：封装主体，包括凹入到封装体中的第一凹槽部分，并且作为安装区域设置在封装主体的顶部; 第一引线框架和第二引线框架布置在第一槽部分的下表面上，同时第一和第二引线框架的一部分被暴露; LED芯片安装在第一槽部分的下表面上并电连接到第一和第二引线框架; 以及设置在包装体的底部并由碳纳米管形成的多个散热图案。

公开(公告)号：US08278671B2

公开(公告)日：2012-10-02

申请号：US13404924

申请日：2012-02-24

申请人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

发明人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

摘要翻译： 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

公开(公告)号：US20100171143A1

公开(公告)日：2010-07-08

申请号：US12571751

申请日：2009-10-01

申请人： Ho Sun PAEK ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

发明人： Ho Sun PAEK ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

摘要： There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

摘要翻译： 提供了具有高散热效率的LED封装。 根据本发明的一个方面的LED封装可以包括：封装主体，包括凹入到封装体中的第一凹槽部分，并且作为安装区域设置在封装主体的顶部; 第一引线框架和第二引线框架布置在第一槽部分的下表面上，同时第一和第二引线框架的一部分被暴露; LED芯片安装在第一槽部分的下表面上并电连接到第一和第二引线框架; 以及设置在包装体的底部并由碳纳米管形成的多个散热图案。

公开(公告)号：US08076692B2

公开(公告)日：2011-12-13

申请号：US12255469

申请日：2008-10-21

申请人： Hyung Kun Kim ,  Ho Sun Paek ,  Suk Ho Jung ,  Hak Hwan Kim ,  Young Jin Lee

发明人： Hyung Kun Kim ,  Ho Sun Paek ,  Suk Ho Jung ,  Hak Hwan Kim ,  Young Jin Lee

IPC分类号： H01L33/00 ,  H01L23/34

CPC分类号： H01L33/642 ,  F21K9/00 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.

摘要翻译： 本发明提供一种LED封装体，其特征在于，包括：散热体，其在外周面设置有多个径向突出的散热片，在所述散热片之间填充空间的成型材料; 封装体，其被容纳在所述散热体的顶面上并具有空腔; 一对引线框架从散热体的上部延伸到其两侧; 以及安装在腔内的LED芯片。

公开(公告)号：US08183583B2

公开(公告)日：2012-05-22

申请号：US12571754

申请日：2009-10-01

申请人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

发明人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.

摘要翻译： 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。 因此，防止由黄化引起的LED的发光效率的降低，从而提高发光效率并实现尺寸的减小。

公开(公告)号：US20100051985A1

公开(公告)日：2010-03-04

申请号：US12255469

申请日：2008-10-21

申请人： Hyung Kun KIM ,  Ho Sun Paek ,  Suk Ho Jung ,  Hak Hwan Kim ,  Young Jin Lee

发明人： Hyung Kun KIM ,  Ho Sun Paek ,  Suk Ho Jung ,  Hak Hwan Kim ,  Young Jin Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  F21K9/00 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.

摘要翻译： 本发明提供一种LED封装体，其特征在于，包括：散热体，其在外周面设置有多个径向突出的散热片，在所述散热片之间填充空间的成型材料; 封装体，其被容纳在所述散热体的顶面上并具有空腔; 一对引线框架从散热体的上部延伸到其两侧; 以及安装在腔内的LED芯片。

公开(公告)号：US20100128461A1

公开(公告)日：2010-05-27

申请号：US12343452

申请日：2008-12-23

申请人： Hyung Kun KIM ,  Ho Sun Paek ,  Suk Ho Jung ,  Jeong Wook Lee

发明人： Hyung Kun KIM ,  Ho Sun Paek ,  Suk Ho Jung ,  Jeong Wook Lee

IPC分类号： F21V9/08

CPC分类号： H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips.

摘要翻译： 提供了一种发光二极管（LED）封装。 LED封装包括封装主体，第一和第二电极结构，第一和第二LED芯片以及第一和第二树脂封装部件。 包装主体包括凹部和将凹部分成至少第一和第二容纳凹部的阻挡壁。 第一和第二电极结构形成在封装主体处，分别暴露在第一和第二容纳凹槽的底表面处。 第一和第二LED芯片电连接到第一和第二电极结构分别安装在第一和第二容纳凹部的底表面上。 第一和第二树脂包装部分包括至少一种荧光材料，并且形成在用于包装第一和第二LED芯片的第一和第二容纳凹部中。

公开(公告)号：US08558268B2

公开(公告)日：2013-10-15

申请号：US12343452

申请日：2008-12-23

申请人： Hyung Kun Kim ,  Ho Sun Paek ,  Suk Ho Jung ,  Jeong Wook Lee

发明人： Hyung Kun Kim ,  Ho Sun Paek ,  Suk Ho Jung ,  Jeong Wook Lee

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips.

摘要翻译： 提供了一种发光二极管（LED）封装。 LED封装包括封装主体，第一和第二电极结构，第一和第二LED芯片以及第一和第二树脂封装部件。 包装主体包括凹部和将凹部分成至少第一和第二容纳凹部的阻挡壁。 第一和第二电极结构形成在封装主体处，分别暴露在第一和第二容纳凹槽的底表面处。 第一和第二LED芯片电连接到第一和第二电极结构分别安装在第一和第二容纳凹部的底表面上。 第一和第二树脂包装部分包括至少一种荧光材料，并且形成在用于包装第一和第二LED芯片的第一和第二容纳凹部中。