Abstract:
A method for manufacturing a PNP type planar transistor, diffusing an acceptor impurity in a non-oxidizing atmosphere to form a P type emitter region in one portion of an N type base region with a first silicon oxide film as a selective mask, depositing a second silicon oxide film from vapor phase on the surface of said emitter region, diffusing selectively a donor impurity in another portion of said base region with said first and second silicon oxide films as selective masks thereby to form an N type highly doped region in said base region.
Abstract:
With a view to carrying out successive treatments on the semiconductor component, the insulating layer of the said component is removed during a preliminary litho-engraving operation on the parts to be opened up later. The procedure can be applied to great advantage to plane structure high-frequency components in which the active base is prolonged by a peripheral part having an increased concentration of impurities, on which electrical connection is easier.
Abstract:
AN IMPROVED METHOD FOR FABRICATING A TRANSISTOR BASED ON THE "WASHED EMITTER METHOD," WHEREIN AN ORIGINAL SILICON DIOXIDE FILM, USED AT A MASK FOR BASE DIFFUSION, IS REMOVED FROM THE SURFACE OF THE SILICON TRANSISTOR BODY AFTER A BASE REGION IS FORMED BY DIFFUSION AND A NEW INSULATION FILM WHICH OPERATIVELY ACTS TO STABILIZE THE SURFACE PROPERTY OF THE TRANSISTOR BODY IS SUBSTITUTED THEREFOR. EMITTER DIFFUSION IS THEN PROVIDED TO THE SURFACE OF THE BASE REGION BY UTILIZING THE NEW INSULATOR FILM AS A MASK FOR THE EMITTER DIFFUSION, AND THEREAFTER THE SURFACE OF THE BODY IS WASHED TO REMOVE THE OXIDE LAYER FORMED ON THE EMITTER REGION DURING THE EMITTER DIFFUSION. AN APERTURE FOR A BASE CONTACT IS THEN FORMED BY PHOTOETCHING A PART OF THE NEW INSULATOR FILM. A COMPLETED TRANSISTOR IS OBTAINED BY PROVIDING METAL CONTRACTS THROUGH THE RESPECTIVE APERTURES TO THE RESPECTIVE EMITTER AND BASE REGIONS.
Abstract:
IN A SEMICONDUCTOR DEVICE, THE EMITTER AND BASE METAL CONTACT STRIPES ARE AT DIFFERENT LEVELS AND ARE SEPARATED BY SILICON DIOXIDE AND SILICON NITRIDE. BY USING SUCH A SILICON DIOXIDE SEPARATORY LAYER IN COMBINATION WITH AN INITIAL SILICON NITRIDE COATING OVER THE EMITTER AND BASE REGIONS IN THE SEMICONDUCTOR SUBSTRATE, THE SILICON NITRIDE COATING BEING ETCHED DURING PROCESSING, A HIGH SPEED TRANSISTOR HAVING A VERY SMALL EMITTER-BASE CONTACT SPACING, AND A SMALL EMITTER STRIPE WIDTH IS OBTAINED.