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公开(公告)号：US20240298423A1
公开(公告)日：2024-09-05
申请号：US18662585
申请日：2024-05-13
IPC分类号： H05K7/20 , B33Y80/00 , F28F3/12 , H01L23/473
CPC分类号： H05K7/20254 , F28F3/12 , H01L23/473 , B33Y80/00
摘要： A cold plate apparatus includes walls that surround an active volume adjacent to an inlet plenum; the walls include an inlet opening at one end of a top side of the inlet plenum and a plenum opening between the inlet plenum and the active volume. Also included is a blocker that partially separates the inlet plenum from the active volume. The blocker is structurally configured to preferentially redirect flow from the inlet plenum into the active volume.
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公开(公告)号：US20220418134A1
公开(公告)日：2022-12-29
申请号：US17304855
申请日：2021-06-28
发明人： Noah Singer , Jeffrey Allen Zitz , Mark D. Schultz , John Torok , William L. Brodsky , Yuet-Ying Yu , Shawn Canfield
摘要： An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.
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公开(公告)号：US20220418129A1
公开(公告)日：2022-12-29
申请号：US17304856
申请日：2021-06-28
发明人： Noah Singer , Jeffrey Allen Zitz , Mark D. Schultz , John Torok , Yuet-Ying Yu , William L. Brodsky , Shawn Canfield
摘要： An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.
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公开(公告)号：US20220328375A1
公开(公告)日：2022-10-13
申请号：US17225075
申请日：2021-04-07
发明人： Mark D. Schultz , Fuad Elias Doany , Benjamin Giles Lee , Daniel M. Kuchta , Christian Wilhelmus Baks
IPC分类号： H01L23/367 , H01L25/16 , G02B6/42
摘要： An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.
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公开(公告)号：US11335657B2
公开(公告)日：2022-05-17
申请号：US17023297
申请日：2020-09-16
发明人： Evan Colgan , Timothy J. Chainer , Monty Montague Denneau , Kai Schleupen , Diego Anzola , Mark D. Schultz , Layne A. Berge
IPC分类号： H01L23/00 , H01L25/065 , H01L23/48 , H01L23/544
摘要： A data processing system includes a first wafer comprising a plurality of first chips, and kerf and crack-stop structures around perimeters of the first chips, and a second wafer comprising a plurality second chips, a plurality of interconnect structures through a connection zone between the second chips, and a plurality of thru silicon vias, wherein the first wafer and the second wafer are bonded face-to-face such that the interconnect structures of the second wafer electrically connect adjacent chip sites of the first wafer and where a pitch of the chips on the first and second wafer are equal.
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公开(公告)号：US11131506B2
公开(公告)日：2021-09-28
申请号：US16257584
申请日：2019-01-25
发明人： Paul W. Coteus , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： F28F3/06 , F28D1/03 , F28F3/02 , H01L23/473 , H01L21/48 , B23K1/00 , B23P15/26 , F28F3/14 , B21D53/02 , F28F3/04 , B21D53/04 , F24S10/50
摘要： An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.
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公开(公告)号：US10749817B2
公开(公告)日：2020-08-18
申请号：US16135172
申请日：2018-09-19
发明人： Paul W. Coteus , Fuad E. Doany , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H04L12/933 , H05K7/20
摘要： A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
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公开(公告)号：US10727158B2
公开(公告)日：2020-07-28
申请号：US16689445
申请日：2019-11-20
发明人： Thomas J. Brunschwiler , Timothy J. Chainer , Evan G. Colgan , Arvind Raj Mahankali Sridhar , Chin Lee Ong , Pritish R. Parida , Gerd Schlottig , Mark D. Schultz , Joel A. Silberman
IPC分类号： H01L23/473 , H01L23/427 , H01L21/48 , H01L23/00 , H01L25/065
摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
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公开(公告)号：US10440862B2
公开(公告)日：2019-10-08
申请号：US14867199
申请日：2015-09-28
摘要： A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.
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公开(公告)号：US20190020597A1
公开(公告)日：2019-01-17
申请号：US16135172
申请日：2018-09-19
发明人： Paul W. Coteus , Fuad E. Doany , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H04L12/933 , H05K7/20
摘要： A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
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