摘要:
Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.
摘要:
Systems and methods that protect CMOS layers from exposure to a release chemical are provided. The release chemical is utilized to release a micro-electro-mechanical (MEMS) device integrated with the CMOS wafer. Sidewalls of passivation openings created in a complementary metal-oxide-semiconductor (CMOS) wafer expose a dielectric layer of the CMOS wafer that can be damaged on contact with the release chemical. In one aspect, to protect the CMOS wafer and prevent exposure of the dielectric layer, the sidewalls of the passivation openings can be covered with a metal barrier layer that is resistant to the release chemical. Additionally or optionally, an insulating barrier layer can be deposited on the surface of the CMOS wafer to protect a passivation layer from exposure to the release chemical.
摘要:
Signal processing for an acoustic sensor bi-directional communication channel is presented herein. The acoustic sensor can comprise a micro-electro-mechanical system (MEMS) transducer configured to generate, based on an acoustic pressure, an audio output; and a bi-directional communication component configured to send and/or receive data that has been superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation. In an example, a signal processing component is configured to send the audio output directed to an external device utilizing differential mode signaling between respective pins of the acoustic sensor; and send the data utilizing the common mode signaling comprising a sum of voltages of the respective pins. In other examples, the signal processing component is configured to send and/or receive the data, and send the audio output, during different time periods; or send the data based on a frequency range outside an audio band.
摘要:
Sound based navigation using a portable communications device is presented herein. A portable communications device can include a speaker for generating a sound, and microphone(s) for receiving a reflection of the sound—the reflection including an acoustic wave that has been reflected from an object. Further, the portable communications device can include a timing component configured to determine a time of propagation of the acoustic wave from the speaker to the microphone(s), and a distance component configured to determine a distance of the object from the portable communications device based on the time of propagation of the acoustic wave. Furthermore, the portable communications device can include a mapping component configured to: determine a geographic location of the portable communications device, and create, based on the geographic location and the distance of the object from the portable communications device, a map, indoor map, etc. of objects, structures, etc. comprising the object.
摘要:
A MEMS acoustic sensor includes a transducer with a frequency response with a gain peak, and a peak reduction circuit with a frequency response and coupled to the transducer. The frequency response of the peak reduction circuit causes attenuation of the gain peak.
摘要:
A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a substrate having a first surface and a second surface and wherein the first surface is exposed to an environment outside the MEMS device; and a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such that acoustic waves received at the MEMS microphone are incident on the diaphragm. The MEMS device also includes: a first integrated circuit disposed at a second location of the substrate, wherein the first integrated circuit is electrically coupled to the MEMS microphone; and a MEMS measurement device at a third location, wherein the MEMS measurement device comprises a motion sensor and a pressure sensor.
摘要:
An integrated MEMS acoustic sensor has a MEMS transducer and a programmable electronic interface. The programmable electronic interface includes non-volatile memory and is coupled to the MEMS transducer. Using programmable electrical functions, the programmable electronic interface is operable to sense variations in the MEMS transducer caused by application of an acoustic pressure to the MEMS transducer.
摘要:
Providing security features in an audio sensor is presented herein. A micro-electro-mechanical system (MEMS) microphone can include an acoustic membrane that converts an acoustic signal into an electrical signal; an electronic amplifier that increases an amplitude of the electrical signal to generate an amplified signal; and switch(es) configured to prevent propagation of a direct current (DC) voltage source to the MEMS microphone; prevent propagation of the DC voltage source to the electronic amplifier; prevent propagation of the electrical signal to the electronic amplifier; and/or prevent propagation of the amplified signal to an external device.
摘要:
Systems and methods that protect CMOS layers from exposure to a release chemical are provided. The release chemical is utilized to release a micro-electro-mechanical (MEMS) device integrated with the CMOS wafer. Sidewalls of passivation openings created in a complementary metal-oxide-semiconductor (CMOS) wafer expose a dielectric layer of the CMOS wafer that can be damaged on contact with the release chemical. In one aspect, to protect the CMOS wafer and prevent exposure of the dielectric layer, the sidewalls of the passivation openings can be covered with a metal barrier layer that is resistant to the release chemical. Additionally or optionally, an insulating barrier layer can be deposited on the surface of the CMOS wafer to protect a passivation layer from exposure to the release chemical.
摘要:
A MEMS acoustic sensor includes a transducer with a frequency response with a gain peak, and a peak reduction circuit with a frequency response and coupled to the transducer. The frequency response of the peak reduction circuit causes attenuation of the gain peak.