公开(公告)号：US09185806B2

公开(公告)日：2015-11-10

申请号：US14041743

申请日：2013-09-30

Applicant: IBIDEN CO., LTD.

Inventor： Fumitaka Takagi ,  Nobuhisa Kuroda ,  Mariko Kimura

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/02 ,  H01L23/498 ,  H05K3/34 ,  H01L23/00

CPC classification number: H05K1/183 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/83411 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/181 ,  H05K3/02 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A printed wiring board includes an interlayer resin insulation layer, a pad structure formed on the interlayer resin insulation layer and positioned to mount a semiconductor device, and a solder-resist layer formed on the interlayer resin insulation layer and having an opening portion exposing a portion of the pad structure from the solder-resist layer. The opening portion of the solder-resist layer has a bottom surface such that the bottom surface of the opening portion is exposing an upper surface and a portion of a side surface of the pad structure.

Abstract translation: 印刷布线板包括层间树脂绝缘层，形成在层间树脂绝缘层上并定位成安装半导体器件的焊盘结构，以及形成在层间树脂绝缘层上的阻焊层，并且具有露出部分 的焊料结构。 阻焊层的开口部分具有底表面，使得开口部分的底表面暴露焊盘结构的上表面和侧表面的一部分。