公开(公告)号：US20160268213A1

公开(公告)日：2016-09-15

申请号：US14642316

申请日：2015-03-09

Applicant: INTEL CORPORATION

Inventor： Hongjin JIANG ,  Robert STARKSTON ,  Digvijay A. RAORANE ,  Keith D. JONES ,  Ashish DHALL ,  Omkar G. KARHADE ,  Kedar DHANE ,  Suriyakala RAMALINGAM ,  Li-Sheng WENG ,  Robert F. CHENEY ,  Patrick N. STOVER

IPC: H01L23/552 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/16 ,  H01L23/49805 ,  H01L23/5383 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32155 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/014

Abstract: An apparatus including a package including a die and a package substrate, the package substrate including a conductor; and a stiffener body electrically coupled to the conductor of the package substrate. An apparatus including a package including a die and a package substrate; a stiffener body coupled to the package substrate; and an electrically conductive path between the stiffener body and the package substrate. A method including electrically coupling a stiffener body to a conductor of a package substrate.

Abstract translation: 一种包括包括管芯和封装基板的封装的装置，所述封装基板包括导体; 以及电耦合到封装衬底的导体的加强体。 一种包括包括管芯和封装衬底的封装的设备; 耦合到所述封装衬底的加强体; 以及在所述加强体和所述封装基板之间的导电路径。 一种包括将加强体电连接到封装基板的导体的方法。