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    Thermally conductive silicone grease composition
    1.
    发明授权
    Thermally conductive silicone grease composition 有权
    导热硅油组合物

    公开(公告)号：US08383005B2

    公开(公告)日：2013-02-26

    申请号：US13282797

    申请日：2011-10-27

    申请人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    发明人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    IPC分类号： C09K5/10 ,  C08G77/04 ,  C08G77/12 ,  C08G77/20

    CPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08L83/04

    摘要： A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

    摘要翻译： 一种导热硅脂组合物，其包含：（A）在一个分子中具有至少两个烯基的有机聚硅氧烷，其在25℃下的动力学粘度为5,000至100,000mm 2 / s; （B）在一端具有三官能终止并由以下通式（2）表示的可水解甲基聚硅氧烷：其中R2表示碳原子数1〜6的烷基，b为5〜100的整数。 （C）具有至少10W / m·℃的导热率的导热填料; （D）在一个直接与硅原子结合的分子（Si-H基）中含有2至5个氢原子的有机氢聚硅氧烷; （E）在一个分子中具有三嗪环和至少一个烯基的键合助剂; 和（F）选自铂和铂化合物的催化剂。

    Molybdenum disilicide ceramic composite infrared radiation source or heating source
    2.
    发明授权
    Molybdenum disilicide ceramic composite infrared radiation source or heating source 失效
    二硅化钼陶瓷复合红外辐射源或加热源

    公开(公告)号：US6008479A

    公开(公告)日：1999-12-28

    申请号：US938966

    申请日：1997-09-26

    申请人： Wan Jiang ,  Kenichi Tsuji ,  Tetsuo Uchiyama ,  Mutsumi Nagumo ,  Satoru Sakaue ,  Masahiro Uno

    发明人： Wan Jiang ,  Kenichi Tsuji ,  Tetsuo Uchiyama ,  Mutsumi Nagumo ,  Satoru Sakaue ,  Masahiro Uno

    IPC分类号： G01J3/10 ,  C04B35/58 ,  H01K1/04 ,  H05B3/00 ,  H05B3/10 ,  H05B3/14

    CPC分类号： H05B3/148 ,  H01K1/04 ,  H05B3/0038 ,  H05B3/141 ,  H05B2203/032

    摘要： In an infrared radiation source containing hot-pressed molybdenum disilicide reinforced with silicon carbide whiskers as the illuminant thereof, terminal portions of the illuminant having a protective dense silica film of 5 to 20 .mu.m in thickness formed on the surface thereof which portions are to be heated at a temperature of 400 to 800.degree. C. are either set to have a current density of at most 12 A/mm.sup.2 or disposed in dry air having a relative humidity at 25.degree. C. of at most 30% (absolute humidity: 0.00588). As a result, the low-temperature oxidation phenomenon that would otherwise be developed in the terminal portions of the illuminant is suppressed. Thus, there can be obtained an infrared radiation source containing an illuminant made of molybdenum disilicide reinforced with silicon carbide whiskers and having a long serviceable life span.

    摘要翻译： 在含有用碳化硅晶须作为发光体加强的热压二硅化钼的红外线辐射源中，发光体的端部具有形成在其表面上的部分的厚度为5〜20μm的保护性致密二氧化硅膜， 在400〜800℃的温度下加热至电流密度至多为12A / mm2，或者设置在相对湿度25℃的干燥空气中至多30％（绝对湿度：0.00588 ）。 结果，抑制了在发光体的末端部分产生的低温氧化现象。 因此，可以获得含有由碳化硅晶须增强的二硅化钼制成的发光体并具有长使用寿命的红外线辐射源。

    HEAT-CONDUCTIVE SILICONE COMPOSITION
    3.
    发明申请
    HEAT-CONDUCTIVE SILICONE COMPOSITION 审中-公开
    导热硅胶组合物

    公开(公告)号：US20130105726A1

    公开(公告)日：2013-05-02

    申请号：US13606061

    申请日：2012-09-07

    申请人： Kenichi TSUJI ,  Kunihiro Yamada

    发明人： Kenichi TSUJI ,  Kunihiro Yamada

    IPC分类号： C09K5/16

    CPC分类号： C08K3/08 ,  C08G77/12 ,  C08G77/20 ,  C08K5/0025 ,  C08K5/5419 ,  C08K5/5425 ,  C08K5/56 ,  C08K13/02 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08L83/04 ,  C09D183/04 ,  C08L83/00

    摘要： A heat-conductive silicone composition that exhibits reduced thermal contact resistance, while also maintaining high overall thermal conductivity. Specifically, a heat-conductive silicone composition comprising silver particles that undergo an exothermic reaction at a temperature of 260° C. or lower. One embodiment of the composition comprises (A) an organopolysiloxane comprising at least two alkenyl groups within each molecule, and having a kinematic viscosity at 25° C. of 10 to 100,000 mm2/s, (B) an organohydrogenpolysiloxane comprising at least two hydrogen atoms bonded to silicon atoms within each molecule, (C) a platinum-based hydrosilylation reaction catalyst, (D) a reaction retarder, (E) silver particles that undergo an exothermic reaction at a temperature of 260° C. or lower, and (F) a heat-conductive filler, other than the component (E), having a thermal conductivity of at least 10 W/m° C.

    摘要翻译： 具有降低的热接触电阻的导热硅氧烷组合物，同时还保持高的整体导热性。 具体地说，包括在260℃以下的温度下进行放热反应的银粒子的导热性有机硅组合物。 组合物的一个实施方案包括（A）在每个分子内包含至少两个烯基的有机聚硅氧烷，并且在25℃下的运动粘度为10至100,000mm 2 / s，（B）包含至少两个氢原子的有机氢聚硅氧烷 （C）铂系氢化硅烷化反应催化剂，（D）反应延迟剂，（E）在260℃以下的温度下发生放热反应的银粒子，（F ）除了组分（E）之外的具有至少10W / m℃的热导率的导热填料。

    THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION
    4.
    发明申请
    THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION 有权
    导热硅脂润滑脂组合物

    公开(公告)号：US20120119137A1

    公开(公告)日：2012-05-17

    申请号：US13282797

    申请日：2011-10-27

    申请人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    发明人： Kenichi Tsuji ,  Kunihiro Yamada ,  Hiroaki Kizaki ,  Nobuaki Matsumoto

    IPC分类号： C09K5/10

    CPC分类号： C09K5/14 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08L83/04

    摘要： A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.

    摘要翻译： 一种导热硅脂组合物，其包含：（A）在一个分子中具有至少两个烯基的有机聚硅氧烷，其在25℃下的动力学粘度为5,000至100,000mm 2 / s; （B）在一端具有三官能终止并由以下通式（2）表示的可水解甲基聚硅氧烷：其中R2表示碳原子数1〜6的烷基，b为5〜100的整数。 （C）具有至少10W / m·℃的导热率的导热填料; （D）在一个直接与硅原子结合的分子（Si-H基）中含有2至5个氢原子的有机氢聚硅氧烷; （E）在一个分子中具有三嗪环和至少一个烯基的键合助剂; 和（F）选自铂和铂化合物的催化剂。

    Advanced liquid cooling apparatus
    8.
    发明授权
    Advanced liquid cooling apparatus 有权
    先进的液体冷却装置

    公开(公告)号：US6158232A

    公开(公告)日：2000-12-12

    申请号：US266220

    申请日：1999-03-10

    申请人： Kenichi Tsuji ,  Yoshihito Kikuchi ,  Naoto Mizuguchi

    发明人： Kenichi Tsuji ,  Yoshihito Kikuchi ,  Naoto Mizuguchi

    IPC分类号： H01L23/473 ,  H05K7/20 ,  F25D23/12

    CPC分类号： H01L23/473 ,  H01L2924/0002

    摘要： An advanced liquid cooling system with an advanced cooling characteristic and high reliability, which is small in size and light in weight, is provided. In the liquid cooling system, heating units 2, which are semiconductors, are fixed on a base having high thermal conductivity. A liquid-passage hole 7 in the base 5 allows a liquid refrigerant 6 to pass through. Since the base 5 is made of material with high thermal conductivity, and the liquid-passage hole 7 extends in the vicinity of the heating unit 2 in the base, it is sufficient to transfer the heat of heating unit 2 the liquid refrigerant 6. This enables control of the temperature rise of the heating unit to be maintained low.

    摘要翻译： 提供了具有先进的冷却特性和高可靠性的先进的液体冷却系统，体积小，重量轻。 在液体冷却系统中，作为半导体的加热单元2固定在具有高导热性的基底上。 底座5中的液体通道孔7允许液体制冷剂6通过。 由于基座5由具有高导热性的材料制成，并且液体通道孔7在基座中的加热单元2附近延伸，所以足以将加热单元2的热量传送到液体制冷剂6。 能够将加热单元的温度上升控制为低。