公开(公告)号：US20150271929A1

公开(公告)日：2015-09-24

申请号：US14663559

申请日：2015-03-20

Applicant: IBIDEN CO., LTD.

Inventor： Kota NODA ,  Takema ADACHI ,  Wataru NAKAMURA

IPC: H05K3/42 ,  C25D5/02 ,  C25D5/34 ,  C25D7/12 ,  C25D5/48

CPC classification number: C25D5/022 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/38 ,  C25D5/10 ,  C25D5/12 ,  C25D7/00 ,  C25D7/123 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4007 ,  H05K3/4644

Abstract: A method for manufacturing a wiring board having conductive posts includes preparing a wiring board including electronic circuit and a solder resist layer covering the electronic circuit and having first openings and second openings surrounding the first openings such that the first openings are exposing pad portions of the electronic circuit and that the second openings are exposing post connecting portions of the electronic circuit surrounding the pad portions, applying surface treatment to the pad portions, forming a plating resist layer on the wiring board after the surface treatment of the pad portions such that the plating resist layer has resist openings exposing the post connecting portions, applying electrolytic plating on the post connecting portions such that conductive posts rising from the post connecting portions are formed in the resist openings, and removing the plating resist layer from the wiring board after forming the conductive posts in the resist openings.

Abstract translation: 一种制造具有导电柱的布线板的方法，包括制备包括电子电路的布线板和覆盖电子电路的阻焊层，并且具有围绕第一开口的第一开口和第二开口，使得第一开口暴露电子部件的焊盘部分 并且第二开口暴露围绕焊盘部分的电子电路的连接部分，对焊盘部分进行表面处理，在焊盘部分的表面处理之后在布线板上形成电镀抗蚀剂层，使得电镀抗蚀剂 层具有露出柱连接部分的抗蚀剂开口，在柱连接部分上施加电镀，使得在抗蚀剂开口中形成从柱连接部分上升的导电柱，并且在形成导电柱之后从布线板去除电镀抗蚀剂层 在抗蚀剂开口中。