公开(公告)号：US20220415731A1

公开(公告)日：2022-12-29

申请号：US17820659

申请日：2022-08-18

Applicant: Illumina, Inc.

Inventor： Arvin Emadi ,  Arnaud Rival ,  Ali Agah ,  Tara Bozorg-Grayeli

IPC: H01L23/053 ,  H01L23/31 ,  H01L23/00 ,  H01L23/48 ,  B81B1/00 ,  H01L23/15

Abstract: Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.

公开(公告)号：US20220231068A1

公开(公告)日：2022-07-21

申请号：US17574358

申请日：2022-01-12

Applicant: Illumina, Inc.

Inventor： Ludovic Vincent ,  Tara Bozorg-Grayeli ,  Arvin Emadi ,  Vanessa Montaño Machado

IPC: H01L27/146 ,  H01L23/00 ,  G01N33/543 ,  G01N27/414

Abstract: Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The method may include forming bumps on a surface of one or more electrical contacts, where the one or more electrical contacts are accessible on an upper surface of a die, where the die is oriented on a substrate, and where the electrical contacts comprise bonding pads. The method may also include coupling one or more additional electrical contacts to the one or more electrical contacts, where the coupling comprises wire-bonding each additional electrical contact of the additional electrical contacts to one of the one or more electrical contacts accessible on the upper surface of the die, via a portion of the bumps on the surface of the one or more electrical contacts, thereby forming wire-bonded connections.

公开(公告)号：US20250096050A1

公开(公告)日：2025-03-20

申请号：US18971047

申请日：2024-12-06

Applicant: Illumina, Inc.

Inventor： Arvin Emadi ,  Arnaud Rival ,  Ali Agah ,  Tara Bozorg-Grayeli

IPC: H01L23/053 ,  B81B1/00 ,  G01N21/64 ,  H01L23/00 ,  H01L23/15 ,  H01L23/31 ,  H01L23/48

Abstract: Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.

公开(公告)号：US20240288765A1

公开(公告)日：2024-08-29

申请号：US18444438

申请日：2024-02-16

Applicant: ILLUMINA, INC.

Inventor： Ravi Billa ,  Tara Bozorg-Grayeli ,  Arvin Emadi ,  Cassandra Renee Greene Chamoun ,  Vanessa Montano-Machado ,  Roger Park

IPC: G03F7/00 ,  C23C14/18 ,  C23C14/24 ,  C23C14/58 ,  G03F7/30

CPC classification number: G03F7/0035 ,  C23C14/185 ,  C23C14/24 ,  C23C14/5873 ,  G03F7/0002 ,  G03F7/30

Abstract: In an example of a method for making a flow cell, a sacrificial layer is deposited over a substrate including depressions separated by interstitial regions. The sacrificial layer is dry etched from the depressions, and the sacrificial layer remains on the interstitial regions. A functionalized layer is deposited over the depressions and over the sacrificial layer. The sacrificial layer is removed from the interstitial regions, which also removes the functionalized layer that overlies the interstitial regions.

公开(公告)号：US12165939B2

公开(公告)日：2024-12-10

申请号：US18463354

申请日：2023-09-08

Applicant: Illumina, Inc.

Inventor： Arvin Emadi ,  Arnaud Rival ,  Ali Agah ,  Tara Bozorg-Grayeli

IPC: H01L23/00 ,  B81B1/00 ,  H01L23/053 ,  H01L23/15 ,  H01L23/31 ,  H01L23/48 ,  G01N21/64

Abstract: Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.

公开(公告)号：US20230420312A1

公开(公告)日：2023-12-28

申请号：US18463354

申请日：2023-09-08

Applicant: Illumina, Inc.

Inventor： Arvin Emadi ,  Arnaud Rival ,  Ali Agah ,  Tara Bozorg-Grayeli

IPC: H01L23/053 ,  H01L23/31 ,  H01L23/00 ,  H01L23/48 ,  B81B1/00 ,  H01L23/15

CPC classification number: H01L23/053 ,  H01L23/3185 ,  H01L24/48 ,  H01L23/481 ,  H01L24/73 ,  H01L24/16 ,  B81B1/002 ,  H01L23/15 ,  G01N2021/6439

Abstract: Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.

公开(公告)号：US11798854B2

公开(公告)日：2023-10-24

申请号：US17820659

申请日：2022-08-18

Applicant: Illumina, Inc.

Inventor： Arvin Emadi ,  Arnaud Rival ,  Ali Agah ,  Tara Bozorg-Grayeli

IPC: H01L23/31 ,  H01L23/053 ,  H01L23/00 ,  H01L23/48 ,  B81B1/00 ,  H01L23/15 ,  G01N21/64

CPC classification number: H01L23/053 ,  B81B1/002 ,  H01L23/15 ,  H01L23/3185 ,  H01L23/481 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  G01N21/6428 ,  G01N2021/6439 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/48227 ,  H01L2224/73215

Abstract: Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.

公开(公告)号：US11476171B2

公开(公告)日：2022-10-18

申请号：US17179783

申请日：2021-02-19

Applicant: Illumina, Inc.

Inventor： Arvin Emadi ,  Arnaud Rival ,  Ali Agah ,  Tara Bozorg-Grayeli

IPC: H01L23/00 ,  H01L23/053 ,  H01L23/31 ,  H01L23/48 ,  B81B1/00 ,  H01L23/15 ,  G01N21/64

Abstract: Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.

公开(公告)号：US20210272863A1

公开(公告)日：2021-09-02

申请号：US17179783

申请日：2021-02-19

Applicant: Illumina, Inc.

Inventor： Arvin Emadi ,  Arnaud Rival ,  Ali Agah ,  Tara Bozorg-Grayeli

IPC: H01L23/053 ,  H01L23/31 ,  H01L23/00 ,  H01L23/48 ,  H01L23/15 ,  B81B1/00

Abstract: Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.