公开(公告)号：US20190267332A1

公开(公告)日：2019-08-29

申请号：US15904556

申请日：2018-02-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kamal K. SIKKA ,  Krishna R. TUNGA ,  Hilton T. TOY ,  Thomas WEISS ,  Shidong LI ,  Sushumna IRUVANTI

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/027

Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

公开(公告)号：US20180368757A1

公开(公告)日：2018-12-27

申请号：US15801720

申请日：2017-11-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Mahmoud AMIN ,  Zhenxing BI ,  Lawrence A. CLEVENGER ,  Leigh Anne H. CLEVENGER ,  Krishna R. TUNGA

IPC: A61B5/00 ,  G16H50/20 ,  G16H20/30 ,  G16H15/00

CPC classification number: A61B5/4815 ,  A61B5/00 ,  A61B5/0022 ,  A61B5/1118 ,  A61B5/1123 ,  A61B5/68 ,  A61B5/681 ,  A61B5/6898 ,  G16B20/20 ,  G16H10/60 ,  G16H15/00 ,  G16H20/30 ,  G16H40/63 ,  G16H40/67 ,  G16H50/20 ,  G16H50/30

Abstract: Embodiments of the invention are directed to a computer-implemented method for generating a sleep optimization plan. A non-limiting example of the computer-implemented method includes receiving, by a processor, genetic data for a user. The method also includes receiving, by the processor, Internet of Things (IoT) device data for the user. The method also includes generating, by the processor, a sleep duration measurement for the user based at last in part upon the IoT device data. The method also includes generating, by the processor, a sleep optimization plan for the user based at least in part upon the genetic data.

公开(公告)号：US20140027898A1

公开(公告)日：2014-01-30

申请号：US14041875

申请日：2013-09-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kamal K. SIKKA ,  Hilton T. TOY ,  Krishna R. TUNGA ,  Jeffrey A. ZITZ

IPC: H01L23/04 ,  H01L21/50

CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/10 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2924/01322 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/166 ,  H01L2924/00

Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant.

Abstract translation: 提供了一种多芯片电子封装及其制造方法。 该方法包括相对于芯片载体上的一个或多个芯片来调节一个或多个活塞的活塞位置。 调整包括将芯片垫片放置在芯片上，并将密封垫片放置在盖子和芯片载体之间。 密封垫片比芯片垫片厚。 该调节还包括降低盖直到活塞接触芯片垫片。 该方法还包括分离盖和芯片载体并移除芯片垫片和密封垫片。 该方法还包括将热界面材料分配在芯片上并降低盖子，直到填充有热界面材料的间隙大约为热界面材料的粒度。 该方法还包括用密封剂将盖子密封到芯片载体上。