公开(公告)号：US20150188016A1

公开(公告)日：2015-07-02

申请号：US14287205

申请日：2014-05-27

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Chuan Wang ,  Cheng-Chou Wong ,  Chia-Ying Yen ,  Hsin-Hwa Chen

IPC: H01L33/64

CPC classification number: H01L33/641 ,  C23C28/00 ,  C23C28/30 ,  C23C28/32 ,  C23C28/321 ,  C23C28/322 ,  C23C28/324 ,  C23C28/34 ,  C23C30/00 ,  C23C30/005 ,  H01L23/00 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/185 ,  H05K3/188 ,  H05K2203/0709 ,  H05K2203/072 ,  H05K2203/0723 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/2495 ,  Y10T428/24959 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  H01L2924/00

Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.

Abstract translation: 导电散热基板包括陶瓷基板和种子层，以及依次形成在其上的缓冲材料层和铜电路层。 缓冲材料层具有陶瓷基板与铜电路层的热膨胀系数。 此外，缓冲材料层由合金材料和陶瓷材料组成或由金属材料和陶瓷材料组成。

公开(公告)号：US09397279B2

公开(公告)日：2016-07-19

申请号：US14287205

申请日：2014-05-27

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Chuan Wang ,  Cheng-Chou Wong ,  Chia-Ying Yen ,  Hsin-Hwa Chen

IPC: H01L33/64 ,  B32B15/04 ,  B32B18/00 ,  C23C28/00 ,  C23C30/00 ,  H01L23/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/18 ,  H01L33/62

CPC classification number: H01L33/641 ,  C23C28/00 ,  C23C28/30 ,  C23C28/32 ,  C23C28/321 ,  C23C28/322 ,  C23C28/324 ,  C23C28/34 ,  C23C30/00 ,  C23C30/005 ,  H01L23/00 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/185 ,  H05K3/188 ,  H05K2203/0709 ,  H05K2203/072 ,  H05K2203/0723 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/2495 ,  Y10T428/24959 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  H01L2924/00

Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.

Abstract translation: 导电散热基板包括陶瓷基板和种子层，以及依次形成在其上的缓冲材料层和铜电路层。 缓冲材料层具有陶瓷基板与铜电路层的热膨胀系数。 此外，缓冲材料层由合金材料和陶瓷材料组成或由金属材料和陶瓷材料组成。

公开(公告)号：US20140158178A1

公开(公告)日：2014-06-12

申请号：US13832068

申请日：2013-03-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Cheng-Chou Wong ,  Jenn-Dong Hwang ,  Cheng-Ting Hsu ,  Hsu-Shen Chu

IPC: H01L35/30

CPC classification number: H01L35/30

Abstract: A thermoelectric generator (TEG) including a cooling element, a heat-collection element and at least one thermoelectric generating module is provided. The heat-collection element is disposed at a side of the cooling element, wherein the heat-collection element has a first surface and a second surface opposite to the first surface, and the heat-collection element is suitable for facing a thermal radiation source with the first surface so as to receive thermal energy thereof in a predetermined distance without contacting the thermal radiation source. The thermoelectric generating module is disposed between the second surface of the heat-collection element and the cooling element, wherein the emissivity of the heat-collection element is larger than 0.8. A thermoelectric generating system is also provided.

Abstract translation: 提供了包括冷却元件，热收集元件和至少一个热电发电模块的热电发电机（TEG）。 集热元件设置在冷却元件的一侧，其中，所述集热元件具有与所述第一表面相对的第一表面和第二表面，并且所述热收集元件适于面对具有 第一表面以便在不接触热辐射源的情况下以预定距离接收其热能。 热电发电模块设置在集热元件的第二表面和冷却元件之间，其中，热收集元件的发射率大于0.8。 还提供了一种热电发生系统。