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    HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
    1.
    发明申请
    HEAT-CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF 有权
    导热硅胶组合物及其固化产品

    公开(公告)号：US20080057325A1

    公开(公告)日：2008-03-06

    申请号：US11846862

    申请日：2007-08-29

    申请人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

    发明人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

    IPC分类号： C08G77/12

    CPC分类号： C09J183/04 ,  C08G77/045 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K5/56 ,  C08L83/00 ,  Y10T428/31663

    摘要： Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.

    摘要翻译： 提供一种导热性有机硅组合物，其包含：（A）100体积份的具有特定结构的有机聚硅氧烷，（B）0.1〜50体积份作为润湿剂的有机硅化合物，并且含有三有机氧基甲硅烷基键合 通过可以被支链的亚烷基连接到一个末端，（C）100-2,500体积份的导热填料，和（D）有效量的固化剂。 还提供了通过固化该组合物获得的导热硅氧烷固化产物。 即使填充有大量导热填料以提供优异的导热性，导热硅氧烷组合物的粘度或塑性的增加也最小，并保持良好的操作性和成型性。 即使填充有大量的导热性填料，导热性硅酮固化物也具有优异的柔软性。 由发热电子部件产生的热可以通过将固化物夹在发热电子部件和散热部件之间而散发到散热部件中。

    Heat-conductive silicone composition and cured product thereof
    2.
    发明授权
    Heat-conductive silicone composition and cured product thereof 有权
    导热硅氧烷组合物及其固化产物

    公开(公告)号：US08119758B2

    公开(公告)日：2012-02-21

    申请号：US11846862

    申请日：2007-08-29

    申请人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

    发明人： Ikuo Sakurai ,  Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada

    IPC分类号： C08G77/12 ,  C08L83/04 ,  C08K3/00 ,  C08K5/541 ,  C08K5/5419

    CPC分类号： C09J183/04 ,  C08G77/045 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K5/56 ,  C08L83/00 ,  Y10T428/31663

    摘要： Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.

    摘要翻译： 提供一种导热性有机硅组合物，其包含：（A）100体积份的具有特定结构的有机聚硅氧烷，（B）0.1〜50体积份作为润湿剂的有机硅化合物，并且含有三有机氧基甲硅烷基键合 通过可以被支链的亚烷基连接到一个末端，（C）100-2,500体积份的导热填料，和（D）有效量的固化剂。 还提供了通过固化该组合物获得的导热硅氧烷固化产物。 即使填充有大量导热填料以提供优异的导热性，导热硅氧烷组合物的粘度或塑性的增加也最小，并保持良好的操作性和成型性。 即使填充有大量的导热性填料，导热性硅酮固化物也具有优异的柔软性。 由发热电子部件产生的热可以通过将固化物夹在发热电子部件和散热部件之间而散发到散热部件中。

    ORGANOSILICON COMPOUND
    5.
    发明申请
    ORGANOSILICON COMPOUND 审中-公开
    有机硅化合物

    公开(公告)号：US20070290202A1

    公开(公告)日：2007-12-20

    申请号：US11763782

    申请日：2007-06-15

    申请人： Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada ,  Toshiyuki Ozai

    发明人： Nobuaki Matsumoto ,  Kei Miyoshi ,  Kunihiro Yamada ,  Toshiyuki Ozai

    IPC分类号： H01L29/08

    CPC分类号： C07F7/1804

    摘要： Provided is a novel organosilicon compound which functions as a silane coupling agent (wetter) that enables a silicone to be filled with a large quantity of a filler.The organosilicon compound is represented by a general formula (1) wherein, R1 represents a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, R2 to R4 represent identical or different unsubstituted or substituted monovalent hydrocarbon groups, each R5 represents, independently, a hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, each R6 represents, independently, an identical or different unsubstituted or substituted monovalent organic group, m represents an integer from 0 to 4, and n represents an integer from 2 to 20; as well as a method of producing the above organosilicon compound, wherein a one end organohydrogensilyl-terminated organopolysiloxane is produced by reacting an organohydrogensiloxane with a vinylsilane or an alkenyltriorganooxysilane in the presence of a hydrosilylation catalyst, and optionally this one end organohydrogensilyl-terminated organopolysiloxane is then reacted with an alkene in the presence of a hydrosilylation catalyst.

    摘要翻译： 提供了一种新型的有机硅化合物，其作为使硅氧烷填充有大量填料的硅烷偶联剂（润湿剂）起作用。 有机硅化合物由通式（1）表示，其中R 1表示氢原子，或未取代或取代的一价烃基，R 2至R 0 表示相同或不同的未取代或取代的单价烃基，每个R 5独立地表示氢原子或未取代或取代的一价烃基，每个R 6 独立地表示相同或不同的未取代或取代的一价有机基团，m表示0至4的整数，n表示2至20的整数; 以及制备上述有机硅化合物的方法，其中通过在氢化硅烷化催化剂存在下使有机氢硅氧烷与乙烯基硅烷或烯基三有机氧基硅烷反应制备一端有机氢甲硅烷基封端的有机基聚硅氧烷，任选地，该一端有机氢甲硅烷基封端的有机聚硅氧烷是 然后在氢化硅烷化催化剂存在下与烯烃反应。

    Heat-conductive silicone grease composition
    6.
    发明授权
    Heat-conductive silicone grease composition 有权
    导热硅脂组合物

    公开(公告)号：US08754165B2

    公开(公告)日：2014-06-17

    申请号：US13084641

    申请日：2011-04-12

    申请人： Nobuaki Matsumoto ,  Ikuo Sakurai ,  Kunihiro Yamada ,  Masaya Ueno

    发明人： Nobuaki Matsumoto ,  Ikuo Sakurai ,  Kunihiro Yamada ,  Masaya Ueno

    IPC分类号： C08K3/22 ,  C08K3/08

    CPC分类号： C08L83/04 ,  C08G77/18 ,  C08L83/00

    摘要： A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.

    摘要翻译： 提供一种导热性硅氧烷润滑脂组合物，其包含（A）在25℃下粘度为0.1-1,000Pa·s的三烷氧基甲硅烷基封端的有机聚硅氧烷，（B）特定有机聚硅氧烷，（C）导热填料， 和（D）缩合催化剂。 该组合物最初可以涂覆，然后在室温下用水分增加其粘度，而不是固化，使其保持柔软性，易于重新加工和防流挂，消除了对冷藏和热应用的需要， 避免任何不希望的粘度累积，易于制造，并具有良好的热传递。

    Thermally conductive silicone grease composition
    7.
    发明授权
    Thermally conductive silicone grease composition 有权
    导热硅油组合物

    公开(公告)号：US08383005B2

    公开(公告)日：2013-02-26

    申请号：US13282797

    申请日：2011-10-27

    申请人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    发明人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    IPC分类号： C09K5/10 ,  C08G77/04 ,  C08G77/12 ,  C08G77/20

    CPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08L83/04

    摘要： A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

    摘要翻译： 一种导热硅脂组合物，其包含：（A）在一个分子中具有至少两个烯基的有机聚硅氧烷，其在25℃下的动力学粘度为5,000至100,000mm 2 / s; （B）在一端具有三官能终止并由以下通式（2）表示的可水解甲基聚硅氧烷：其中R2表示碳原子数1〜6的烷基，b为5〜100的整数。 （C）具有至少10W / m·℃的导热率的导热填料; （D）在一个直接与硅原子结合的分子（Si-H基）中含有2至5个氢原子的有机氢聚硅氧烷; （E）在一个分子中具有三嗪环和至少一个烯基的键合助剂; 和（F）选自铂和铂化合物的催化剂。

    THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION
    9.
    发明申请
    THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION 有权
    导热硅脂润滑脂组合物

    公开(公告)号：US20120119137A1

    公开(公告)日：2012-05-17

    申请号：US13282797

    申请日：2011-10-27

    申请人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    发明人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    IPC分类号： C09K5/10

    CPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08L83/04

    摘要： A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

    摘要翻译： 一种导热硅脂组合物，其包含：（A）在一个分子中具有至少两个烯基的有机聚硅氧烷，其在25℃下的动力学粘度为5,000至100,000mm 2 / s; （B）在一端具有三官能终止并由以下通式（2）表示的可水解甲基聚硅氧烷：其中R2表示碳原子数1〜6的烷基，b为5〜100的整数。 （C）具有至少10W / m·℃的导热率的导热填料; （D）在一个直接与硅原子结合的分子（Si-H基）中含有2至5个氢原子的有机氢聚硅氧烷; （E）在一个分子中具有三嗪环和至少一个烯基的键合助剂; 和（F）选自铂和铂化合物的催化剂。