公开(公告)号：US11592472B2

公开(公告)日：2023-02-28

申请号：US16417408

申请日：2019-05-20

Applicant: INTEL CORPORATION

Inventor： Joe F. Walczyk ,  James Hastings ,  Morten Jensen ,  Todd Coons

IPC: G01R31/28

Abstract: An apparatus for testing integrated circuits (ICs) , includes a first thermal contact structure having a first surface to interface with a heat source and an opposing second surface to interface with a device under test (DUT). A second thermal contact structure is above the first thermal contact structure and separated therefrom by a variable-resistance thermal interface (VRTI) structure operable to couple or decouple the first and second thermal contact structures from one another. The VRTI structure has a maximal thermal conductivity associated with a first state, and a minimal thermal conductivity associated with a second state.

公开(公告)号：US11464139B2

公开(公告)日：2022-10-04

申请号：US16180499

申请日：2018-11-05

Applicant: Intel Corporation

Inventor： Kelly Lofgreen ,  Joseph Petrini ,  Todd Coons ,  Christopher Wade Ackerman ,  Edvin Cetegen ,  Yang Jiao ,  Michael Rutigliano ,  Kuang Liu

IPC: H05K7/20

Abstract: A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

公开(公告)号：US20200371155A1

公开(公告)日：2020-11-26

申请号：US16417408

申请日：2019-05-20

Applicant: INTEL CORPORATION

Inventor： Joe F. Walczyk ,  James Hastings ,  Morten Jensen ,  Todd Coons

IPC: G01R31/28

Abstract: An apparatus for testing integrated circuits (ICs), comprising a first thermal contact structure having a first surface to interface with a heat source, the first surface is opposite a second surface. A second thermal contact structure is above the first thermal contact structure and separated therefrom. The second thermal contact structure has a third surface to interface with a cold mass. The third surface is opposite a fourth surface, and the fourth surface is opposite the second surface. A variable-resistance thermal interface (VRTI) structure is between the first and second thermal contact structures. The VRTI structure has a maximal thermal conductivity associated with a first state, and a minimal thermal conductivity associated with a second state.