公开(公告)号：US20170196096A1

公开(公告)日：2017-07-06

申请号：US15398935

申请日：2017-01-05

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Ayumi SHIBATA ,  Kosuke IKEDA

IPC: H05K3/46 ,  H05K1/18 ,  H05K3/06 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K3/0035 ,  H05K3/0097 ,  H05K3/061 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2201/04 ,  H05K2201/09863 ,  H05K2203/1536

Abstract: A printed wiring board includes a resin insulating layer, a projecting conductor layer formed on a surface of the resin insulating layer such that the projecting conductor layer is projecting from the surface of the resin insulating layer, and an integral conductor structure formed in the resin insulating layer and including a via conductor portion and an embedded conductor layer portion such that the embedded conductor layer portion is embedded in the resin insulating layer on the opposite side of the resin insulating layer with respect to the projecting conductor layer and has an exposed surface exposed from the resin insulating layer and the via conductor portion is formed through the resin insulating layer and is connecting the embedded conductor layer portion and projecting conductor layer. The projecting conductor layer and integral conductor structure are formed such that the projecting conductor layer and integral conductor structure are individual conductor structures.