SMART SENSOR FOR ALWAYS-ON OPERATION

    公开(公告)号:US20210006895A1

    公开(公告)日:2021-01-07

    申请号:US17024626

    申请日:2020-09-17

    申请人: INVENSENSE, INC.

    IPC分类号: H04R3/00 H04R19/04 H04R19/00

    摘要: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.

    Signal processing for an acoustic sensor bi-directional communication channel

    公开(公告)号:US09749736B2

    公开(公告)日:2017-08-29

    申请号:US14975155

    申请日:2015-12-18

    申请人: INVENSENSE, INC.

    摘要: Signal processing for an acoustic sensor bi-directional communication channel is presented herein. The acoustic sensor can comprise a micro-electro-mechanical system (MEMS) transducer configured to generate, based on an acoustic pressure, an audio output; and a bi-directional communication component configured to send and/or receive data that has been superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation. In an example, a signal processing component is configured to send the audio output directed to an external device utilizing differential mode signaling between respective pins of the acoustic sensor; and send the data utilizing the common mode signaling comprising a sum of voltages of the respective pins. In other examples, the signal processing component is configured to send and/or receive the data, and send the audio output, during different time periods; or send the data based on a frequency range outside an audio band.

    Sound bases navigation using a portable communications device
    4.
    发明授权
    Sound bases navigation using a portable communications device 有权
    使用便携式通信设备进行声音导航

    公开(公告)号:US09503828B2

    公开(公告)日:2016-11-22

    申请号:US14478158

    申请日:2014-09-05

    申请人: INVENSENSE, INC.

    IPC分类号: H04R29/00 H04R1/08

    摘要: Sound based navigation using a portable communications device is presented herein. A portable communications device can include a speaker for generating a sound, and microphone(s) for receiving a reflection of the sound—the reflection including an acoustic wave that has been reflected from an object. Further, the portable communications device can include a timing component configured to determine a time of propagation of the acoustic wave from the speaker to the microphone(s), and a distance component configured to determine a distance of the object from the portable communications device based on the time of propagation of the acoustic wave. Furthermore, the portable communications device can include a mapping component configured to: determine a geographic location of the portable communications device, and create, based on the geographic location and the distance of the object from the portable communications device, a map, indoor map, etc. of objects, structures, etc. comprising the object.

    摘要翻译: 本文介绍使用便携式通信设备的基于声音的导航。 便携式通信设备可以包括用于产生声音的扬声器和用于接收声音的反射的麦克风 - 该反射包括已经从对象反射的声波。 此外,便携式通信设备可以包括定时分量,其被配置为确定声波从扬声器到麦克风的传播时间,以及距离分量,其被配置为基于来自便携式通信设备的距离来确定物体 在声波的传播时间。 此外,便携式通信设备可以包括映射组件,其被配置为:确定便携式通信设备的地理位置,并且基于物体与便携式通信设备的地理位置和距离创建地图,室内地图, 包括对象的对象,结构等的等等。

    SYSTEMS AND APPARATUS HAVING MEMS ACOUSTIC SENSORS AND OTHER MEMS SENSORS AND METHODS OF FABRICATION OF THE SAME
    6.
    发明申请
    SYSTEMS AND APPARATUS HAVING MEMS ACOUSTIC SENSORS AND OTHER MEMS SENSORS AND METHODS OF FABRICATION OF THE SAME 有权
    具有MEMS声学传感器和其他MEMS传感器的系统和装置及其制造方法

    公开(公告)号:US20150158722A1

    公开(公告)日:2015-06-11

    申请号:US14618251

    申请日:2015-02-10

    申请人: INVENSENSE, INC.

    IPC分类号: B81B7/00 B81C1/00

    摘要: A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a substrate having a first surface and a second surface and wherein the first surface is exposed to an environment outside the MEMS device; and a MEMS microphone disposed at a first location on the second surface of the substrate and having a diaphragm positioned such that acoustic waves received at the MEMS microphone are incident on the diaphragm. The MEMS device also includes: a first integrated circuit disposed at a second location of the substrate, wherein the first integrated circuit is electrically coupled to the MEMS microphone; and a MEMS measurement device at a third location, wherein the MEMS measurement device comprises a motion sensor and a pressure sensor.

    摘要翻译: 提供了微机电系统(MEMS)装置。 MEMS器件包括:具有第一表面和第二表面的衬底,并且其中第一表面暴露于MEMS器件外部的环境; 以及MEMS麦克风,其设置在所述基板的第二表面上的第一位置处,并且具有定位成使得在所述MEMS麦克风处接收的声波入射在所述隔膜上的隔膜。 MEMS器件还包括:设置在衬底的第二位置处的第一集成电路,其中第一集成电路电耦合到MEMS麦克风; 以及在第三位置处的MEMS测量装置,其中所述MEMS测量装置包括运动传感器和压力传感器。

    ACOUSTIC SENSOR WITH INTEGRATED PROGRAMMABLE ELECTRONIC INTERFACE
    7.
    发明申请
    ACOUSTIC SENSOR WITH INTEGRATED PROGRAMMABLE ELECTRONIC INTERFACE 审中-公开
    具有集成可编程电子接口的声学传感器

    公开(公告)号:US20140264652A1

    公开(公告)日:2014-09-18

    申请号:US13950240

    申请日:2013-07-24

    申请人: Invensense, Inc.

    IPC分类号: B81B3/00

    摘要: An integrated MEMS acoustic sensor has a MEMS transducer and a programmable electronic interface. The programmable electronic interface includes non-volatile memory and is coupled to the MEMS transducer. Using programmable electrical functions, the programmable electronic interface is operable to sense variations in the MEMS transducer caused by application of an acoustic pressure to the MEMS transducer.

    摘要翻译: 集成的MEMS声学传感器具有MEMS传感器和可编程电子接口。 可编程电子接口包括非易失性存储器并耦合到MEMS换能器。 使用可编程电气功能,可编程电子接口可操作以感测通过向MEMS换能器施加声压而引起的MEMS换能器中的变化。

    Secure audio sensor
    8.
    发明授权

    公开(公告)号:US10182296B2

    公开(公告)日:2019-01-15

    申请号:US14537991

    申请日:2014-11-11

    申请人: INVENSENSE, INC.

    摘要: Providing security features in an audio sensor is presented herein. A micro-electro-mechanical system (MEMS) microphone can include an acoustic membrane that converts an acoustic signal into an electrical signal; an electronic amplifier that increases an amplitude of the electrical signal to generate an amplified signal; and switch(es) configured to prevent propagation of a direct current (DC) voltage source to the MEMS microphone; prevent propagation of the DC voltage source to the electronic amplifier; prevent propagation of the electrical signal to the electronic amplifier; and/or prevent propagation of the amplified signal to an external device.

    Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
    9.
    发明授权
    Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices 有权
    释放用于集成的互补金属氧化物半导体(CMOS)和微机电(MEMS)器件的化学保护

    公开(公告)号:US09487396B2

    公开(公告)日:2016-11-08

    申请号:US14477451

    申请日:2014-09-04

    申请人: INVENSENSE, INC.

    IPC分类号: B81C1/00 B81B7/00

    摘要: Systems and methods that protect CMOS layers from exposure to a release chemical are provided. The release chemical is utilized to release a micro-electro-mechanical (MEMS) device integrated with the CMOS wafer. Sidewalls of passivation openings created in a complementary metal-oxide-semiconductor (CMOS) wafer expose a dielectric layer of the CMOS wafer that can be damaged on contact with the release chemical. In one aspect, to protect the CMOS wafer and prevent exposure of the dielectric layer, the sidewalls of the passivation openings can be covered with a metal barrier layer that is resistant to the release chemical. Additionally or optionally, an insulating barrier layer can be deposited on the surface of the CMOS wafer to protect a passivation layer from exposure to the release chemical.

    摘要翻译: 提供了保护CMOS层免于暴露于释放化学品的系统和方法。 释放化学品用于释放与CMOS晶片集成的微机电(MEMS)器件。 在互补金属氧化物半导体(CMOS)晶片中产生的钝化开口的侧壁暴露了CMOS释放化学品接触时可能损坏的CMOS晶片的电介质层。 在一个方面,为了保护CMOS晶片并防止电介质层的暴露,钝化开口的侧壁可以被抵抗释放化学品的金属阻挡层覆盖。 另外或可选地,可以在CMOS晶片的表面上沉积绝缘阻挡层,以保护钝化层免于暴露于释放化学品。