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公开(公告)号：US20240402443A1
公开(公告)日：2024-12-05
申请号：US18325512
申请日：2023-05-30
Applicant: Intel Corporation
Inventor： John M. Heck , Saeed Fathololoumi , Harel Frish , Sang Yup Kim , Hari Mahalingam , Nicholas D. Psaila
Abstract: A kinematically aligned optical connector may be implemented with a silicon PIC component and a glass substrate component. The kinematically aligned optical connector includes one or more kinematic connectors or mechanical alignment features and visual fiducials that enable true kinematic coupling (i.e., in a three-dimensional Cartesian coordinate system, full constraint in all 6 degrees of freedom, meaning, X, Y, Z planes and all 3 angles), and enables an increased thickness of the glass substrate material of the glass waveguide substrate.
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2.发明公开公开(公告)号：US20240027700A1
公开(公告)日：2024-01-25
申请号：US17871647
申请日：2022-07-22
Applicant: Intel Corporation
Inventor： Nicholas D. Psaila
IPC: G02B6/42
CPC classification number: G02B6/4214
Abstract: Technologies for beam expansion for vertically-emitting photonic integrated circuits are disclosed. In the illustrative embodiment, waveguides in a photonic integrated circuit (PIC) die guide light to vertical couplers, which direct the light from the waveguides out of the top surface of the PIC die. A glass microoptic substrate is mounted on the top surface of the PIC die, positioned over the vertical couplers. A mirror in the glass microoptic substrate reflects the light from the vertical couplers to propagate in a direction parallel to the top surface of the PIC die. Another set of mirrors in the glass microoptic substrate focus the light from each waveguide into a collimated beam directed out of the top surface of the glass microoptic substrate.
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公开(公告)号：US20240253157A1
公开(公告)日：2024-08-01
申请号：US18565408
申请日：2022-08-05
Applicant: Intel Corporation
Inventor： Richard Laming , Nicholas D. Psaila
IPC: B23K26/082 , B23K26/06 , B23K26/0622 , B23K26/70 , B23K103/00
CPC classification number: B23K26/082 , B23K26/0622 , B23K26/0648 , B23K26/705 , B23K2103/52 , B23K2103/54
Abstract: The present application relates to a method for modifying a substrate, which comprises generating a pulsed laser beam comprising a train of laser pulses, the train of laser pulses including at least three consecutive laser pulses, and controlling a direction of the pulsed laser beam and/or a position of the substrate from laser pulse to laser pulse so that the at least three consecutive laser pulses sequentially irradiate at least three regions of the substrate according to a predetermined spatial sequence which defines the relative spatial positions of the at least three regions of the substrate and the order of irradiation of the at least three regions of the substrate. The present application relates also to an apparatus (100) for modifying a substrate (108). The method and apparatus (100) may be used, in particular though not exclusively, for forming an optical device.
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公开(公告)号：US20240027699A1
公开(公告)日：2024-01-25
申请号：US17869372
申请日：2022-07-20
Applicant: Intel Corporation
Inventor： Nicholas D. Psaila , Pooya Tadayon
IPC: G02B6/42
CPC classification number: G02B6/4214 , G02B6/4278 , G02B6/4244 , G02B6/4245 , G02B27/30
Abstract: Technologies for beam expansion in glass substrates are disclosed. In the illustrative embodiment, light in a waveguide defined in a glass substrate is allowed to expand towards a curved mirror defined in the glass substrate. The light is collimated to a beam as it is reflected off the mirror. In the illustrative embodiment, the light is reflected upwards toward the top surface of the glass substrate. A photonic integrated circuit (PIC) die may be mounted on the glass substrate. A micromirror lens fixed to the PIC die can focus the collimated beam into a waveguide defined in the PIC die. In some embodiments, an interface for an optical connector may be formed in the glass substrate, allowing the optical connector to be removably plugged into the glass substrate.
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公开(公告)号：US20240329320A1
公开(公告)日：2024-10-03
申请号：US18565319
申请日：2022-12-02
Applicant: Intel Corporation
Inventor： Nicholas D. Psaila , Richard Laming
CPC classification number: G02B6/305 , G02B6/32 , G02B6/3853 , G02B6/3885
Abstract: An optical interconnect component for use in transmitting light between a photonic integrated circuit and one or more optical fibres attached to an optical fibre connector ferrule is disclosed. The optical interconnect component comprises a step formed at an edge of the optical interconnect component, the step including a ledge and a facet, one or more optical beam management elements formed in a surface of the optical interconnect component, and a plurality of integrated optical waveguides. Each of two or more of the integrated optical waveguides extends from the facet so as to define a plurality of optical ports at the facet, and each of the one or more optical beam management elements is aligned with, but separated from, an end of a corresponding one of the plurality of integrated optical waveguides. Also disclosed are an optical fibre connector ferrule, an optical interconnect assembly comprising the optical interconnect component and the optical fibre connector ferrule, and an optical system comprising the optical interconnect assembly, a photonic integrated circuit, and one or more optical fibres.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20240201445A1
公开(公告)日：2024-06-20
申请号：US18553448
申请日：2022-06-28
Applicant: INTEL CORPORATION
Inventor： Richard Laming , Nicholas D. Psaila
CPC classification number: G02B6/3636 , G02B6/3676 , G02B6/368 , G02B6/3688 , G02B6/3837 , G02B6/423
Abstract: An apparatus for positioning one or more optical fibers relative to the apparatus, comprises a body comprising a monolithic block of material, one or more fiber alignment structures formed in the material of the monolithic block, each fiber alignment structure comprising a groove configured to accommodate a corresponding optical fiber, and one or more apparatus alignment features formed in the material of the monolithic block, wherein the one or more apparatus alignment features are additional to the one or more fiber alignment structures and wherein the one or more apparatus alignment features have a known spatial relationship relative to the one or more fiber alignment structures. The one or more apparatus alignment features may enable passive alignment of the apparatus relative to a member which is separate from the apparatus such as an optical component and/or a photonic chip. When one or more optical fibers are located and/or secured in one or more corresponding fiber alignment structures of the apparatus, the one or more apparatus alignment features may also enable passive alignment of the one or more optical fibers relative to the member.
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公开(公告)号：US20240184064A1
公开(公告)日：2024-06-06
申请号：US18553361
申请日：2022-06-28
Applicant: Intel Corporation
Inventor： Richard Laming , Nicholas D. Psaila
IPC: G02B6/42
CPC classification number: G02B6/4226
Abstract: An apparatus for positioning one or more optical fibers relative to the apparatus, comprises a body comprising material, and one or more fiber alignment structures defined in the material of the body, wherein each fiber alignment structure is configured to accommodate a corresponding optical fiber, and wherein each fiber alignment structure is configured to induce one or more bends along the corresponding optical fiber. When an optical fiber is located in such a fiber alignment structure, the optical fiber may be forced into contact with the fiber alignment structure in one or more known regions so that the corresponding optical fiber is located at a more predictable position relative to the corresponding fiber alignment structure in the one or more known regions than is the case for known fiber alignment structures. The location of the corresponding optical fiber at a more predictable position may improve the optical coupling efficiency achievable between the optical fiber and an optical component and/or a photonic chip.
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公开(公告)号：US20240272368A1
公开(公告)日：2024-08-15
申请号：US18565376
申请日：2022-12-02
Applicant: Intel Corporation
Inventor： Richard Laming , Nicholas D. Psaila
Abstract: An optical interconnect arrangement for use in transmitting light between a photonic integrated circuit and a plurality of optical fibres, comprises a plurality of primary optical beam management elements, a plurality of secondary optical beam management elements, and a plurality of optical fibre alignment structures. Each optical fibre alignment structure is configured to receive a corresponding optical fibre so that the end of the corresponding optical fibre is aligned with, but separated from, a corresponding one of the secondary optical beam management elements, and the optical interconnect arrangement defines a plurality of optical paths, each optical path extending from a surface of the optical interconnect arrangement to the end of a corresponding one of the optical fibre alignment structures via a corresponding one of the primary optical beam management elements and a corresponding one of the secondary optical beam management elements. An optical system is also disclosed which comprises the optical interconnect arrangement, a photonic integrated circuit, and a plurality of optical fibres.
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公开(公告)号：US20250102745A1
公开(公告)日：2025-03-27
申请号：US18475907
申请日：2023-09-27
Applicant: Intel Corporation
Inventor： Mohanraj Prabhugoud , David Shia , Hari Mahalingam , John M. Heck , John Robert Macdonald , Duncan Peter Dore , Eric J. M. Moret , Nicholas D. Psaila , Sang Yup Kim , Shane Kevin Yerkes , Harel Frish
IPC: G02B6/42
Abstract: In one embodiment, a device includes a fiber array unit (FAU) coupled to a photonics integrated circuit (PIC) die. The PIC die includes a cavity defined at an edge of the PIC die, with outer edges of the cavity being formed at an angle less than 90 degrees with respect to a bottom surface of the cavity. The PIC die further includes first waveguides protruding into the cavity of the PIC die. The FAU includes a shelf portion extending from a body portion, and a plurality of second waveguides protruding from an outer edge of the shelf portion opposite the body portion. The FAU further includes alignment structures on outer edges of the shelf portion that are in contact with the angled edges of the cavity of the PIC die.
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公开(公告)号：US20250004215A1
公开(公告)日：2025-01-02
申请号：US18342422
申请日：2023-06-27
Applicant: Intel Corporation
Inventor： Nicholas D. Psaila
Abstract: Technologies for hybrid optical chip-to-chip coupling are disclosed. In an illustrative embodiment, light from a waveguide in a photonic integrated circuit (PIC) die is collimated using a micromirror and directed towards a glass substrate. Another micromirror in the glass substrate focuses the light into a waveguide defined in a bulk layer of the glass substrate. In the illustrative embodiment, the waveguide is directly written into the bulk layer using an ultrafast laser. The glass substrate also has waveguides with a large difference in the index of refraction in a layer above the bulk substrate, such as silicon nitride waveguides in silicon oxide cladding. The directly-written waveguides can be evanescently coupled to the silicon nitride waveguides. The silicon nitride waveguides can then be used for two-dimensional routing throughout the glass substrate. The light can be coupled back into a directly-written waveguide before it is transmitted to another PIC die.
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