公开(公告)号：US07842564B2

公开(公告)日：2010-11-30

申请号：US12167695

申请日：2008-07-03

申请人： Ichiro Mizushima ,  Hirokazu Ishida ,  Yoshio Ozawa ,  Takashi Suzuki ,  Fumiki Aiso ,  Makoto Mizukami

发明人： Ichiro Mizushima ,  Hirokazu Ishida ,  Yoshio Ozawa ,  Takashi Suzuki ,  Fumiki Aiso ,  Makoto Mizukami

IPC分类号： H01L21/84

CPC分类号： H01L27/11521 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02639 ,  H01L21/02667 ,  H01L21/7624 ,  H01L21/84 ,  H01L27/115 ,  H01L27/11524 ,  H01L27/11568 ,  H01L27/12 ,  H01L27/1203 ,  H01L29/66825

摘要： In a method of manufacturing a semiconductor memory device, an opening is made in a part of an insulating film formed on a silicon substrate. An amorphous silicon thin film is formed on the insulating film in which the opening has been made and inside the opening. Then, a monocrystal is solid-phase-grown in the amorphous silicon thin film, with the opening as a seed, thereby forming a monocrystalline silicon layer. Then, the monocrystalline silicon layer is heat-treated in an oxidizing atmosphere, thereby thinning the monocrystalline silicon layer and reducing the defect density. Then, a memory cell array is formed on the monocrystalline silicon layer which has been thinned and whose defect density has been reduced.

摘要翻译： 在制造半导体存储器件的方法中，在形成于硅衬底上的绝缘膜的一部分上形成开口。 在已经形成开口的绝缘膜和开口内部形成非晶硅薄膜。 然后，将单晶在非晶硅薄膜中固相生长，以开口为种子，由此形成单晶硅层。 然后，在氧化气氛中对单晶硅层进行热处理，从而使单晶硅层变薄并降低缺陷密度。 然后，在已经变薄的缺陷密度降低的单晶硅层上形成存储单元阵列。

公开(公告)号：US20090014828A1

公开(公告)日：2009-01-15

申请号：US12167695

申请日：2008-07-03

申请人： Ichiro MIZUSHIMA ,  Hirokazu Ishida ,  Yoshio Ozawa ,  Takashi Suzuki ,  Fumiki Aiso ,  Makoto Mizukami

发明人： Ichiro MIZUSHIMA ,  Hirokazu Ishida ,  Yoshio Ozawa ,  Takashi Suzuki ,  Fumiki Aiso ,  Makoto Mizukami

IPC分类号： H01L29/06 ,  H01L21/36

CPC分类号： H01L27/11521 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02639 ,  H01L21/02667 ,  H01L21/7624 ,  H01L21/84 ,  H01L27/115 ,  H01L27/11524 ,  H01L27/11568 ,  H01L27/12 ,  H01L27/1203 ,  H01L29/66825

摘要： In a method of manufacturing a semiconductor memory device, an opening is made in a part of an insulating film formed on a silicon substrate. An amorphous silicon thin film is formed on the insulating film in which the opening has been made and inside the opening. Then, a monocrystal is solid-phase-grown in the amorphous silicon thin film, with the opening as a seed, thereby forming a monocrystalline silicon layer. Then, the monocrystalline silicon layer is heat-treated in an oxidizing atmosphere, thereby thinning the monocrystalline silicon layer and reducing the defect density. Then, a memory cell array is formed on the monocrystalline silicon layer which has been thinned and whose defect density has been reduced.

摘要翻译： 在制造半导体存储器件的方法中，在形成于硅衬底上的绝缘膜的一部分上形成开口。 在已经形成开口的绝缘膜和开口内部形成非晶硅薄膜。 然后，将单晶在非晶硅薄膜中固相生长，以开口为种子，由此形成单晶硅层。 然后，在氧化气氛中对单晶硅层进行热处理，从而使单晶硅层变薄并降低缺陷密度。 然后，在已经变薄的缺陷密度降低的单晶硅层上形成存储单元阵列。

公开(公告)号：US07651930B2

公开(公告)日：2010-01-26

申请号：US12146802

申请日：2008-06-26

申请人： Takashi Suzuki ,  Hirokazu Ishida ,  Ichiro Mizushima ,  Yoshio Ozawa ,  Fumiki Aiso ,  Katsuyuki Sekine ,  Takashi Nakao ,  Yoshihiko Saito

发明人： Takashi Suzuki ,  Hirokazu Ishida ,  Ichiro Mizushima ,  Yoshio Ozawa ,  Fumiki Aiso ,  Katsuyuki Sekine ,  Takashi Nakao ,  Yoshihiko Saito

IPC分类号： H01L21/20

CPC分类号： H01L27/115 ,  H01L21/76264 ,  H01L21/84 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/1203 ,  H01L29/66825

摘要： A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the opening portions are formed, and in the opening portions. Then, trenches are formed to divide the amorphous silicon film, in the vicinity of a midpoint between adjacent opening portions, into a portion on one opening portion side and a portion on the other opening portion side. Next, the amorphous silicon film, in which the trenches are formed, is annealed and subjected to solid-phase crystallization to form a single crystal with the opening portions used as seeds, and thereby a silicon single-crystal layer is formed. Then, a memory cell array is formed on the silicon single-crystal layer.

摘要翻译： 一种制造半导体存储装置的方法包括在形成在硅衬底上的绝缘膜中的多个位置提供开口部分，然后在其中形成开口部分的绝缘膜上形成非晶硅膜，并且在 开口部。 然后，形成沟槽，将相邻的开口部之间的中点附近的非晶硅膜分割成一个开口部侧的一部分和另一个开口部侧的一部分。 接着，对其中形成沟槽的非晶硅膜进行退火并进行固相结晶以形成具有用作晶种的开口部分的单晶，从而形成硅单晶层。 然后，在硅单晶层上形成存储单元阵列。

公开(公告)号：US07863166B2

公开(公告)日：2011-01-04

申请号：US12646563

申请日：2009-12-23

申请人： Takashi Suzuki ,  Hirokazu Ishida ,  Ichiro Mizushima ,  Yoshio Ozawa ,  Fumiki Aiso ,  Katsuyuki Sekine ,  Takashi Nakao ,  Yoshihiko Saito

发明人： Takashi Suzuki ,  Hirokazu Ishida ,  Ichiro Mizushima ,  Yoshio Ozawa ,  Fumiki Aiso ,  Katsuyuki Sekine ,  Takashi Nakao ,  Yoshihiko Saito

IPC分类号： H01L21/20

CPC分类号： H01L27/115 ,  H01L21/76264 ,  H01L21/84 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/1203 ,  H01L29/66825

摘要： A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the opening portions are formed, and in the opening portions. Then, trenches are formed to divide the amorphous silicon film, in the vicinity of a midpoint between adjacent opening portions, into a portion on one opening portion side and a portion on the other opening portion side. Next, the amorphous silicon film, in which the trenches are formed, is annealed and subjected to solid-phase crystallization to form a single crystal with the opening portions used as seeds, and thereby a silicon single-crystal layer is formed. Then, a memory cell array is formed on the silicon single-crystal layer.

摘要翻译： 一种制造半导体存储装置的方法包括在形成在硅衬底上的绝缘膜中的多个位置提供开口部分，然后在其中形成开口部分的绝缘膜上形成非晶硅膜，并且在 开口部。 然后，形成沟槽，将相邻的开口部之间的中点附近的非晶硅膜分割成一个开口部侧的一部分和另一个开口部侧的一部分。 接着，对其中形成沟槽的非晶硅膜进行退火并进行固相结晶以形成具有用作晶种的开口部分的单晶，从而形成硅单晶层。 然后，在硅单晶层上形成存储单元阵列。

公开(公告)号：US20090004833A1

公开(公告)日：2009-01-01

申请号：US12146802

申请日：2008-06-26

申请人： Takashi Suzuki ,  Hirokazu Ishida ,  Ichiro Mizushima ,  Yoshio Ozawa ,  Fumiki Aiso ,  Katsuyuki Sekine ,  Takashi Nakao ,  Yoshihiko Saito

发明人： Takashi Suzuki ,  Hirokazu Ishida ,  Ichiro Mizushima ,  Yoshio Ozawa ,  Fumiki Aiso ,  Katsuyuki Sekine ,  Takashi Nakao ,  Yoshihiko Saito

IPC分类号： H01L21/20

CPC分类号： H01L27/115 ,  H01L21/76264 ,  H01L21/84 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/1203 ,  H01L29/66825

摘要： A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the opening portions are formed, and in the opening portions. Then, trenches are formed to divide the amorphous silicon film, in the vicinity of a midpoint between adjacent opening portions, into a portion on one opening portion side and a portion on the other opening portion side. Next, the amorphous silicon film, in which the trenches are formed, is annealed and subjected to solid-phase crystallization to form a single crystal with the opening portions used as seeds, and thereby a silicon single-crystal layer is formed. Then, a memory cell array is formed on the silicon single-crystal layer.

摘要翻译： 一种制造半导体存储装置的方法包括在形成在硅衬底上的绝缘膜中的多个位置提供开口部分，然后在其中形成开口部分的绝缘膜上形成非晶硅膜，并且在 开口部。 然后，形成沟槽，将相邻的开口部之间的中点附近的非晶硅膜分割成一个开口部侧的一部分和另一个开口部侧的一部分。 接着，对其中形成沟槽的非晶硅膜进行退火并进行固相结晶以形成具有用作晶种的开口部分的单晶，从而形成硅单晶层。 然后，在硅单晶层上形成存储单元阵列。

公开(公告)号：US20100112791A1

公开(公告)日：2010-05-06

申请号：US12646563

申请日：2009-12-23

申请人： Takashi Suzuki ,  Hirokazu Ishida ,  Ichiro Mizushima ,  Yoshio Ozawa ,  Fumiki Aiso ,  Katsuyuki Sekine ,  Takashi Nakao ,  Yoshihiko Saito

发明人： Takashi Suzuki ,  Hirokazu Ishida ,  Ichiro Mizushima ,  Yoshio Ozawa ,  Fumiki Aiso ,  Katsuyuki Sekine ,  Takashi Nakao ,  Yoshihiko Saito

IPC分类号： H01L21/20

CPC分类号： H01L27/115 ,  H01L21/76264 ,  H01L21/84 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/1203 ,  H01L29/66825

摘要： A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the opening portions are formed, and in the opening portions. Then, trenches are formed to divide the amorphous silicon film, in the vicinity of a midpoint between adjacent opening portions, into a portion on one opening portion side and a portion on the other opening portion side. Next, the amorphous silicon film, in which the trenches are formed, is annealed and subjected to solid-phase crystallization to form a single crystal with the opening portions used as seeds, and thereby a silicon single-crystal layer is formed. Then, a memory cell array is formed on the silicon single-crystal layer.

摘要翻译： 一种制造半导体存储装置的方法包括在形成在硅衬底上的绝缘膜中的多个位置提供开口部分，然后在其中形成开口部分的绝缘膜上形成非晶硅膜，并且在 开口部。 然后，形成沟槽，将相邻的开口部之间的中点附近的非晶硅膜分割成一个开口部侧的一部分和另一个开口部侧的一部分。 接着，对其中形成沟槽的非晶硅膜进行退火并进行固相结晶以形成具有用作晶种的开口部分的单晶，从而形成硅单晶层。 然后，在硅单晶层上形成存储单元阵列。

公开(公告)号：US20100117135A1

公开(公告)日：2010-05-13

申请号：US12564349

申请日：2009-09-22

申请人： Makoto MIZUKAMI ,  Kiyohito Nishihara ,  Masaki Kondo ,  Takashi Izumida ,  Hirokazu Ishida ,  Atsushi Fukumoto ,  Fumiki Aiso ,  Daigo Ichinose ,  Tadashi Iguchi

发明人： Makoto MIZUKAMI ,  Kiyohito Nishihara ,  Masaki Kondo ,  Takashi Izumida ,  Hirokazu Ishida ,  Atsushi Fukumoto ,  Fumiki Aiso ,  Daigo Ichinose ,  Tadashi Iguchi

IPC分类号： H01L27/12 ,  H01L21/86

CPC分类号： H01L27/1203 ,  H01L21/84 ,  H01L27/11521 ,  H01L27/11524

摘要： A semiconductor device is formed on a SOI substrate having a semiconductor substrate, a buried oxide film formed on the semiconductor substrate, and a semiconductor layer formed on the buried oxide film, the semiconductor substrate having a first conductive type, the semiconductor layer having a second conductive type, wherein the buried oxide film has a first opening opened therethrough for communicating the semiconductor substrate with the semiconductor layer, the semiconductor layer is arranged to have a first buried portion buried in the first opening in contact with the semiconductor substrate and a semiconductor layer main portion positioned on the first buried portion and on the buried oxide film, the semiconductor substrate has a connection layer buried in a surface of the semiconductor substrate and electrically connected to the first buried portion in the first opening, the connection layer having the second conductive type, and the semiconductor device includes a contact electrode buried in a second opening, a side surface of the contact electrode being connected to the semiconductor layer main portion, a bottom surface of the contact electrode being connected to the connection layer, the second opening passing through the semiconductor layer main portion and the buried oxide film, and the second opening reaching a surface portion of the connection layer.

摘要翻译： 半导体器件形成在具有半导体衬底的SOI衬底上，形成在半导体衬底上的掩埋氧化膜以及形成在掩埋氧化膜上的半导体层，该半导体衬底具有第一导电类型，该半导体层具有第二导电型 导电型，其中所述掩埋氧化物膜具有通过其开口的第一开口，用于使所述半导体衬底与所述半导体层连通，所述半导体层被布置为具有埋在所述第一开口中的与所述半导体衬底接触的第一掩埋部分和半导体层 主要部分位于第一掩埋部分和掩埋氧化膜上，半导体衬底具有埋在半导体衬底的表面中并与第一开口中的第一掩埋部分电连接的连接层，连接层具有第二导电 类型，并且半导体器件包括接触电极 阴极埋入第二开口中，接触电极的侧表面连接到半导体层主体部分，接触电极的底表面连接到连接层，第二开口穿过半导体层主体部分和埋设 氧化膜，第二开口到达连接层的表面部分。

公开(公告)号：US07986000B2

公开(公告)日：2011-07-26

申请号：US12564349

申请日：2009-09-22

申请人： Makoto Mizukami ,  Kiyohito Nishihara ,  Masaki Kondo ,  Takashi Izumida ,  Hirokazu Ishida ,  Atsushi Fukumoto ,  Fumiki Aiso ,  Daigo Ichinose ,  Tadashi Iguchi

发明人： Makoto Mizukami ,  Kiyohito Nishihara ,  Masaki Kondo ,  Takashi Izumida ,  Hirokazu Ishida ,  Atsushi Fukumoto ,  Fumiki Aiso ,  Daigo Ichinose ,  Tadashi Iguchi

IPC分类号： H01L29/76 ,  H01L21/00 ,  H01L21/84

CPC分类号： H01L27/1203 ,  H01L21/84 ,  H01L27/11521 ,  H01L27/11524

摘要： A semiconductor device is formed on a SOI substrate having a semiconductor substrate, a buried oxide film formed on the semiconductor substrate, and a semiconductor layer formed on the buried oxide film, the semiconductor substrate having a first conductive type, the semiconductor layer having a second conductive type, wherein the buried oxide film has a first opening opened therethrough for communicating the semiconductor substrate with the semiconductor layer, the semiconductor layer is arranged to have a first buried portion buried in the first opening in contact with the semiconductor substrate and a semiconductor layer main portion positioned on the first buried portion and on the buried oxide film, the semiconductor substrate has a connection layer buried in a surface of the semiconductor substrate and electrically connected to the first buried portion in the first opening, the connection layer having the second conductive type, and the semiconductor device includes a contact electrode buried in a second opening, a side surface of the contact electrode being connected to the semiconductor layer main portion, a bottom surface of the contact electrode being connected to the connection layer, the second opening passing through the semiconductor layer main portion and the buried oxide film, and the second opening reaching a surface portion of the connection layer.

摘要翻译： 半导体器件形成在具有半导体衬底的SOI衬底上，形成在半导体衬底上的掩埋氧化膜以及形成在掩埋氧化膜上的半导体层，该半导体衬底具有第一导电类型，该半导体层具有第二导电型 导电型，其中所述掩埋氧化物膜具有通过其开口的第一开口，用于使所述半导体衬底与所述半导体层连通，所述半导体层被布置为具有埋在所述第一开口中的与所述半导体衬底接触的第一掩埋部分和半导体层 主要部分位于第一掩埋部分和掩埋氧化膜上，半导体衬底具有埋在半导体衬底的表面中并与第一开口中的第一掩埋部分电连接的连接层，连接层具有第二导电 类型，并且半导体器件包括接触电极 阴极埋入第二开口中，接触电极的侧表面连接到半导体层主体部分，接触电极的底表面连接到连接层，第二开口穿过半导体层主体部分和埋设 氧化膜，第二开口到达连接层的表面部分。

公开(公告)号：US08415242B2

公开(公告)日：2013-04-09

申请号：US12886135

申请日：2010-09-20

申请人： Ichiro Mizushima ,  Shinji Mori ,  Yoshiaki Fukuzumi ,  Fumiki Aiso

发明人： Ichiro Mizushima ,  Shinji Mori ,  Yoshiaki Fukuzumi ,  Fumiki Aiso

IPC分类号： H01L21/3205

CPC分类号： H01L29/792 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/66833 ,  H01L29/7926

摘要： According to one embodiment, a nonvolatile semiconductor memory device is provided in which memory strings, which are formed by providing a plurality of transistors having gate electrode films on sides of columnar semiconductor films in a height direction of the columnar semiconductor films via charge storage layers, are substantially perpendicularly arranged in a matrix shape on a substrate. A coupling section made of a semiconductor material that connects lower portions of the columnar semiconductor films forming a pair of the memory strings adjacent to each other in a predetermined direction is provided. Each of the columnar semiconductor films is formed of a generally single-crystal-like germanium film or silicon germanium film.

公开(公告)号：US20110233646A1

公开(公告)日：2011-09-29

申请号：US12886135

申请日：2010-09-20

申请人： Ichiro MIZUSHIMA ,  Shinji Mori ,  Yoshiaki Fukuzumi ,  Fumiki Aiso

发明人： Ichiro MIZUSHIMA ,  Shinji Mori ,  Yoshiaki Fukuzumi ,  Fumiki Aiso

IPC分类号： H01L29/792 ,  H01L21/336

CPC分类号： H01L29/792 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/66833 ,  H01L29/7926

摘要： According to one embodiment, a nonvolatile semiconductor memory device is provided in which memory strings, which are formed by providing a plurality of transistors having gate electrode films on sides of columnar semiconductor films in a height direction of the columnar semiconductor films via charge storage layers, are substantially perpendicularly arranged in a matrix shape on a substrate. A coupling section made of a semiconductor material that connects lower portions of the columnar semiconductor films forming a pair of the memory strings adjacent to each other in a predetermined direction is provided. Each of the columnar semiconductor films is formed of a generally single-crystal-like germanium film or silicon germanium film.

摘要翻译： 根据一个实施例，提供了一种非易失性半导体存储器件，其中通过在柱状半导体膜的高度方向上经由电荷存储层提供在柱状半导体膜的侧面上具有栅电极膜的多个晶体管形成的存储器串， 基本上垂直地以矩阵形式布置在基底上。 提供了一种由半导体材料制成的耦合部分，其连接形成在预定方向上彼此相邻的一对存储器串的柱状半导体膜的下部。 每个柱状半导体膜由大致单晶状锗膜或硅锗膜形成。