公开(公告)号：US5997704A

公开(公告)日：1999-12-07

申请号：US962678

申请日：1997-11-03

申请人： Ichirou Shiono ,  Kazuo Watanabe ,  Hitoshi Maruyama ,  Akifumi Mishima ,  Satoru Mori ,  Jun-ichi Oda

发明人： Ichirou Shiono ,  Kazuo Watanabe ,  Hitoshi Maruyama ,  Akifumi Mishima ,  Satoru Mori ,  Jun-ichi Oda

IPC分类号： C01G23/00 ,  B24B7/19 ,  C04B41/91 ,  C23C14/08 ,  C23C14/34 ,  H01B3/12 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/04 ,  H01L27/108 ,  C23C14/00 ,  B24B1/00 ,  B24B7/30

CPC分类号： H01J37/3426 ,  B24B7/19 ,  C23C14/3414 ,  H01J37/3491

摘要： The present invention provides sputtering targets which are useful for depositing ferroelectric films and are resistant to crack generation during sputtering. The sputtering targets comprise a disk target which is formed using a sintered material including a compound oxide of Ba and Ti, Sr and Ti, or Ba, Sr and Ti, and which has a surface which has been subjected to grinding, wherein the scratches 4 formed on the surface of the disk target due to grinding have a pattern radiating from an arbitrary point on the plane of the surface of said disk target.

摘要翻译： 本发明提供了可用于沉积铁电体膜并且在溅射期间耐裂纹产生的溅射靶。 溅射靶包括使用包含Ba和Ti，Sr和Ti或Ba，Sr和Ti的复合氧化物的烧结材料形成的圆盘靶，并且具有经过研磨的表面，其中划痕4 由于磨削而形成在盘对象的表面上的图案具有从所述盘片的表面的平面上的任意点辐射的图案。