公开(公告)号：US20140231990A1

公开(公告)日：2014-08-21

申请号：US14265887

申请日：2014-04-30

Applicant: IBIDEN CO., LTD.

Inventor： Shinji OUCHI ,  Shigeru YAMADA ,  Makoto TERUI ,  Yoshinori SHIZUNO

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49811 ,  H01L21/76885 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02377 ,  H01L2224/0346 ,  H01L2224/03831 ,  H01L2224/0401 ,  H01L2224/0501 ,  H01L2224/05016 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05555 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor chip and a wiring board formed on the semiconductor chip. The wiring board includes a first insulation layer, first conductive patterns on the first layer, first via conductors formed in the first layer and connecting the first patterns and electrode pads of the chip, respectively, a second insulation layer on the first layer, second conductive patterns on the second layer, and second via conductors formed in the second layer and connecting the first conductive patterns and the second patterns, respectively, each second via conductors has a side surface extending through the second layer such that the side surface has a bent portion which changes inclination of the side surface in depth direction of each second via conductor, and the second patterns are positioned to fan in or out with respect to the electrode pads.

Abstract translation: 半导体器件包括形成在半导体芯片上的半导体芯片和布线板。 布线基板包括第一绝缘层，第一层上的第一导电图案，形成在第一层中的第一通孔导体，分别连接芯片的第一图案和电极焊盘，第一绝缘层，第二导电层 第二层上的图案和形成在第二层中并分别连接第一导电图案和第二图案的第二通孔导体分别具有每个第二通孔导体，具有延伸穿过第二层的侧表面，使得侧表面具有弯曲部分 其改变每个第二通孔导体在深度方向上的侧表面的倾斜度，并且第二图案被定位成相对于电极焊盘进入或者退出。

公开(公告)号：US20130341077A1

公开(公告)日：2013-12-26

申请号：US13752768

申请日：2013-01-29

Applicant: IBIDEN CO., LTD.

Inventor： Shinji OUCHI ,  Hirokazu HIGASHI

IPC: H05K3/22 ,  H05K1/11

CPC classification number: H05K1/115 ,  H05K3/1241 ,  H05K3/1283 ,  H05K3/225 ,  H05K2203/107

Abstract: A method for repairing a disconnection in a wiring board includes positioning a substrate including an insulation layer and a conductive layer formed on the insulation layer, the conductive layer having a wiring line disconnected such that the wiring line has a disconnected portion formed between conductive patterns forming the wiring line, applying in the disconnected portion between the conductive patterns a conductive paste including a non-conductive material and conductive particles such that the conductive paste fills the disconnected portion between the conductive patterns and joins the conductive patterns forming the wiring line in the conductive layer, and irradiating laser upon the conductive paste applied in the disconnected portion such that at least a portion of the conductive paste in the disconnected portion is sintered and forms a sintered portion connecting the conductive patterns of the wiring line in the conductive layer.

Abstract translation: 一种用于修复布线板中的断开的方法，包括定位包括绝缘层和形成在绝缘层上的导电层的基板，导电层具有断开的布线，使得布线具有形成在导电图案之间的导电图案之间的断开部分 布线，在导电图案之间的断开部分中施加包括非导电材料的导电浆料和导电颗粒，使得导电浆料填充导电图案之间的断开部分，并将形成布线的导电图案连接到导电 层，并且将激光照射在施加在断开部分中的导电膏上，使得断开部分中的至少一部分导电膏被烧结并形成连接导电层中的布线的导电图案的烧结部分。