PROCESS AND SYSTEM FOR UNIFORMLY CRYSTALLIZING AMORPHOUS SILICON SUBSTRATE BY FIBER LASER
    2.
    发明申请
    PROCESS AND SYSTEM FOR UNIFORMLY CRYSTALLIZING AMORPHOUS SILICON SUBSTRATE BY FIBER LASER 审中-公开
    通过光纤激光器使非晶硅基板均匀结晶的工艺和系统

    公开(公告)号:US20160013057A1

    公开(公告)日:2016-01-14

    申请号:US14790170

    申请日:2015-07-02

    摘要: The inventive system for crystallizing an amorphous silicon (a-Si) film is configured with a quasi-continuous wave fiber laser source operative to emit a film irradiating pulsed beam. The fiber laser source is operative to emit a plurality of non-repetitive pulses incident on the a-Si. In particular, the fiber laser is operative to emit multiple discrete packets of film irradiating light at a burst repetition rate (BRR), and a plurality of pulses within each packet emitted at a pulse repetition rate (PRR) which is higher than the BRR. The pulse energy, pulse duration of each pulse and the PRR are controlled so that each packet has a desired packet temporal power profile (W/cm2) and packet energy sufficient to provide transformation of a-Si to polysilicon (p-Si) at each location of the film which is exposed to at least one packets.

    摘要翻译: 本发明的用于结晶非晶硅(a-Si)膜的系统由准连续波长的光纤激光源构成,该激光源可操作地发射照射脉冲光束的膜。 光纤激光源可操作地发射入射到a-Si上的多个非重复脉冲。 特别地,光纤激光器以突发重复率(BRR)发射多个离散的薄膜照射光束的分组,并且以比BRR高的脉冲重复率(PRR)发射每个分组内的多个脉冲。 控制脉冲能量,每个脉冲的脉冲持续时间和PRR,使得每个分组具有期望的分组时间功率分布(W / cm 2)和分组能量,其足以在每个分组处提供a-Si到多晶硅(p-Si)的转变 暴露于至少一个数据包的电影的位置。

    FIBER LASER APPARATUS AND METHOD FOR PROCESSING WORKPIECE

    公开(公告)号:US20230405713A1

    公开(公告)日:2023-12-21

    申请号:US18201306

    申请日:2023-05-24

    摘要: A surface treating method and apparatus include operating a quasi-continuous wave fiber laser and pre-scan shaping the laser beam such that an instantaneous spot beam has predetermined geometrical dimensions, intensity profile, and power; operating a scanner at an optimal angular velocity and angular range to divide the pre-scan beam into at least one sub-beam deflected toward the surface being processed; guiding the sub-beam through a post-scan optical assembly to provide the spot beam with predetermined geometrical dimensions, power, and angular velocity and range, which are selected such that the instantaneous spot beam is dragged in a scan direction over a desired length at a desired scan velocity, which allow the treated surface to be exposed for a predetermined exposure duration and have a predetermined fluence distribution providing the treated surface with a quality comparable to that of the surface processed by an excimer laser or a burst-mode fiber laser.

    LASER APPARATUS AND METHOD OF PROCESSING THIN FILMS

    公开(公告)号:US20210098255A1

    公开(公告)日:2021-04-01

    申请号:US16635097

    申请日:2018-07-31

    IPC分类号: H01L21/02 H01L21/67 H01L27/12

    摘要: A method of fiber laser processing of thin film deposited on a substrate includes providing a laser beam from at least one fiber laser which is guided through a beam-shaping unit onto the thin film. The beam-shaping optics is configured to shape the laser beam into a line beam which irradiates a first irradiated thin film area Ab on a surface of the thin film, with the irradiated thin film area Ab being a fraction of the thin film area Af. By continuously displacing the beam shaping optics and the film relative to one another in a first direction at a distance dy between sequential irradiations, a sequence of uniform irradiated thin film areas Ab are formed on the film surface defining thus a first elongated column. Thereafter the beam shaped optics and film are displaced relative to one another at a distance dx in a second direction transverse to the first direction with the distance dx being smaller than a length of the irradiated film area Ab. With the steps performed to form respective columns, the elongated columns overlap one another covering the desired thin film area Af. The dx and dy distances are so selected that that each location of the film area Af is exposed to the shaped laser beam during a cumulative predetermined duration.

    FIBER LASER APPARATUS AND METHOD FOR PROCESSING WORKPIECE

    公开(公告)号:US20210008660A1

    公开(公告)日:2021-01-14

    申请号:US16635877

    申请日:2018-07-31

    摘要: A surface treating method and apparatus include operating a quasi-continuous wave fiber laser and pre-scan shaping the laser beam such that an instantaneous spot beam has predetermined geometrical dimensions, intensity profile, and power; operating a scanner at an optimal angular velocity and angular range to divide the pre-scan beam into a plurality of sub-beams deflected towards the surface being processed; guiding the sub-beams through a post-scan optical assembly to provide the spot beam with predetermined geometrical dimensions, power, and angular velocity and range, which are selected such that the instantaneous spot beam is dragged in a scan direction over a desired length at a desired scan velocity, which allow the treated surface to be exposed for a predetermined exposure duration and have a predetermined fluence distribution providing the treated surface with a quality comparable to that of the surface processed by an excimer laser or a burst-mode fiber laser.