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    Abrading apparatus
    2.
    发明授权
    Abrading apparatus 失效
    装饰设备

    公开(公告)号：US3702042A

    公开(公告)日：1972-11-07

    申请号：US3702042D

    申请日：1970-11-25

    Applicant: IBM

    Inventor： COCHRAN THOMAS J ,  COUGHLIN CHARLES P ,  FICKER WALTER W ,  LENT CHARLES V ,  SULLIVAN JOSEPH M

    IPC: H01C17/245 ,  B24C3/04

    CPC classification number: H01C17/245

    Abstract: This patent discloses apparatus for altering the electrical characteristics of electrical and electronic components by trimming or abrading, the rate of abrading being variable and is responsive to changes in the electrical characteristics of the components during the abrading operation. Electrical components that have electrical characteristics that may be altered by the abrading apparatus include resistors, capacitors, inductors, semiconductive devices, and photocells. The apparatus includes electrical circuitry for both accurate control of the rate of abrasion and enabling production of electrical and electronic components to predetermined characteristics with unusually close manufacturing tolerances. The circuitry includes a highly sensitive Kelvin bridge at each abrading station, the circuitry being programmable for trim pretesting, control of the rate of abrading, and post-testing. The circuitry may also be programmed to abrade a discrete component to predetermined tolerances, and/or abrade one of a pair of components to a predetermined ratio of the electrical characteristic of one component to the electrical characteristic of the other of the pair. Additionally, the circuitry may be programmed to abrade one component in a connected closed loop of components to predetermined tolerances, for example ''''in circuit'''' abrading. The mechanical arrangement of the apparatus provides for sequentially abrading multiple electrical and electronic components which may be positioned on both the upper and lower surfaces of single insulating members such as ceramic substrates. The apparatus is fully mechanized for rapid processing of a high production product through sequential abrading stations and includes stations for rejecting out-of-tolerance components.

    Abstract translation: 该专利公开了通过修整或研磨来改变电气和电子部件的电气特性的装置，其研磨速率是可变的并且响应于在研磨操作期间部件的电特性的变化。 具有可由研磨装置改变的电特性的电气部件包括电阻器，电容器，电感器，半导体器件和光电池。

    X-y rotational positioning system
    3.
    发明授权
    X-y rotational positioning system 失效
    X-Y旋转定位系统

    公开(公告)号：US3691864A

    公开(公告)日：1972-09-19

    申请号：US3691864D

    申请日：1970-11-19

    Applicant: IBM

    Inventor： COCHRAN THOMAS J ,  HAZEL HERBERT K ,  RANCE WILLIAM G JR

    IPC: B23Q1/48 ,  H05K13/00 ,  G05G15/06

    CPC classification number: H05K13/0015 ,  B23Q1/48 ,  Y10T29/53061 ,  Y10T29/53265 ,  Y10T74/20348

    Abstract: An improved system is provided for positioning a circuit board with respect to wire handling and bonding apparatus. The board is movable in an X-Y plane, can be raised or lowered along a Z dimension axis, and can be rotated about the Z dimension axis. Separate X, Y, Z, and rotational dimension electric motors are mounted on a stationary base. A differential mechanism couples an X positioning mechanism to respond to the difference between the X dimension motor position and the rotational dimension motor position. The differential mechanism prevents changes in the rotational position of the X positioning mechanism from affecting the X dimension position. A similar differential mechanism couples the Y positioning mechanism to the Y drive motor and to the rotational dimension drive motor.

    Abstract translation: 提供了一种改进的系统，用于相对于线处理和接合装置定位电路板。 该板可以在X-Y平面上移动，可以沿着Z尺寸轴升高或降低，并可绕Z轴旋转。 分离的X，Y，Z和旋转尺寸的电动机安装在固定的基座上。 差速机构连接X定位机构以响应X尺寸电动机位置和旋转尺寸电动机位置之间的差异。 差速机构防止X定位机构的旋转位置的变化影响X尺寸位置。 类似的差速机构将Y定位机构连接到Y驱动电机和旋转尺寸驱动电机。

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