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公开(公告)号:US20240018686A1
公开(公告)日:2024-01-18
申请号:US18351402
申请日:2023-07-12
Applicant: IMEC VZW , Katholieke Universiteit Leuven
Inventor: Yuanyuan Shi , Pierre Morin , Benjamin Groven , Vladislav Voronenkov
Abstract: In one aspect, a template for growing a crystal of a two-dimensional material can include a flat surface for growing the crystal thereon, a first wall on the flat surface, and a second wall on the flat surface. The first and the second walls can meet at a corner to form an angle having an opening that is adapted to align with the crystal structure of the crystal with a tolerance of up to 5°. Each of the first and second walls can have a length of from 5 nm to 1000 nm and a height of from 0.6 nm to 2 nm.
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公开(公告)号:US11854803B2
公开(公告)日:2023-12-26
申请号:US17371936
申请日:2021-07-09
Applicant: IMEC VZW
Inventor: Boon Teik Chan , Pierre Morin , Antony Premkumar Peter
IPC: H01L21/02 , H01L21/321 , H01L21/8234 , H01L29/66
CPC classification number: H01L21/02636 , H01L21/0228 , H01L21/02274 , H01L21/02282 , H01L21/3212 , H01L21/823431 , H01L29/6681
Abstract: A method for protecting a gate spacer when forming a FinFET structure, the method comprising: providing a fin with at least one dummy gate crossing the fin wherein a gate hardmask is present on top of the dummy gate; providing a gate spacer such that it is covering the dummy gate and the gate hardmask; recessing the gate spacer such that at least a part of the gate hardmask is exposed; selectively growing, by means of area selective deposition, extra capping material over the exposed part of the gate hardmask.
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公开(公告)号:US20220084822A1
公开(公告)日:2022-03-17
申请号:US17371936
申请日:2021-07-09
Applicant: IMEC VZW
Inventor: Boon Teik Chan , Pierre Morin , Antony Premkumar Peter
IPC: H01L21/02 , H01L29/66 , H01L21/8234 , H01L21/321
Abstract: A method for protecting a gate spacer when forming a FinFET structure, the method comprising: providing a fin with at least one dummy gate crossing the fin wherein a gate hardmask is present on top of the dummy gate; providing a gate spacer such that it is covering the dummy gate and the gate hardmask; recessing the gate spacer such that at least a part of the gate hardmask is exposed; selectively growing, by means of area selective deposition, extra capping material over the exposed part of the gate hardmask.
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