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1.发明申请FABRICATING THERMAL TRANSFER STRUCTURE(S) AND ATTACHMENT MECHANISM(S) FOR COOLING ELECTRONICS CARD(S) 有权制造电子卡的热转移结构（S）和附件机制（S）公开(公告)号：US20150047809A1
公开(公告)日：2015-02-19
申请号：US14528066
申请日：2014-10-30
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, Jr. , Eric J. McKEEVER , Richard P. SNIDER
IPC分类号： F28F9/26
CPC分类号： H05K7/20254 , F16L41/10 , F28D15/0275 , F28F9/02 , Y10T29/4935
摘要： Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The method further includes providing a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and providing a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.
摘要翻译： 提供制造冷却装置和冷却剂冷却的电子组件的方法，其包括提供热传递结构，其被配置为耦合到具有一个或多个要冷却的电子部件的电子卡的一侧或多侧。 热传递结构包括散热器和与散热器相关联的至少一个冷却剂传送通道，以便于将热量从散热器移除到流过冷却剂传送通道的冷却剂。 该方法还包括提供与电子系统的插座相邻设置的冷却剂歧管结构，其中电子卡片可操作地对接，并且提供流体和机械附接机构，其有助于热传递结构和冷却剂的选择性，流体和机械耦合或解耦 歧管结构，该附接机构有助于冷却剂流在冷却剂歧管结构和热传递结构的冷却剂传送通道之间。
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公开(公告)号：US20160095263A1
公开(公告)日：2016-03-31
申请号：US14831105
申请日：2015-08-20
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , John J. LOPARCO , Robert K. MULLADY , Donald W. PORTER , Roger R. SCHMIDT , Richard P. SNIDER , John G. TOROK
CPC分类号： H05K7/20736 , F24F7/04 , H05K7/20172 , H05K7/20727
摘要： Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.
摘要翻译： 提供了设备和方法，用于在操作状态下防止从底盘移除空气移动组件。 该装置包括具有滑动元件和一个或多个互锁元件的互锁组件。 滑动元件可滑动地联接到空气移动组件，并且当空气移动组件处于操作状态时处于第一位置，并且当空气移动组件处于静止状态时，滑动元件可滑动到第二位置。 滑动元件防止空气移动组件在第一位置从底盘移除，并且允许空气移动组件在第二位置从底盘移除。 互锁元件与滑动元件相关联并且当空气移动组件处于操作状态时防止滑动元件从第一位置滑动到第二位置。
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3.发明申请公开(公告)号：US20140238640A1
公开(公告)日：2014-08-28
申请号：US13778524
申请日：2013-02-27
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Eric J. McKEEVER , Richard P. SNIDER
IPC分类号： F28F9/26
CPC分类号： H05K7/20254 , F16L41/10 , F28D15/0275 , F28F9/02 , Y10T29/4935
摘要： Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.
摘要翻译： 提供冷却装置和冷却剂冷却的电子组件，其包括热传递结构，其被配置为耦合到具有一个或多个要冷却的电子部件的电子卡的一侧或多侧。 热传递结构包括散热器和与散热器相关联的至少一个冷却剂传送通道，以便于将热量从散热器移除到流过冷却剂传送通道的冷却剂。 冷却装置还包括冷却剂歧管结构，该冷却剂歧管结构设置在电子系统的插座附近，电子系统的插座在其中可操作地对接，以及流体和机械附接机构，其有助于热传递结构和冷却剂歧管的选择性，流体和机械耦合或解耦 结构，该附接机构有助于冷却剂流在冷却剂歧管结构和热传递结构的冷却剂传送通道之间。
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公开(公告)号：US20160095261A1
公开(公告)日：2016-03-31
申请号：US14499422
申请日：2014-09-29
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , John J. LOPARCO , Robert K. MULLADY , Donald W. PORTER , Roger R. SCHMIDT , Richard P. SNIDER , John G. TOROK
CPC分类号： H05K7/20736 , F24F7/04 , H05K7/20172 , H05K7/20727
摘要： Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.
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5.发明申请FABRICATING THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FOR COOLING ELECTRONICS CARD(S) 有权制造电子卡的热转印和冷却冷却结构（S）公开(公告)号：US20150052754A1
公开(公告)日：2015-02-26
申请号：US14528075
申请日：2014-10-30
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Eric J. McKEEVER , Richard P. SNIDER
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/20636 , H05K7/20772 , Y10T29/4935
摘要： Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).
摘要翻译： 提供了制造冷却装置和冷却剂冷却的电子组件的方法，其包括：将构造成具有一个或多个要冷却的电子部件的电子卡的一侧或多侧的热传递结构联接在一起，所述热传递结构包括耦合 到电子卡的一边; 并且将冷却剂冷却结构设置在电子系统的插座附近，冷却剂冷却结构包括一个或多个低剖面冷轨，其大小和构造成沿着热扩散器的底部边缘热耦合到散热器，其操作 电子卡在插座内的对接，以及与低剖面冷轨相关联的一个或多个冷却剂传送通道，用于将热量从低剖面冷轨移除到流过冷却剂承载通道的冷却剂 （s）。
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公开(公告)号：US20160295741A1
公开(公告)日：2016-10-06
申请号：US15185704
申请日：2016-06-17
发明人： Francis R. KRUG , Eric J. McKEEVER , Robert K. MULLADY , Donald W. PORTER , Richard P. SNIDER , John G. TOROK , Allan C. VanDEVENTER , Xiaojin WEI
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , H01L23/473 , H05K7/20218 , H05K7/20772 , H05K7/20781
摘要： A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.
摘要翻译： 提供了一种冷却组件，其包括：一个或多个冷却剂冷却的散热器，其配置成耦合到要冷却的一个或多个电子部件; 一个或多个柔性冷却剂管道; 和一个或多个可枢转的冷却剂歧管。 柔性冷却剂导管将可枢转的冷却剂歧管和冷却剂冷却的散热器流体连通，并且容纳可枢转冷却剂歧管的枢转，同时保持冷却剂冷却的散热器（ s）与可枢转的冷却剂歧管流体连通。 在一个或多个实施例中，可枢转冷却剂歧管在与一个或多个冷却剂冷却的散热器横向偏移的第一位置和在一个或多个冷却剂冷却的散热器上方的第二位置之间枢转。 第一枢转臂和第二枢转臂可以设置在可枢转的冷却剂歧管的相对端处，以便于歧管在第一位置和第二位置之间的可枢转运动。
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公开(公告)号：US20160242318A1
公开(公告)日：2016-08-18
申请号：US14620459
申请日：2015-02-12
发明人： Francis R. KRUG, JR. , Eric J. McKEEVER , Robert K. MULLADY , Donald W. PORTER , Richard P. SNIDER , John G. TOROK , Allan C. VanDEVENTER , Xiaojin WEI
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , H01L23/473 , H05K7/20218 , H05K7/20772 , H05K7/20781
摘要： A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.
摘要翻译： 提供了一种冷却组件，其包括：一个或多个冷却剂冷却的散热器，其配置成耦合到要冷却的一个或多个电子部件; 一个或多个柔性冷却剂管道; 和一个或多个可枢转的冷却剂歧管。 柔性冷却剂导管将可枢转的冷却剂歧管和冷却剂冷却的散热器流体连通，并且容纳可枢转冷却剂歧管的枢转，同时保持冷却剂冷却的散热器（ s）与可枢转的冷却剂歧管流体连通。 在一个或多个实施例中，可枢转的冷却剂歧管在与一个或多个冷却剂冷却的散热器横向偏移的第一位置和在一个或多个冷却剂冷却的散热器上方的第二位置之间枢转第一 并且第二枢转臂可以设置在可枢转的冷却剂歧管的相对端处，以便于歧管在第一位置和第二位置之间的可枢转运动。
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8.发明申请THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FACILITATING COOLING OF ELECTRONICS CARD(S) 有权电子卡片的热转印和冷却冷却结构加热冷却公开(公告)号：US20140240930A1
公开(公告)日：2014-08-28
申请号：US13778552
申请日：2013-02-27
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Eric J. McKEEVER , Richard P. SNIDER
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/20636 , H05K7/20772 , Y10T29/4935
摘要： Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).
摘要翻译： 提供冷却装置和冷却剂冷却的电子组件，其包括热传递结构，其被配置为耦合到具有一个或多个要冷却的电子部件的电子卡的一侧或多侧。 热转印结构包括耦合到电子卡的一侧的散热器，并且该装置还包括邻近电子系统的插座设置的冷却剂冷却结构。 冷却剂冷却结构包括：一个或多个低剖面冷轨，其大小和构造成沿着散热器的底部边缘热耦合到散热器，其中电子卡在插座内的操作对接; 以及与低剖面冷轨相关联的一个或多个冷却剂传送通道，用于将热量从低剖面冷轨移除到流过冷却剂输送通道的冷却剂。
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