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    THERMOELECTRIC-ENHANCED, LIQUID-BASED COOLING OF A MULTI-COMPONENT ELECTRONIC SYSTEM
    1.
    发明申请
    THERMOELECTRIC-ENHANCED, LIQUID-BASED COOLING OF A MULTI-COMPONENT ELECTRONIC SYSTEM 有权
    多组分电子系统的热电增强液体冷却

    公开(公告)号：US20150138715A1

    公开(公告)日：2015-05-21

    申请号：US14564250

    申请日：2014-12-09

    申请人： International Business Machines Corporation

    发明人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： H05K7/20 ,  F25B21/04

    CPC分类号： H05K7/20763 ,  F25B21/02 ,  F25B21/04 ,  F25D17/06 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836

    摘要： Methods are provided for facilitating cooling of an electronic component. The methods include providing: a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

    摘要翻译： 提供了便于冷却电子部件的方法。 所述方法包括提供：液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路和室外空气 冷却热交换单元，其耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。 热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。 在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。

    NETWORK SWITCH MOUNTING SYSTEM
    3.
    发明申请
    NETWORK SWITCH MOUNTING SYSTEM 有权

    公开(公告)号：US20210092859A1

    公开(公告)日：2021-03-25

    申请号：US16578946

    申请日：2019-09-23

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Eric James MCKEEVER ,  Edward J. SEMINARO ,  David P. GRAYBILL ,  Benjamin LYNDGAARD ,  Wayne A. BARRINGER

    IPC分类号： H05K7/14

    摘要： An assembly includes: a server rack; first side and second side outer rails attached to the rack and positionally fixed relative to the rack; a support device attached to the rack adjacent to a rear of the rack; a computer network switch having a port side positioned adjacent to the rear of the rack; and first side and second side inner rails attached to the network switch and positionally fixed relative to the network switch, the inner rails being slidably attached to the outer rails. The network switch is movable between a retracted position and an extended position, and the support device is located such that the support device physically blocks the network switch from being removed from the rear of the server rack.

    MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER
    4.
    发明申请
    MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER 有权
    多机架，门安装热交换器

    公开(公告)号：US20140043760A1

    公开(公告)日：2014-02-13

    申请号：US14055347

    申请日：2013-10-16

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Eric A. ECKBERG ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Howard V. MAHANEY, JR. ,  Roger R. SCHMIDT ,  Kenneth R. SCHNEEBELI

    IPC分类号： H05K7/20 ,  B23P15/26

    CPC分类号： B23P15/26 ,  H05K7/20718 ,  H05K7/2079 ,  H05K7/20818 ,  Y10T29/4935

    摘要： An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

    摘要翻译： 提供了一种空气冷却装置，其包括用于保持两个或更多个彼此相邻的固定关系的独立电子机架的固定机构，以及尺寸设计成跨越机架的空气入口侧或空气出口侧的多齿条门。 固定机构使电子机架与其空气入口侧面对第一方向固定，并且空气出口侧面向第二方向。 门包括具有气流开口的门框。 气流开口有助于通过电子机架进入或流出气流，并且门还包括由门框架支撑的空气对液体热交换器，并且设置成使流过气流开口的空气穿过热交换器。 在操作中，热交换器从通过分离的电子机架的空气中提取热量。

    APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S)
    5.
    发明申请
    APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) 有权
    通过液体冷却电子架（S）调节冷却剂流动阻力的装置和方法

    公开(公告)号：US20130186612A1

    公开(公告)日：2013-07-25

    申请号：US13795010

    申请日：2013-03-12

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Wayne A. BARRINGER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  James J. STEFFES ,  Gerard V. WEBER, JR.

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20709 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20736 ,  H05K7/20763 ,  H05K7/2079

    摘要： A method is presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.

    摘要翻译： 提出了一种通过一个或多个液冷电子机架来调节冷却剂流动阻力的方法。 流量限制器与热交换组件的多个热交换管部分相关联地使用，或者与供给多个热交换组件的多个冷却剂供应管线或冷却剂返回管路相关联地使用。 与相应的热交换管部分（或相应的热交换组件）相关联的流量限制器设置在管部分（或热交换组件）的冷却剂通道入口或冷却剂通道出口处。 这些流量限制器通过热交换管部分或通过热交换组件来调节冷却剂流动阻力，以通过调整冷却剂流量来增强管部分内部或通过热交换组件的整体热传递。 在一个实施例中，流量限制器定制跨越多个热交换管部分或跨多个热交换组件的冷却剂流量分配差。

    DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE
    6.
    发明申请
    DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE 有权
    直接连接热交换器管段和冷却冷却结构

    公开(公告)号：US20130174421A1

    公开(公告)日：2013-07-11

    申请号：US13711854

    申请日：2012-12-12

    申请人： International Business Machines Corporation

    发明人： Timothy J. CHAINER ,  Patrick A. COICO ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： B23P15/26

    CPC分类号： B23P15/26 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/4935 ,  Y10T29/49826

    摘要： A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

    摘要翻译： 提供了一种用于制造用于冷却电子机架的冷却装置的方法，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。 热交换器与电子机架相关联并且设置成冷却通过齿条的空气，包括多个冷却剂承载管部分，每个管段具有冷却剂入口和出口，其中一个与冷却剂流体连通 循环以便于冷却剂流过管段。 冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。 该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

    FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER
    9.
    发明申请
    FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER 审中-公开
    制冷冷却电子系统与液体冷却冷板和热膨胀机

    公开(公告)号：US20150116941A1

    公开(公告)日：2015-04-30

    申请号：US14562867

    申请日：2014-12-08

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20336 ,  F28D15/02 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20936

    摘要： Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

    摘要翻译： 提供了便于冷却电子部件的方法。 该方法包括提供与冷板相关联的液冷冷板和散热器。 冷板包括在冷板内延伸的多个冷却剂承载通道部分，以及具有比待冷却部件的表面积更大的表面积的导热表面。 散热器包括一个或多个包括多个热管段的热管。 一个或多个热管部分与冷板的第一区域部分对准，即，与要冷却的表面对准，并且部分地对准于位于第一区域外部的冷板的第二区域。 一个或多个热管促进热量从电子部件分配到位于冷板的第二区域中的冷板的冷却剂承载通道部分。

    COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT
    10.
    发明申请
    COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT 有权
    冷却电子系统与液体冷却冷却板和热传递器耦合到电子元件

    公开(公告)号：US20140078674A1

    公开(公告)日：2014-03-20

    申请号：US14086114

    申请日：2013-11-21

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Timothy J. CHAINER ,  David P. GRAYBILL ,  Madhusudan K. IYENGAR ,  Vinod KAMATH ,  Bejoy J. KOCHUPARAMBIL ,  Roger R. SCHMIDT ,  Mark E. STEINKE

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20336 ,  F28D15/02 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20936

    摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

    摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括液冷冷板和与冷板相关联的散热器。 冷板包括在冷板内延伸的多个冷却剂承载通道部分，以及具有比待冷却部件的表面积更大的表面积的导热表面。 散热器包括一个或多个包括多个热管段的热管。 一个或多个热管部分与冷板的第一区域部分对准，即，与要冷却的表面对准，并且部分地对准于位于第一区域外部的冷板的第二区域。 一个或多个热管促进热量从电子部件分配到位于冷板的第二区域中的冷板的冷却剂承载通道部分。