OPTIMIZED MANAGEMENT OF THE POWER SUPPLY OF A MICROCONTROLLER

    公开(公告)号:US20190265775A1

    公开(公告)日:2019-08-29

    申请号:US16308237

    申请日:2017-06-09

    申请人: INGENICO GROUP

    IPC分类号: G06F1/3234 G06F1/3206

    摘要: A printed circuit including a microcontroller having at least one main element, termed a core, and at least one peripheral unit. The printed circuit has a selective power supply management for managing the power supply of the microcontroller. The selective management receives a command to shutdown the microcontroller coming from an internal shutdown function of the microcontroller, and reversibly cuts the power supply to the at least one peripheral unit while maintaining the power supply to the core.

    Optimized management of the power supply of a microcontroller

    公开(公告)号:US10955902B2

    公开(公告)日:2021-03-23

    申请号:US16308237

    申请日:2017-06-09

    申请人: INGENICO GROUP

    摘要: A printed circuit including a microcontroller having at least one main element, termed a core, and at least one peripheral unit. The printed circuit has a selective power supply management for managing the power supply of the microcontroller. The selective management receives a command to shutdown the microcontroller coming from an internal shutdown function of the microcontroller, and reversibly cuts the power supply to the at least one peripheral unit while maintaining the power supply to the core.

    Flexible printed circuit board and corresponding secured connection method

    公开(公告)号:US10561024B2

    公开(公告)日:2020-02-11

    申请号:US15691149

    申请日:2017-08-30

    申请人: INGENICO GROUP

    摘要: A flexible printed circuit board is proposed. The flexible printed circuit board includes at least one soldering element possessing a soldering face, accessible from a first face of the flexible printed circuit board, and a heating face, accessible from a second face of the flexible printed circuit board. Such a flexible printed circuit board includes a main part including the soldering element, and at least one foldable part, extending from the main part and being configured to pass: from a non-folded state, in which the at least one foldable part does not cover the heating face of the at least one soldering element; to a folded state in which the at least one foldable part covers the heating face of the at least one soldering element.