Abstract:
A stacked connector component includes a housing, connectors at a front opening of the housing and arranged in a stacked formation within one or more columns, and a for and exposed at the connectors. The pins include high-speed pins routed within the housing to a bottom side thereof and low-speed pins routed within the housing to a back side or a top side thereof. A circuit board includes pin pads connectable to the pins and disposed on a substrate. The pin pads include high-speed signal pin pads for the high-speed signal pins. The substrate includes contiguous high-speed areas in which the high-speed signal pin pads for the high-speed pins are located, between which no pin pads are located.
Abstract:
A logical design component permits an electronic device design to be modified from a logical perspective on a schematic of the device showing device components in logical form, and displays a logical window of the schematic. A physical design component permits the design to be modified from a circuit board perspective on a circuit board representation of the device the showing the components in physical form, and displays a physical window of the circuit board representation. A real-time component permits the design to be modified from a simplified circuit board perspective on a simplified view of the circuit board representation, and displays a simplified window of the simplified view. Changes made to the design within the logical and/or physical window are automatically displayed within the simplified window in real-time; changes made to the design within the simplified window are automatically displayed within the logical and/or physical window in real-time.
Abstract:
A logical design component permits an electronic device design to be modified from a logical perspective on a schematic of the device showing device components in logical form, and displays a logical window of the schematic. A physical design component permits the design to be modified from a circuit board perspective on a circuit board representation of the device the showing the components in physical form, and displays a physical window of the circuit board representation. A real-time component permits the design to be modified from a simplified circuit board perspective on a simplified view of the circuit board representation, and displays a simplified window of the simplified view. Changes made to the design within the logical and/or physical window are automatically displayed within the simplified window in real-time; changes made to the design within the simplified window are automatically displayed within the logical and/or physical window in real-time.
Abstract:
A current detector senses current flowing through a conductor, such as a conductive trace of a circuit board, without being placed in series with the conductor. A first magnetically conductive partial ring is located above the conductor, and a second magnetically conductive partial ring is located below the conductor. Ends of one of the partial rings may be inserted through holes of the circuit board to either side of the conductive trace. The partial rings, upon being contactively aligned with one another, form a magnetically conductive complete ring around the conductor. A Hall effect sensor disposed within one of the partial rings outputs a signal corresponding to the current flowing through the conductor.
Abstract:
A stacked connector component includes a housing, connectors at a front opening of the housing and arranged in a stacked formation within one or more columns, and a for and exposed at the connectors. The pins include high-speed pins routed within the housing to a bottom side thereof and low-speed pins routed within the housing to a back side or a top side thereof. A circuit board includes pin pads connectable to the pins and disposed on a substrate. The pin pads include high-speed signal pin pads for the high-speed signal pins. The substrate includes contiguous high-speed areas in which the high-speed signal pin pads for the high-speed pins are located, between which no pin pads are located.
Abstract:
A stacked connector component includes a housing, connectors at a front opening of the housing and arranged in a stacked formation within one or more columns, and a for and exposed at the connectors. The pins include high-speed pins routed within the housing to a bottom side thereof and low-speed pins routed within the housing to a back side or a top side thereof. A circuit board includes pin pads connectable to the pins and disposed on a substrate. The pin pads include high-speed signal pin pads for the high-speed signal pins. The substrate includes contiguous high-speed areas in which the high-speed signal pin pads for the high-speed pins are located, between which no pin pads are located.