公开(公告)号：US5660318A

公开(公告)日：1997-08-26

申请号：US509232

申请日：1995-07-31

申请人： Il Gyu Jung ,  Tae Gyeong Chung ,  Tae Koo Lee

发明人： Il Gyu Jung ,  Tae Gyeong Chung ,  Tae Koo Lee

IPC分类号： H01L21/60 ,  B23K20/02 ,  H01L21/603 ,  H01L21/58

CPC分类号： H01L24/80 ,  B23K20/023 ,  B23K2201/38 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14

摘要： An inner lead bonding apparatus having a heat dissipation plate attached to inner leads and to a support for upholding a lead frame of a tape automated bonding package. The heat dissipation plate is, during performance of an inner lead bonding process, located near the bonding interface of bumps formed on a semiconductor chip or on the inner leads and the inner leads, and includes a fastener for fixing itself to the support and elliptical bolt holes for enabling its contact position to the inner leads to be controllable.

摘要翻译： 一种内引线接合装置，其具有附接到内引线的散热板和用于支撑带自动接合封装的引线框的支撑。 在内引线接合工艺执行期间，散热板位于形成在半导体芯片或内引线和内引线上的凸点的接合界面附近，并且包括用于将自身固定到支撑件和椭圆螺栓 使得其与内部引线的接触位置能够被控制的孔。

公开(公告)号：US06326686B1

公开(公告)日：2001-12-04

申请号：US09144510

申请日：1998-08-31

申请人： Joong Hyun Baek ,  Il Gyu Jung ,  Tae Koo Lee ,  Chang Ho Cho

发明人： Joong Hyun Baek ,  Il Gyu Jung ,  Tae Koo Lee ,  Chang Ho Cho

IPC分类号： H01L2334

CPC分类号： H01L23/36 ,  H01L23/13 ,  H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094

摘要： The present invention provides a vertical semiconductor device package comprising a semiconductor chip, a heat spreader, a printed circuit board(PCB), a plurality of metal wires, and an encapsulating material. The semiconductor chip is directly attached to the heat spreader, and/or the heat spreader is directly attached to the metal layers in the PCB, which has multiple ground metal layers. A package module has a plurality of the vertical semiconductor device packages, which are vertically mounted on a second circuit board, and a heat sink, which is attached to each heat spreader. The present invention has advantages in that it enhances the heat dissipation properties and the electrical characteristics of the packages.

摘要翻译： 本发明提供了一种垂直半导体器件封装，其包括半导体芯片，散热器，印刷电路板（PCB），多个金属线以及封装材料。 半导体芯片直接连接到散热器上，和/或散热器直接连接到具有多个接地金属层的PCB​​中的金属层。 封装模块具有垂直安装在第二电路板上的多个垂直半导体器件封装和附接到每个散热器的散热器。 本发明的优点在于其增强了包装的散热特性和电特性。