公开(公告)号：US11110534B2

公开(公告)日：2021-09-07

申请号：US16378547

申请日：2019-04-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jae-Woong Nah ,  Stephen L. Buchwalter ,  Peter A. Gruber ,  Da-Yuan Shih ,  Paul Alfred Lauro

IPC: B23K1/00 ,  B23K3/06 ,  H01L23/00 ,  B23K3/08

Abstract: In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

公开(公告)号：US20200316702A1

公开(公告)日：2020-10-08

申请号：US16378547

申请日：2019-04-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jae-Woong Nah ,  Stephen L. Buchwalter ,  Peter A. Gruber ,  Da-Yuan Shih ,  Paul Alfred Lauro

IPC: B23K3/06 ,  B23K3/08 ,  H01L23/00

Abstract: In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.

公开(公告)号：US11270966B2

公开(公告)日：2022-03-08

申请号：US16686815

申请日：2019-11-18

Applicant: International Business Machines Corporation

Inventor： Jae-Woong Nah ,  Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: H01L23/00

Abstract: Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.

公开(公告)号：US20140191775A1

公开(公告)日：2014-07-10

申请号：US14175116

申请日：2014-02-07

Applicant: International Business Machines Corporation

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Daniel Peter Morris ,  Da-Yuan Shih

IPC: G01R1/073

CPC classification number: G01R1/07307 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/06772 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract translation: 本发明涉及具有从支撑表面突出的多个离散绝缘细长电导体的结构，其可用作用于测试电子装置（例如集成电路装置和其它电子部件）的电互连的探针，特别是用于集成 具有刚性互连焊盘的电路装置和具有高密度互连焊盘的多芯片模块封装以及其使用的装置及其制造方法。 通过提供高密度同轴探针的方法制造同轴探针结构。

公开(公告)号：US20220157657A1

公开(公告)日：2022-05-19

申请号：US17097113

申请日：2020-11-13

Applicant: International Business Machines Corporation

Inventor： Cyril Cabral, JR. ,  Frank Robert Libsch ,  Chitra Subramanian ,  Peter Jerome Sorce ,  Paul Alfred Lauro ,  John M. Papalia

IPC: H01L21/78 ,  H01L21/3065 ,  H01L21/67

Abstract: Embodiments of the invention include a method of singulating IC chips from a wafer. The method can include receiving the wafer having a substrate formed under active layers. The wafer includes a chip that includes a first portion of the active layers and a first portion of the substrate. A separation trench is formed by using an etch operation to remove a first segment of the active layers and a first segment of the substrate that are beneath a first separation channel of the wafer. The separation trench separates the first portion of the active layers from a remaining portion of the active layers; and separates the first portion of the substrate from a remaining portion of the substrate. The first IC chip is seperated from the wafer by removing a first section of the remaining portion of the substrate that is underneath the first portion of the substrate.

公开(公告)号：US20210151402A1

公开(公告)日：2021-05-20

申请号：US16686815

申请日：2019-11-18

Applicant: International Business Machines Corporation

Inventor： Jae-Woong Nah ,  Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: H01L23/00

Abstract: Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.

公开(公告)号：US11541472B2

公开(公告)日：2023-01-03

申请号：US16775390

申请日：2020-01-29

Applicant: International Business Machines Corporation

Inventor： Jae-Woong Nah ,  Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: B23K3/00 ,  B23K1/06 ,  H01L23/00 ,  B23K1/00 ,  B23K3/06 ,  B23K103/00 ,  B23K101/40

Abstract: Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.

公开(公告)号：US20210229203A1

公开(公告)日：2021-07-29

申请号：US16775390

申请日：2020-01-29

Applicant: International Business Machines Corporation

Inventor： Jae-Woong Nah ,  Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: B23K1/06 ,  H01L23/00 ,  B23K1/00

Abstract: Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.