Method for fabricating insulated-gate field effect transistors having controlled operating characeristics
    1.
    发明授权
    Method for fabricating insulated-gate field effect transistors having controlled operating characeristics 失效
    用于制造具有控制操作特性的绝缘栅场效应晶体管的方法

    公开(公告)号:US3590477A

    公开(公告)日:1971-07-06

    申请号:US3590477D

    申请日:1968-12-19

    Applicant: IBM

    CPC classification number: H01L27/088 H01L29/00 Y10S438/91

    Abstract: A method for fabricating electrical circuit components, field effect transistors, for example, in which the operating characteristics of the field effect devices are tailored by eliminating or passivating surface traps along the conduction channel. A layer of an active metal aluminum, for example, is deposited on the surface of an insulator, the latter being disposed in overlying relationship with the surface of a field effect transistor which has spaced source and drain regions. The active metal is disposed between the source and drain region. The transistor is subjected to heating for a time and temperature sufficient to passivate or eliminate surface traps. By heating for a temperature in a specified range, varying degrees of passivation can be attained. Heating in the absence of metallization does not alter the operating characteristics of the insulated gate field effect transistor.

    Field effect device
    2.
    发明授权
    Field effect device 失效
    场效应装置

    公开(公告)号:US3577047A

    公开(公告)日:1971-05-04

    申请号:US3577047D

    申请日:1969-01-15

    Applicant: IBM

    Inventor: CHEROFF GEORGE

    CPC classification number: H01L31/1136 H01L29/00

    Abstract: A field-effect device is provided which comprises a field effect transistor of the insulated gate type. The device is capable of being used as a photodetector with a gain greater than unity. To this end, the transistor is biased in the ''''off'''' state by a substrate potential (source-to-substrate) resulting from the provision of an external voltage supply in the source-tosubstrate loop. Upon the radiation of the source and drain junctions in the transistor, a current is caused to flow between the source and drain electrodes which result in a current gain in excess of unity.

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