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公开(公告)号：US11569181B2
公开(公告)日：2023-01-31
申请号：US17113032
申请日：2020-12-05
IPC分类号： H01L23/00 , H01L21/02 , H01L23/26 , H01L21/768
摘要： Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.
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公开(公告)号：US11031343B2
公开(公告)日：2021-06-08
申请号：US16448182
申请日：2019-06-21
IPC分类号： H01L23/538 , H01L25/065
摘要： Semiconductor structures are provided in which a first chip on a substrate has at least one first protruding section, the first protruding section including first interconnect locations, a second chip on the substrate having at least one second protruding section, the second protruding section including second interconnect locations and the first chip and the second chip are arranged such that the first protruding section is interdigitated with the second protruding section.
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公开(公告)号：US10892233B2
公开(公告)日：2021-01-12
申请号：US16177100
申请日：2018-10-31
IPC分类号： H01L23/00 , H01L21/02 , H01L23/26 , H01L21/768
摘要： Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.
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公开(公告)号：US20220308564A1
公开(公告)日：2022-09-29
申请号：US17209574
申请日：2021-03-23
发明人： Kirk D. Peterson , Steven Paul Ostrander , Stephanie E Allard , Charles L. Reynolds , Sungjun Chun , Daniel M. Dreps , Brian W. Quinlan , Sylvain Pharand , Jon Alfred Casey , David Edward Turnbull , Pascale Gagnon , Jean Labonte , Jean-Francois Bachand , Denis Blanchard
IPC分类号： G05B19/418
摘要： Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.
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