公开(公告)号：US09508610B2

公开(公告)日：2016-11-29

申请号：US14499120

申请日：2014-09-27

申请人： INTEL CORPORATION

发明人： Shuhong Liu ,  Nilanjan Z. Ghosh ,  Zhiyong Wang ,  Deepak Goyal ,  Shripad Gokhale ,  Jieping Zhang

IPC分类号： H01L21/66 ,  G01B11/06 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L22/12 ,  G01B11/06 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2224/81

摘要： A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector.

摘要翻译： 一种包括在成型材料层从光源发射太赫兹光束的方法; 检测光束的反射率; 并确定成型材料层的厚度。 一种包括面板支撑件的系统，其可操作以支撑包括布置在平面阵列中的多个基板的面板; 光源，其可操作以在所述面板支撑件上的面板处发射太赫兹光束; 检测器，用于检测在面板上发射的太赫兹波束的反射; 以及处理器，其可操作以基于由检测器检测的发射的太赫兹光束的时间延迟来确定面板上的材料的厚度。

公开(公告)号：US09389064B2

公开(公告)日：2016-07-12

申请号：US14229446

申请日：2014-03-28

申请人： Intel Corporation

发明人： Shuhong Liu ,  Zhiyong Wang ,  Nilanjan Ghosh ,  Deepak Goyal

IPC分类号： G01B11/02 ,  G01B9/02 ,  G01B11/06 ,  G01N21/956 ,  G02B21/00

CPC分类号： G01N21/9501 ,  G01B9/0203 ,  G01B9/0209 ,  G01B11/0675 ,  G01B2210/56 ,  G01N21/956 ,  G02B21/0016

摘要： Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing formed on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.

摘要翻译： 实施例包括使用具有倾斜物镜的白光干涉仪（WLI）显微镜的装置，系统和方法，以执行两种抗蚀剂基础缺陷和导电迹线底切缺陷的在线监测。 可以在干膜抗蚀剂（DFR）底脚与形成在包装基材的绝缘层顶表面上的导电迹线基底之间的界面处检测到缺陷。 这种基础和底切缺陷可能被认为是“隐藏的缺陷”。 使用具有倾斜物镜的WLI显微镜为非破坏性，非接触式在线监测提供了高吞吐量和低成本的计量和工具。

公开(公告)号：US20160245758A1

公开(公告)日：2016-08-25

申请号：US15146812

申请日：2016-05-04

申请人： Intel Corporation

发明人： Shuhong Liu ,  Zhiyong Wang ,  Nilanjan Z. Ghosh ,  Deepak Goyal

IPC分类号： G01N21/95

CPC分类号： G01N21/9501 ,  G01B9/0203 ,  G01B9/0209 ,  G01B11/0675 ,  G01B2210/56 ,  G01N21/956 ,  G02B21/0016

摘要： Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.

摘要翻译： 实施例包括使用具有倾斜物镜的白光干涉仪（WLI）显微镜的装置，系统和方法，以执行两种抗蚀剂基础缺陷和导电迹线底切缺陷的在线监测。 可以在干膜抗蚀剂（DFR）基底与在封装衬底的绝缘层顶表面上发现的导电迹线基底之间的界面处检测到缺陷。 这种基础和底切缺陷可能被认为是“隐藏的缺陷”。 使用具有倾斜物镜的WLI显微镜为非破坏性，非接触式在线监测提供了高吞吐量和低成本的计量和工具。

公开(公告)号：US09746428B2

公开(公告)日：2017-08-29

申请号：US15146812

申请日：2016-05-04

申请人： Intel Corporation

发明人： Shuhong Liu ,  Zhiyong Wang ,  Nilanjan Z. Ghosh ,  Deepak Goyal

IPC分类号： G01B11/02 ,  G01N21/95 ,  G01B9/02 ,  G01B11/06 ,  G01N21/956 ,  G02B21/00

CPC分类号： G01N21/9501 ,  G01B9/0203 ,  G01B9/0209 ,  G01B11/0675 ,  G01B2210/56 ,  G01N21/956 ,  G02B21/0016

摘要： Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.