摘要:
A compounds represented by the Formula (I) or the Formula (I′). wherein Z1 and Z2 independently represent a hydrogen atom, a C1 to C12 alkyl group or a C3 to C12 cyclic saturated hydrocarbon group, provided that at least one of Z1 and Z2 represent a C1 to C12 alkyl group or a C3 to C12 cyclic saturated hydrocarbon group; rings Y1 and Y2 independently represents an optionally substituted C3 to C20 alicyclic hydrocarbon group; Q1 to Q4 and Q′1 to Q′4 independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group; and m and n independently represent an integer of 0 to 5.
摘要:
A compounds represented by the Formula (I) or the Formula (I′). wherein Z1 and Z2 independently represent a hydrogen atom, a C1 to C12 alkyl group or a C3 to C12 cyclic saturated hydrocarbon group, provided that at least one of Z1 and Z2 represent a C1 to C12 alkyl group or a C3 to C12 cyclic saturated hydrocarbon group; rings Y1 and Y2 independently represents an optionally substituted C3 to C20 alicyclic hydrocarbon group; Q1 to Q4 and Q′1 to Q′4 independently represent a fluorine atom or a C1 to C6 perfluoroalkyl group; and m and n independently represent an integer of 0 to 5.
摘要:
The present invention has the object of providing a method of manufacturing a resist pattern in which an extremely fine and highly accurate resist pattern can be formed which is obtained using the resist composition for forming a first resist pattern in a multi-patterning method such as a double patterning method. The resist processing method comprising; forming a first resist film by applying a first resist composition onto a substrate and drying, the first resist composition comprising a resin (A), a photo acid generator (B) and a cross-linking agent (C), the resin (A) having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution but of being rendered soluble in alkali aqueous solution through the action of an acid; prebaking; exposure processing; post-exposure baking; developing; hard-baking the first resist pattern; and obtaining a second resist film; pre-baking; exposure processing; post-exposure baking; developing to obtain a second resist pattern.
摘要:
A resist processing method comprises the steps of: (1) forming a first resist film by applying a first resist composition comprising: a resin (A) having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution, and being rendered soluble in alkali aqueous solution through the action of an acid, a photo acid generator (B), a cross-linking agent (C) and an acid amplifier (D) onto a substrate and drying; (2) prebaking the first resist film; (3) exposing to the first resist film; (4) post-exposure baking of the first resist film; (5) developing with a first alkali developer to obtain a first resist pattern; (6) hard-baking the first resist pattern, (7) obtaining a second resist film by applying a second resist composition onto the first resist pattern, and drying; (8) pre-baking the second resist film; (9) exposing the second resist film; (10) post-exposure baking the second resist film; and (11) developing with a second alkali developer to obtain a second resist pattern.
摘要:
A polymer comprising a structural unit represented by the formula (Ia) or (Ib): wherein R1 represents a hydrogen atom etc., R2 represents a linear, branched chain or cyclic C1-C8 alkyl group, R3 represents a methyl group, n represents an integer of 0 to 14, Z1 represents a single bond etc., k represents an integer of 1 to 4, R4 and R5 each independently represents a hydrogen atom etc., and m represents an integer of 1 to 3, a structural unit represented by the formula (II): wherein R6 and R7 each independently represents a hydrogen atom etc., R8 represents a methyl group, R9 represents a hydrogen atom etc., n′ represents an integer of 0 to 12, Z2 represents a single bond etc., k′ represents an integer of 1 to 4, R21 and R22 each independently represents a hydrogen atom etc., and R23 represents a C1-C30 monovalent hydrocarbon group, and at least one structural unit selected from the group consisting of structural units represented by the formulae (IIIa), (IIIb), (IIIc), (IIId) and (IIIf) wherein R10 represents a hydrogen atom etc., R11 represents a methyl group, R12 is independently in each occurrence a carboxyl group etc., j represents an integer of 0 to 3, a represents an integer of 0 to 5, b represents an integer of 0 to 3, c represents an integer of 0 to (2j+2), Z3 represents a single bond etc., and k″ represents an integer of 1 to 4.
摘要:
A coating composition for forming etch mask patterns may include a polymer and an organic solvent. The polymer may have an aromatic ring substituted by a vinyl ether functional group. The polymer may be, for example, a Novolak resin partially substituted by a vinyl ether functional group or poly(hydroxystyrene) partially substituted by a vinyl ether functional group.
摘要:
Provided are example embodiments of the invention including a range of polymer structures suitable for incorporation in barrier compositions for use, for example, in immersion photolithography in combination with a suitable solvent or solvent system. These polymers exhibit a weight average molecular weight (Mw) of 5,000 to 200,000 daltons and may be generally represented by formula I: wherein the expressions (1+m+n)=1; 0.1≦(1/(1+m+n))≦0.7; 0.3≦(m/(1+m+n))≦0.9; and 0.0≦(n/(1+m+n))≦0.6 are satisfied; R1, R2 and R3 are C1 to C5 alkyl, C1 to C5 alkoxy and hydroxyl groups; and Z represents an alkene that includes at least one hydrophilic group. Barrier coating compositions will include an organic solvent or solvent system selected from C3 to C10 alcohol-based organic solvents, C4 to C12 alkane-based organic solvents and mixtures thereof.
摘要翻译:提供本发明的示例性实施方案,其包括适用于结合到阻挡组合物中的聚合物结构的范围,用于例如浸渍光刻法与合适的溶剂或溶剂体系的组合。 这些聚合物的重均分子量(Mw)为5000〜200,000道尔顿,通常可以由式I表示:式(1 + m + n)= 1; 0.1 <=(1 /(1 + m + n))<= 0.7; 0.3 <=(m /(1 + m + n))<= 0.9; 并且满足0.0 <=(n /(1 + m + n))<= 0.6; R 1,R 2和R 3均为C 1至C 5烷基 C 1 -C 5烷氧基和羟基; Z表示包含至少一个亲水基团的烯烃。 阻挡涂层组合物将包括选自C 3〜C 10醇基有机溶剂,C 4〜C 6烷基的有机溶剂或溶剂体系, 基于烷烃的有机溶剂及其混合物。
摘要:
Top coating compositions capable of being used in immersion lithography, and methods of forming photoresist patterns using the same, are provided. The top coating composition includes: a polymer, a base; and a solvent, wherein the polymer may be represented by Formula I: wherein R1 and R2 are independently selected from the group consisting of hydrogen, fluoro, methyl, and trifluoromethyl; X is a carboxylic acid group or a sulfonic acid group; Y is a carboxylic acid group or a sulfonic acid group, wherein the carboxylic acid group or sulfonic acid group is protected; Z is a monomer selected from the group consisting of a vinyl monomer, an alkyleneglycol, a maleic anhydride, an ethyleneimine, an oxazoline-containing monomer, acrylonitrile, an allylamide, a 3,4-dihydropyran, a 2,3-dihydrofuran, tetrafluoroethylene, or a combination thereof; and m, n, and q are integers wherein 0.03≦m/(m+n+q)≦0.97, 0.03≦n/(m+n+q)≦0.97, 0≦q/(m+n+q)≦0.5; and wherein the solvent includes deionized water.
摘要翻译:提供能够用于浸没式光刻的顶涂层组合物,以及使用其形成光刻胶图案的方法。 顶部涂料组合物包括:聚合物,碱; 和溶剂,其中所述聚合物可以由式I表示:其中R 1和R 2独立地选自氢,氟,甲基和三氟甲基 ; X是羧酸基或磺酸基; Y是羧酸基或磺酸基,其中羧酸基或磺酸基被保护; Z是选自乙烯基单体,亚烷基二醇,马来酸酐,乙烯亚胺,含恶唑啉的单体,丙烯腈,烯丙基酰胺,3,4-二氢吡喃,2,3-二氢呋喃,四氟乙烯 ,或其组合; 并且m,n和q是其中0.03 <= m /(m + n + q)<=0.97,0.03≤n/(m + n + q)<= 0.97,0 <= q /(m + n + q)<= 0.5; 并且其中所述溶剂包括去离子水。
摘要:
Methods of forming an integrated circuit device may include forming a resist pattern on a layer of an integrated circuit device with portions of the layer being exposed through openings of the resist pattern. An organic-inorganic hybrid siloxane network film may be formed on the resist pattern. Portions of the layer exposed through the resist pattern and the organic-inorganic hybrid siloxane network film may then be removed. Related structures are also discussed.
摘要:
A mask pattern for semiconductor device fabrication comprises a resist pattern formed on a semiconductor substrate, and an interpolymer complex film formd on the resist pattern, wherein the interpolymer complex film includes a network formed by a hydrogen bond between a proton donor polymer and a proton acceptor polymer.