摘要:
A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).
摘要:
A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A heat block contacts the front face for transferring generated heat from the electronic component to the working fluid to vaporize the working fluid. A condenser is in fluid communication with the chamber and connected to the rear face for condensing the vaporized working fluid back to a liquid. The assembly further includes an acute angle between the front face and the peripheral wall such that the chamber extends upwardly at an angle from the front face to the rear face to ensure complete coverage of the heat block with the cooling fluid in any position between horizontal and vertical.
摘要:
A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.
摘要:
A thermosiphon for cooling an electronic device having a mean width of dimension “b” comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electronic device to be cooled. A plurality of spaced apart condenser tubes is mounted above the boilerplate such that the boilerplate and the condenser tubes define a vapor chamber therebetween for receiving a working fluid therein. A plurality of convoluted fins extends between each adjacent pair of condenser tubes.
摘要:
An evaporative heat exchanger for cooling a hot refrigerant having a core of alternatively stacked dry and wet plates. Each dry plate includes a dry side defining a plurality of dry channels in a first direction, a series of ports distributed along the dry channels, a wet side, and a refrigerant cooling section. Each wet plate includes a wet side adjacent to and cooperates with the wet side of the dry plate to define a plurality of wet channels in a second direction. The dry channels, ports, and wet channels define a labyrinth for the air flow, which evaporates the liquid contained in the wet channels resulting in a cooling of the refrigerant. The refrigerant cooling section is integral with the outboard of the dry plate and adjacent to an end section of the wet channels to provide enhanced refrigerant cooling.
摘要:
A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element.
摘要:
A hermetically sealed housing includes a plurality of inner walls extending radially from a central post to a circular outer wall, thereby defining a plurality of pie shaped chambers, each independently containing a refrigerant. At least one of the chambers is always in position to remove heat from an electronic device regardless of the orientation of the heat exchanger assembly. A plurality of side fins are disposed on the outer wall of the housing, and a plurality of top fins extend radially from a central axis (A) and are disposed on top of the housing. A wicking material is disposed on the interior of each chamber. A fan assembly is disposed on top of the top fins to blow air radially down into the fins.
摘要:
An integrated liquid cooling unit comprising a liquid pump and a U-shaped flat tube. An adapter rigidly connects and establishes fluid communication between the pump and the tube creating an integrated unit for cooling an electronic chip via a closed loop. Heat is rejected from the coolant through cooling fins disposed between the legs of the U-shaped tube to passing air being propelled by a blower assembly.
摘要:
A heat exchanger having a plurality of tubes that define refrigerant passages extending vertically from a lower end to an upper end. A bottom header is in fluid communication with the passage at the lower end of the tube, and a top header is in fluid communication with the passage at the upper end of the tube. A plurality of plates extends rearwardly from the tubes to a distal edge. Adjacent plates extending from adjacent tubes are closed off at the distal edges by a connector, and adjacent plates extending from the same tube have a rear opening between the distal edges for receiving air into the assembly. A plurality of orifices is disposed along the plates to allow air from the rear opening to flow downstream between the tubes. A water tank and wicking material are provided for wetting the plates.
摘要:
A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.