公开(公告)号：US09257405B2

公开(公告)日：2016-02-09

申请号：US14328599

申请日：2014-07-10

Applicant: INTEL CORPORATION

Inventor： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

IPC: H01L23/12 ,  H01L23/00 ,  B23K35/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L24/14 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于集成电路（IC）封装组件的多焊接技术和配置。 在一个实施例中，一种方法包括在封装衬底的多个焊盘上沉积多个焊球，所述多个焊球对应于所述多个焊盘并且执行焊料回流工艺以在所述多个焊料之间形成焊接点 球和多个垫。 多个焊球的单个焊球包括第一焊料材料和第二焊料材料，第一焊料材料具有大于焊料回流工艺的峰值温度的液相线温度，第二焊料材料具有液相线温度， 小于焊料回流工艺的峰值温度。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09283641B2

公开(公告)日：2016-03-15

申请号：US13626869

申请日：2012-09-25

Applicant: INTEL CORPORATION

Inventor： Rajen S. Sidhu ,  Martha A. Dudek ,  Wei Tan

IPC: B23K35/36 ,  B23K35/02 ,  H01L21/48 ,  B23K35/362 ,  H01L23/498

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/3612 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/16225

Abstract: Embodiments of the present disclosure are directed towards flux materials for heated solder placement and associated techniques and configurations. In one embodiment, a method includes depositing a flux material on one or more pads of a package substrate, the flux material including a rosin material and a thixotropic agent and depositing one or more solder balls on the flux material disposed on the one or more pads, wherein depositing the one or more solder balls on the flux material is performed at a temperature greater than 80° C., and wherein the rosin material and the thixotropic agent are configured to resist softening at the temperature greater than 80° C. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于加热的焊料放置和相关联的技术和构造的助焊剂材料。 在一个实施例中，一种方法包括在封装基板的一个或多个焊盘上沉积焊剂材料，焊剂材料包括松香材料和触变剂，并且将一个或多个焊球沉积在设置在一个或多个焊盘上的焊剂材料上 其中将所述一个或多个焊球沉积在所述焊剂材料上在大于80℃的温度下进行，并且其中所述松香材料和所述触变剂构造成在大于80℃的温度下抵抗软化。其它实施方案 可以被描述和/或要求保护。

公开(公告)号：US08809181B2

公开(公告)日：2014-08-19

申请号：US13670687

申请日：2012-11-07

Applicant: Intel Corporation

Inventor： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

IPC: H01L21/44

CPC classification number: H01L24/14 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于集成电路（IC）封装组件的多焊接技术和配置。 在一个实施例中，一种方法包括在封装衬底的多个焊盘上沉积多个焊球，所述多个焊球对应于所述多个焊盘并且执行焊料回流工艺以在所述多个焊料之间形成焊接点 球和多个垫。 多个焊球的单个焊球包括第一焊料材料和第二焊料材料，第一焊料材料具有大于焊料回流工艺的峰值温度的液相线温度，第二焊料材料具有液相线温度， 小于焊料回流工艺的峰值温度。 可以描述和/或要求保护其他实施例。