MULTI-COOLANT HEAT EXCHANGER FOR AN ELECTRONICS RACK

    公开(公告)号:US20210120704A1

    公开(公告)日:2021-04-22

    申请号:US16654298

    申请日:2019-10-16

    Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.

    THERMOELECTRIC-ENHANCED, INLET AIR-COOLED THERMAL CONDUCTORS
    4.
    发明申请
    THERMOELECTRIC-ENHANCED, INLET AIR-COOLED THERMAL CONDUCTORS 有权
    热电增强型入口空气冷却导热体

    公开(公告)号:US20170049010A1

    公开(公告)日:2017-02-16

    申请号:US14922324

    申请日:2015-10-26

    Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

    Abstract translation: 提供用于冷却电子外壳的散热部件的冷却装置的方法包括:提供热导体以耦合到散热部件,所述热导体包括耦合到所述散热部件的第一导体部分 散热部件和第二导体部分,以沿着电子外壳的空气入口侧定位,使得在操作中,第一导体部分将热量从部件传递到第二导体部分; 将至少一个风冷散热器耦合到所述第二导体部分以便于将热量传递到进入所述外壳的气流; 提供耦合到所述第一或第二导体部分的至少一个热电装置,以便于向所述热导体提供主动辅助冷却; 以及提供控制器以控制热电装置的操作并且选择性地切换冷却装置在主动和被动冷却模式之间的操作。

    THERMOELECTRIC-ENHANCED, INLET AIR COOLING FOR AN ELECTRONICS RACK
    5.
    发明申请
    THERMOELECTRIC-ENHANCED, INLET AIR COOLING FOR AN ELECTRONICS RACK 有权
    热电增强型,用于电子机架的入口空气冷却

    公开(公告)号:US20170013739A1

    公开(公告)日:2017-01-12

    申请号:US14870297

    申请日:2015-09-30

    CPC classification number: H05K7/20781 H05K7/20736 H05K7/20836

    Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

    Abstract translation: 通过冷却装置提供进入电子机架的气流的热电增强机架冷却,其包括:空气对液体热交换器; 冷却剂回路,其耦合到所述热交换器,所述冷却剂回路包括第一回路部分和第二回路部分,其中所述热交换器将加热的冷却剂排出到所述第一回路部分并且从所述第二回路部分接收冷却的冷却剂。 冷却装置还包括排热单元和热电热泵。 散热单元联接到第一和第二回路部分之间的冷却剂回路,并且向第二回路部分提供部分冷却的冷却剂。 热电热泵设置有第一和第二回路部分,其联接到相对侧,以在来自第二回路部分内的部分冷却的冷却剂中传递热量,以在进入空气至液体热交换器之前提供冷却的冷却剂。

    PROTECTIVE COVER ASSEMBLY FOR AIR-MOVING ASSEMBLY
    6.
    发明申请
    PROTECTIVE COVER ASSEMBLY FOR AIR-MOVING ASSEMBLY 审中-公开
    用于空气动力组件的保护罩组件

    公开(公告)号:US20160169237A1

    公开(公告)日:2016-06-16

    申请号:US14565740

    申请日:2014-12-10

    CPC classification number: H05K7/20581 F04D29/703 H05K7/20172 H05K7/20727

    Abstract: Apparatuses and methods are provided for protectively covering an air inlet or outlet of an air-moving assembly. The apparatus includes a protective cover assembly, which includes a retractable cover and a spring-biasing mechanism. The retractable cover transitions between a retracted state, when the air-moving assembly is operatively positioned within the chassis, and in extended state, when the air-moving assembly is withdrawn from the chassis. In retracted state, the retractable cover is retracted away from the air inlet or outlet, and in extended state, the retractable cover covers, at least partially, the air inlet or outlet. The spring-biasing mechanism is coupled to the retractable cover and biases the retractable cover in the extended state when the air-moving assembly is withdrawn from the chassis, and compresses to allow transition of the retractable cover to the retracted state as the air-moving assembly is inserted into operative position within the chassis.

    Abstract translation: 提供了用于保护性地覆盖空气移动组件的空气入口或出口的装置和方法。 该装置包括保护盖组件,其包括可缩回盖和弹簧偏置机构。 当空气移动组件可操作地定位在底盘内时,缩回盖在缩回状态之间以及处于延伸状态时,当空气移动组件从底盘中取出时,缩回盖转变。 在缩回状态下,可缩回的盖子从空气入口或出口缩回,并且在伸展状态下,可缩回的盖子至少部分地覆盖空气入口或出口。 当空气移动组件从底盘中取出时,弹簧偏压机构联接到可缩回的盖子并且在可伸缩的盖子处偏压可伸缩的盖子,并且压缩以允许可伸缩的盖子转动到缩回状态,作为空气移动 组件插入到机箱内的操作位置。

    PROTECTIVE COVER ASSEMBLY FOR AIR-MOVING ASSEMBLY

    公开(公告)号:US20190150320A1

    公开(公告)日:2019-05-16

    申请号:US16246661

    申请日:2019-01-14

    Abstract: Apparatuses and methods are provided for protectively covering an air inlet or outlet of an air-moving assembly. The apparatus includes a protective cover assembly, which includes a retractable cover and a spring-biasing mechanism. The retractable cover transitions between a retracted state, when the air-moving assembly is operatively positioned within the chassis, and in extended state, when the air-moving assembly is withdrawn from the chassis. In retracted state, the retractable cover is retracted away from the air inlet or outlet, and in extended state, the retractable cover covers, at least partially, the air inlet or outlet. The spring-biasing mechanism is coupled to the retractable cover and biases the retractable cover in the extended state when the air-moving assembly is withdrawn from the chassis, and compresses to allow transition of the retractable cover to the retracted state as the air-moving assembly is inserted into operative position within the chassis.

    THERMOELECTRIC-ENHANCED, INLET AIR COOLING FOR AN ELECTRONICS RACK

    公开(公告)号:US20170013746A1

    公开(公告)日:2017-01-12

    申请号:US14791681

    申请日:2015-07-06

    CPC classification number: H05K7/20781 H05K7/20736 H05K7/20836

    Abstract: Thermoelectric-enhanced, rack-level cooling of airflow entering an electronics rack is provided by a cooling apparatus, which includes: an air-to-liquid heat exchanger; a coolant loop coupled to the heat exchanger, the coolant loop including a first loop portion and a second loop portion, where the heat exchanger exhausts heated coolant to the first loop portion and receives cooled coolant from the second loop portion. The cooling apparatus further includes a heat rejection unit and a thermoelectric heat pump(s). The heat rejection unit is coupled to the coolant loop between the first and second loop portions, and provides partially-cooled coolant to the second loop portion. The thermoelectric heat pump is disposed with the first and second loop portions coupled to opposite sides to transfer heat from the partially-cooled coolant within the second loop portion to provide the cooled coolant before entering the air-to-liquid heat exchanger.

    FUEL VAPORIZATION USING DATA CENTER WASTE HEAT
    10.
    发明申请
    FUEL VAPORIZATION USING DATA CENTER WASTE HEAT 有权
    使用数据中心废物燃烧的燃料蒸发

    公开(公告)号:US20160143190A1

    公开(公告)日:2016-05-19

    申请号:US14829869

    申请日:2015-08-19

    Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

    Abstract translation: 通过使用数据中心废热汽化燃料,为数据中心冷却提供了系统和方法。 该系统包括例如发电组件,液体燃料储存器和传热系统。 发电组件从燃料蒸汽发电,供给数据中心。 液体燃料储存器连接以供应燃料蒸汽,并且传热系统与数据中心和液体燃料储存器相关联。 在操作模式中,传热系统将数据中心的余热转移到液体燃料储存器,以便于液化燃料的蒸发以产生供给发电组件的燃料蒸气。 该系统可以以液体燃料储存和传热系统为主要燃料蒸气源或备用燃料蒸气源来实施。

Patent Agency Ranking