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公开(公告)号：US20180328236A1
公开(公告)日：2018-11-15
申请号：US16043263
申请日：2018-07-24
CPC分类号： F01K25/08 , F01K5/00 , F25B15/00 , F25B19/00 , F25B27/02 , F25B49/00 , H02P9/04 , H05K7/20709 , H05K7/20818 , H05K7/20836
摘要： Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
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公开(公告)号：US20170045300A1
公开(公告)日：2017-02-16
申请号：US14824492
申请日：2015-08-12
发明人： Dylan J. BODAY , Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS , Prabjit SINGH , Jason T. WERTZ
CPC分类号： B23P15/26 , B23P2700/10 , F28F3/02 , F28F3/12 , H01L23/473 , H01L23/4735 , H05K7/20254 , H05K7/20772
摘要： Liquid-cooled heat sink assemblies are provided which include: a heat transfer element including a heat transfer base with opposite first and second sides and a plurality of thermally conductive fins extending from the first side, and with the second side of the heat transfer base to couple to a component(s) to be cooled. The heat sink assembly further includes a coolant-carrying structure attached to the heat transfer element. The coolant-carrying structure includes a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows. The coolant-carrying base includes a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins to extend therethrough. The plurality of thermally conductive fins extend into the coolant-carrying compartment through which the liquid coolant flows. In one or more embodiments, the heat transfer element is a metal structure and the coolant-carrying structure is a plastic structure.
摘要翻译： 提供了液冷式散热器组件，其包括：传热元件，其包括具有相对的第一和第二侧的传热基部和从第一侧延伸的多个导热翅片，以及传热基座的第二侧至 耦合到要冷却的部件。 散热器组件还包括附接到传热元件的冷却剂承载结构。 冷却剂承载结构包括冷却剂承载基座和液体冷却剂流过的冷却剂输送室。 冷却剂承载基座包括多个翅片接收开口，其大小和定位用于多个导热翅片延伸穿过其中。 多个导热翅片延伸到液体冷却剂流过的冷却剂供给室中。 在一个或多个实施例中，传热元件是金属结构，并且冷却剂承载结构是塑料结构。
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公开(公告)号：US20160143184A1
公开(公告)日：2016-05-19
申请号：US14828775
申请日：2015-08-18
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20218 , H01L23/34 , H01L23/3672 , H01L23/4006 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/20281 , H05K7/20327 , H05K7/2039 , H05K7/20436 , H05K7/20509 , H05K7/20772 , H01L2924/00
摘要： Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure.
摘要翻译： 提供了液冷式散热器组件，其包括：具有侧壁表面和主传热表面的导热基底结构; 以及附接到基部结构的歧管结构，其中基部结构至少部分地位于歧管结构中的凹部内。 基座和歧管结构一起限定了一个冷却剂供给室，液体冷却剂至少部分地沿基本上平行于基础结构的主传热表面的方向流动，并且至少一个侧壁表面 歧管结构的导热基底结构或其相对的表面包括连续的凹槽。 密封构件至少部分地设置在连续槽内，并且在导热基底结构和歧管结构之间提供流体密封的密封。
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公开(公告)号：US20150109730A1
公开(公告)日：2015-04-23
申请号：US14058546
申请日：2013-10-21
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
CPC分类号： H05K7/203 , F25B23/006 , F28B3/04 , F28D15/0266 , H05K7/20809 , Y10T29/4935
摘要： Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber.
摘要翻译： 提供了冷却装置和方法，便于将热量从工作流体传递到冷却剂。 冷却装置包括蒸气冷凝器，其包括具有容纳工作流体和冷却剂的冷凝室的冷凝器壳体，其在冷凝室内直接接触并且是不混溶的流体。 冷凝室包括工作流体蒸汽层和工作流体液体层; 并且工作流体蒸气入口促进流体蒸汽流入冷凝室，并且工作流体蒸气出口便于从冷凝室排出工作流体液体。 冷却剂入口结构有助于将冷却剂进入冷凝室的工作流体蒸汽层，与工作流体蒸汽直接接触，以便于将蒸汽冷凝成工作流体液体，并且冷却剂出口结构便于后续从冷凝室排出冷却剂 。
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公开(公告)号：US20140133096A1
公开(公告)日：2014-05-15
申请号：US13674207
申请日：2012-11-12
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
CPC分类号： F28F9/00 , H05K7/20781
摘要： A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.
摘要翻译： 提供了一种用于电子机架的冷却装置，其包括在机架的入口或空气出口侧处联接到电子机架的门组件。 门组件包括：气流开口，其构造成便于通过安装到机架的门组件通过电子机架进入或流出气流; 空气冷却剂热交换器，其布置成使得通过气流开口的气流穿过空气 - 冷却剂热交换器，空气 - 冷却剂热交换器被配置为从通过其的气流中提取热量; 以及蒸汽冷凝器，其被配置为便于从电子机架的至少一个浸没冷却的电子部件部分排出的介电流体蒸气的冷凝。 包括门组件的冷却装置有助于电子机架的不同电子部件的空气冷却和浸没冷却。
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公开(公告)号：US20140126149A1
公开(公告)日：2014-05-08
申请号：US13671887
申请日：2012-11-08
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , G05D23/1934 , G06F1/206 , H05K7/20836
摘要： Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.
摘要翻译： 方法和冷却剂分配系统被提供用于自动冷却剂流控制，例如，促进多个不同电子系统的冷却。 这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂 电路i基于传输到冷却剂的确定的热负荷。 不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。
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7.发明申请公开(公告)号：US20140123493A1
公开(公告)日：2014-05-08
申请号：US13788919
申请日：2013-03-07
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： B23P15/26
CPC分类号： B23P15/26 , F28D15/02 , F28F3/048 , F28F3/12 , F28F2250/06 , H05K7/20809 , Y10T29/4935
摘要： Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.
摘要翻译： 提供冷却方法以便于电子部件的抽吸浸没冷却。 冷却方法包括：提供围绕一个或多个部件形成隔室的壳体，以及提供供应歧管，回流歧管以及联接冷却剂回路联接器以使供应和返回歧管与壳体流体连通。 流过冷却剂回路的冷却剂流过壳体的隔室，并且至少部分地通过流动沸腾来冷却部件。 泵有利于循环内的冷却剂循环，并且冷却剂旁通管线连接在供应和返回歧管之间。 回流歧管包括混合相歧管部分，并且旁路管线将冷却剂从供应歧管直接提供给混合相歧管部分。 冷却剂从冷却剂旁通管路流向与该歧管部分内任何冷却剂蒸气流的方向相反的方向流入混合相歧管部分。
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8.发明申请公开(公告)号：US20140096386A1
公开(公告)日：2014-04-10
申请号：US14105691
申请日：2013-12-13
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： B23P15/26
CPC分类号： B23P15/26 , F28D15/0266 , F28F3/00 , F28F3/12 , F28F13/00 , G06F1/20 , H05K7/20254 , H05K7/20272 , H05K7/2029 , H05K7/20772 , Y10T29/4935
摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
摘要翻译： 提供散热器，冷却电子结构和利用散热器的冷却电子设备。 散热器由导热结构制成，该导热结构包括一个或多个冷却剂承载通道，其联接以便于冷却剂流过冷却剂输送通道。 散热器还包括与冷却剂输送通道相关联的膜。 该膜包括至少一个透气区域，其覆盖着一部分冷却剂输送通道，并且有助于从冷却剂输送通道中除去蒸气，以及至少一个孔口，其连接以将冷却剂注入到 在一个或多个通道的相对端之间的冷却剂承载通道的至少一个表面。
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公开(公告)号：US20140068942A1
公开(公告)日：2014-03-13
申请号：US13788722
申请日：2013-03-07
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： B23P15/26
CPC分类号： H05K7/20309 , B23P15/26 , F28D9/0025 , F28D15/02 , F28F3/046 , F28F3/12 , F28F9/02 , H05K7/203 , H05K7/20809 , Y10T29/4935 , Y10T29/49359 , Y10T29/49396
摘要： A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
摘要翻译： 提供一种制造蒸汽冷凝器的方法，其包括三维折叠结构，该三维折叠结构至少部分限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 平行于蒸气冷凝通道延伸。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道
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公开(公告)号：US20140047702A1
公开(公告)日：2014-02-20
申请号：US14063162
申请日：2013-10-25
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS , Prabjit SINGH
IPC分类号： H01L23/367
CPC分类号： H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
摘要翻译： 散热器和制造方法被提供用于从电子部件去除热量。 散热器包括散热器底座和框架。 基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。 框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。 散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。 热界面材料设置在基底表面和电子部件之间。
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