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    PRINTED WIRING BOARD
    3.
    发明申请
    PRINTED WIRING BOARD 有权
    印刷线路板

    公开(公告)号：US20160120033A1

    公开(公告)日：2016-04-28

    申请号：US14920974

    申请日：2015-10-23

    Applicant: IBIDEN CO., LTD.

    Inventor： Takeshi FURUSAWA ,  Kota NODA

    IPC: H05K1/11 ,  H05K1/02 ,  H05K1/09

    CPC classification number: H05K3/4697 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K1/18 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/107

    Abstract: A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conductor penetrating through the substrate and connecting the first and second conductor layers, a build-up layer formed on the second surface of the substrate and including conductor layers, insulating layers and via conductors, and a first insulating layer formed on the first surface the substrate and covering the first conductor layer. The substrate has a cavity penetrating through the first insulating layer and substrate and exposing the build-up layer on the substrate, the via conductors include a lowermost via conductor having a bottom portion exposed at bottom of the cavity, and the bottom portion of the lowermost via conductor is recessed relative to surface of a lowermost insulating layer in the build-up layer at the bottom of the cavity.

    Abstract translation: 印刷电路板包括基板，形成在基板的第一表面上的第一导体层，形成在基板的第二表面上的第二导体层，穿透基板并连接第一和第二导体层的通孔导体， 形成在基板的第二表面上并且包括导体层，绝缘层和通路导体的积层，以及形成在基板的第一表面上并覆盖第一导体层的第一绝缘层。 衬底具有穿透第一绝缘层和衬底的空腔并暴露衬底上的积聚层，通孔导体包括具有暴露在空腔底部的底部的最下通孔导体和最下面的底部 通孔导体相对于空腔底部的积聚层中的最下层绝缘层的表面凹陷。

    MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT
    4.
    发明申请
    MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT 有权
    多层印刷电路板，用于安装半导体元件

    公开(公告)号：US20140262447A1

    公开(公告)日：2014-09-18

    申请号：US14210802

    申请日：2014-03-14

    Applicant: IBIDEN CO., LTD.

    Inventor： Naoki KATSUDA ,  Naoto ISHIDA ,  Kota NODA ,  Nobuhisa KURODA

    IPC: H05K1/02

    CPC classification number: H05K1/185 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/094

    Abstract: A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second laminated structure on second surface of the substrate and including a conductive circuit layer on the second surface of the substrate, a resin insulating layer and the outermost conductive circuit layer. The outermost conductive layer in the first structure has solder pads positioned to mount a semiconductor element and solder bumps formed on the pads, respectively, the outermost conductive layer in the second structure has solder pads positioned to mount a wiring board, and the outermost conductive layers in the first and second structures have thicknesses formed greater than thicknesses of the conductive layers on the surfaces of the substrate.

    Abstract translation: 用于安装半导体元件的多层印刷线路板包括芯基板，在基板的第一表面上的第一层叠结构，并且在基板的第一表面上包括导电电路层，树脂绝缘层和最外导体电路层， 以及在所述基板的第二表面上的第二层叠结构，并且在所述基板的第二表面上包括导电电路层，树脂绝缘层和最外面的导电电路层。 第一结构中的最外面的导电层具有分别安装半导体元件和形成在焊盘上的焊锡凸块的焊盘，第二结构中的最外面的导电层具有定位成安装布线板的焊盘，并且最外面的导电层 在第一和第二结构中，厚度大于衬底表面上的导电层的厚度。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    印刷线路板及其制造方法

    公开(公告)号：US20160043027A1

    公开(公告)日：2016-02-11

    申请号：US14820963

    申请日：2015-08-07

    Applicant: IBIDEN CO., LTD.

    Inventor： Yasushi INAGAKI ,  Kota NODA

    IPC: H01L23/498 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/4015 ,  H05K2201/0376 ,  H05K2201/09827 ,  H01L2924/00

    Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into first surface of the insulating layer and including multiple wirings such that the wirings include connecting portions positioned to connect an electronic component, respectively, a second conductor layer projecting from second surface of the insulating layer on the opposite side, a solder resist layer formed on the first surface of the insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings, and multiple metal posts formed on the connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions. The wirings are formed such that the connecting portions are positioned side by side on every other adjacent one of the wirings.

    Abstract translation: 印刷布线板包括绝缘层，第一导体层，其嵌入在绝缘层的第一表面中并且包括多个布线，使得布线包括分别定位成连接电子部件的连接部分，第二导体层从第二表面的第二表面突出 在相对侧的绝缘层，形成在绝缘层的第一表面上的阻焊层，使得阻焊层覆盖第一导体层并具有露出布线的连接部分的开口结构，以及多个金属柱 分别形成在连接部分上，使得每个金属柱的宽度大于具有连接部分的各个布线的宽度。 布线形成为使得连接部分并排布置在每隔一个相邻的布线之间。

    METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE POST
    7.
    发明申请
    METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE POST 审中-公开
    制造导线板的方法

    公开(公告)号：US20150271929A1

    公开(公告)日：2015-09-24

    申请号：US14663559

    申请日：2015-03-20

    Applicant: IBIDEN CO., LTD.

    Inventor： Kota NODA ,  Takema ADACHI ,  Wataru NAKAMURA

    IPC: H05K3/42 ,  C25D5/02 ,  C25D5/34 ,  C25D7/12 ,  C25D5/48

    CPC classification number: C25D5/022 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/38 ,  C25D5/10 ,  C25D5/12 ,  C25D7/00 ,  C25D7/123 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4007 ,  H05K3/4644

    Abstract: A method for manufacturing a wiring board having conductive posts includes preparing a wiring board including electronic circuit and a solder resist layer covering the electronic circuit and having first openings and second openings surrounding the first openings such that the first openings are exposing pad portions of the electronic circuit and that the second openings are exposing post connecting portions of the electronic circuit surrounding the pad portions, applying surface treatment to the pad portions, forming a plating resist layer on the wiring board after the surface treatment of the pad portions such that the plating resist layer has resist openings exposing the post connecting portions, applying electrolytic plating on the post connecting portions such that conductive posts rising from the post connecting portions are formed in the resist openings, and removing the plating resist layer from the wiring board after forming the conductive posts in the resist openings.

    Abstract translation: 一种制造具有导电柱的布线板的方法，包括制备包括电子电路的布线板和覆盖电子电路的阻焊层，并且具有围绕第一开口的第一开口和第二开口，使得第一开口暴露电子部件的焊盘部分 并且第二开口暴露围绕焊盘部分的电子电路的连接部分，对焊盘部分进行表面处理，在焊盘部分的表面处理之后在布线板上形成电镀抗蚀剂层，使得电镀抗蚀剂 层具有露出柱连接部分的抗蚀剂开口，在柱连接部分上施加电镀，使得在抗蚀剂开口中形成从柱连接部分上升的导电柱，并且在形成导电柱之后从布线板去除电镀抗蚀剂层 在抗蚀剂开口中。

    PRINTED WIRING BOARD
    8.
    发明申请
    PRINTED WIRING BOARD 审中-公开
    印刷线路板

    公开(公告)号：US20160113110A1

    公开(公告)日：2016-04-21

    申请号：US14918784

    申请日：2015-10-21

    Applicant: IBIDEN CO., LTD.

    Inventor： Takeshi FURUSAWA ,  Kota NODA

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K3/4697 ,  H05K1/0271 ,  H05K1/115 ,  H05K2201/068 ,  H05K2201/096 ,  H05K2201/09827

    Abstract: A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conductor penetrating through the substrate and connecting the first and second conductor layers, a build-up layer formed on the second surface of the substrate and including conductor layers and insulating layers, and a first insulating layer formed on the first surface of the substrate such that the first insulating layer is covering the first conductor layer on the substrate. The substrate has a cavity penetrating through the first insulating layer and substrate such that the cavity is exposing the build-up layer on the second surface of the substrate, and the substrate and insulating layers in the build-up layer are formed such that difference between thermal expansion coefficients of the substrate and insulating layers is set 15 ppm or less.

    Abstract translation: 印刷电路板包括基板，形成在基板的第一表面上的第一导体层，形成在基板的第二表面上的第二导体层，穿透基板并连接第一和第二导体层的通孔导体， 形成在基板的第二表面上并包括导体层和绝缘层的积层，以及形成在基板的第一表面上的第一绝缘层，使得第一绝缘层覆盖基板上的第一导体层。 衬底具有穿透第一绝缘层和衬底的空腔，使得空腔暴露衬底的第二表面上的堆积层，并且形成积层中的衬底和绝缘层，使得 基板和绝缘层的热膨胀系数设定为15ppm以下。

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