公开(公告)号：US20190232218A1

公开(公告)日：2019-08-01

申请号：US16260495

申请日：2019-01-29

Applicant: IBIDEN CO., LTD.

Inventor： Masatoshi KUNIEDA ,  Hirokazu HIGASHI ,  Tatsuhiro KAWAI

IPC: B01D53/22 ,  B01D69/06 ,  B01D69/12

CPC classification number: B01D53/228 ,  B01D69/06 ,  B01D69/12 ,  B01D2325/02 ,  B01D2325/06 ,  B01D2325/08 ,  B01D2325/44

Abstract: A filter membrane includes a membrane having through holes that selectively separates specific material in processing medium, the membrane including first, second and third layers such that the first layer has first surface that is supplied with processing medium, the third layer has second surface on the opposite side of the first surface, and the second layer is formed between the first and third layers. The first layer includes first convex and concave portions, the third layer includes second convex and concave portions each having a larger area than each first concave portion, the second convex portions are formed to surround the second concave portions and connected to one another, the second layer has through holes connecting the second concave portions and first set of the first concave portions, and the first concave portions include second set in regions opposing the second convex portions that is connected to each other.

公开(公告)号：US20150075851A1

公开(公告)日：2015-03-19

申请号：US14548725

申请日：2014-11-20

Applicant: IBIDEN CO., LTD.

Inventor： Masahiro KANEKO ,  Satoru KOSE ,  Hirokazu HIGASHI

IPC: H05K3/42 ,  H05K1/03 ,  H05K3/22 ,  H05K1/11

CPC classification number: H05K3/42 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K1/113 ,  H05K1/115 ,  H05K3/007 ,  H05K3/108 ,  H05K3/22 ,  H05K3/388 ,  H05K2201/0344 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/072 ,  H05K2203/1377 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.

Abstract translation: 印刷电路板包括具有贯通孔的层间树脂绝缘层，形成在层间树脂绝缘层的第一表面上的导电电路，形成在层间树脂绝缘层的穿透孔中并与导电 电路，形成在填充的通路导体的第一表面上并具有无电解电镀结构的第一表面处理涂层结构和形成在填充通孔导体的第二表面上的第二表面处理涂层结构，该第二表面处理涂层结构相对于 涉及第一表面处理涂层结构并具有化学镀层结构。 填充的通孔导体包括形成在穿透孔的侧壁上的第一导电层和填充穿透孔的电镀材料，第一表面处理涂层结构的厚度与第二表面处理涂层的厚度不同 结构体。

公开(公告)号：US20130341077A1

公开(公告)日：2013-12-26

申请号：US13752768

申请日：2013-01-29

Applicant: IBIDEN CO., LTD.

Inventor： Shinji OUCHI ,  Hirokazu HIGASHI

IPC: H05K3/22 ,  H05K1/11

CPC classification number: H05K1/115 ,  H05K3/1241 ,  H05K3/1283 ,  H05K3/225 ,  H05K2203/107

Abstract: A method for repairing a disconnection in a wiring board includes positioning a substrate including an insulation layer and a conductive layer formed on the insulation layer, the conductive layer having a wiring line disconnected such that the wiring line has a disconnected portion formed between conductive patterns forming the wiring line, applying in the disconnected portion between the conductive patterns a conductive paste including a non-conductive material and conductive particles such that the conductive paste fills the disconnected portion between the conductive patterns and joins the conductive patterns forming the wiring line in the conductive layer, and irradiating laser upon the conductive paste applied in the disconnected portion such that at least a portion of the conductive paste in the disconnected portion is sintered and forms a sintered portion connecting the conductive patterns of the wiring line in the conductive layer.

Abstract translation: 一种用于修复布线板中的断开的方法，包括定位包括绝缘层和形成在绝缘层上的导电层的基板，导电层具有断开的布线，使得布线具有形成在导电图案之间的导电图案之间的断开部分 布线，在导电图案之间的断开部分中施加包括非导电材料的导电浆料和导电颗粒，使得导电浆料填充导电图案之间的断开部分，并将形成布线的导电图案连接到导电 层，并且将激光照射在施加在断开部分中的导电膏上，使得断开部分中的至少一部分导电膏被烧结并形成连接导电层中的布线的导电图案的烧结部分。