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公开(公告)号：US12220727B2
公开(公告)日：2025-02-11
申请号：US17438705
申请日：2020-03-12
Applicant: IMEC VZW , KATHOLIEKE UNIVERSITEIT LEUVEN
Inventor： David Cheyns , Yongbin Jeong , Xavier Rottenberg
Abstract: The present invention provides a flexible ultrasound transducer (1) for an ultrasound monitoring system for examining a curved object. The ultrasound transducer (1) comprises an integrated circuit structure (7) and a multi-layered structure (2), said multi-layered structure (2) comprising an array (3) of ultrasound transducing elements (3a) arranged in a first layer structure (4) and configured for generating ultrasonic energy propagating along a main transducer axis Z and an array (5) of control circuits (5a) arranged in a second layer structure (6), and wherein the array (5) of control circuits and the integrated circuit structure (7) are configured for operating the array (3) of ultrasound transducing elements in said first layer structure (4), Further, the multi-layered structure (2) comprises at least one flexible layer (8, 9) arranged so that the bending flexibility of the multi-layered structure (2) permits the ultrasound transducer (1) to form a continuous contact with said curved object during operation.
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公开(公告)号：US20210199211A1
公开(公告)日：2021-07-01
申请号：US17135192
申请日：2020-12-28
Applicant: IMEC VZW
Inventor： Lei Zhang , Tim Stakenborg , Chengxun Liu , David Cheyns
IPC: F16K31/128 , F16K7/12 , F16K11/24 , F16K31/00 , F16K7/10
Abstract: Example embodiments relate to microfluidic devices for controlling pneumatic microvalves. One embodiment includes a microfluidic device for independently controlling a plurality of pneumatic microvalves. The microfluidic device is couplable to a pressure source. The microfluidic device includes a first substrate. The microfluidic device also includes a flexible membrane covering the first substrate. Additionally, the microfluidic device includes a second substrate covering the flexible membrane. Further, the microfluidic device includes one or more fluidic channels at least partially defined in the first substrate. In addition, the microfluidic device includes a pressure couplable to the pressure source and branching into a plurality of pressure channels. Still further, the microfluidic device includes at least one pressure control switch per pressure channel.
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公开(公告)号：US12194497B2
公开(公告)日：2025-01-14
申请号：US18589696
申请日：2024-02-28
Applicant: IMEC VZW , Katholieke Universiteit Leuven
Inventor： David Cheyns , Yongbin Jeong , Xavier Rottenberg
Abstract: The present invention provides a flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object. The ultrasound transducer comprises an integrated circuit structure and a multi-layered structure, said multi-layered structure comprising an array of ultrasound transducing elements arranged in a first layer structure and configured for generating ultrasonic energy propagating along a main transducer axis Z and an array of control circuits arranged in a second layer structure, and wherein the array of control circuits and the integrated circuit structure are configured for operating the array of ultrasound transducing elements in said first layer structure, Further, the multi-layered structure comprises at least one flexible layer arranged so that the bending flexibility of the multi-layered structure permits the ultrasound transducer to form a continuous contact with said curved object during operation.
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公开(公告)号：US20240139774A1
公开(公告)日：2024-05-02
申请号：US18488772
申请日：2023-10-17
Applicant: IMEC VZW
Inventor： David Cheyns , Yongbin Jeong
CPC classification number: B06B1/0622 , H10N39/00 , A61B8/4483
Abstract: A method is provided for producing an ultrasound transducer for an ultrasound system. The method includes: 1) forming a first layer structure, comprising: (a) forming a frontplane flexible layer above a first substrate; (b) forming an array of ultrasound transducer elements; and 2) providing a second layer structure comprising at least a backplane layer; wherein 1) and/or 2) comprises: 1) (c) forming a first cavity defining layer above the array of ultrasound transducer elements and/or 2) (a) forming a second cavity defining layer above the backplane layer; and defining an array of cavities in the first and/or second cavity defining layer; 3) attaching by adhesive bonding the first layer structure to the second layer structure with the array of ultrasound transducer elements between the frontplane flexible layer and the backplane layer; and 4) removing the first substrate.
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公开(公告)号：US11757056B2
公开(公告)日：2023-09-12
申请号：US17081829
申请日：2020-10-27
Applicant: IMEC vzw , Katholieke Universiteit Leuven
Inventor： Yunlong Li , Epimitheas Georgitzikis , David Cheyns
IPC: H01L31/0392 , H01L27/146 , H01L31/0232 , H01L31/0224
CPC classification number: H01L31/0392 , H01L27/14634 , H01L31/02327 , H01L31/022408
Abstract: An aspect comprising an optical sensor is disclosed. The optical sensor comprises stacked layers comprising: a window layer configured to allow the passage of photons; a sensing layer configured to generate charges upon impinging of the photons through the window layer; and a bottom electrode layer comprising at least one bottom electrode for receiving charges generated in the sensing layer. The sensing layer is sandwiched between the window layer and the bottom electrode layer. The at least one bottom electrode of the bottom electrode layer comprises conductive material with reflectivity higher than 0.7 to reflect back received photons into the sensing layer; and the at least one bottom electrode is obtained by semiconductor device fabrication techniques.
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Patent Agency Ranking
公开(公告)号：US20220396067A1
公开(公告)日：2022-12-15
申请号：US17834413
申请日：2022-06-07
Applicant: IMEC VZW , Katholieke Universiteit Leuven, KU LEUVEN R&D
Inventor： Boshen Liang , Dominika Wysocka , David Cheyns
Abstract: The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.
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公开(公告)号：US20220140276A1
公开(公告)日：2022-05-05
申请号：US17502708
申请日：2021-10-15
Applicant: Imec vzw
Inventor： Tung Huei Ke , David Cheyns , Pawel Malinowski
Abstract: A semiconductor device comprises a substrate, a first hole-transporting layer over the substrate, a first electron-transporting layer on the first hole-transporting layer, and a second hole-transporting layer over the first electron-transporting layer. At least one of the first electron-transporting layer and the second hole-transporting layer has an organic component. The device is characterized by one of the following: a metal oxide layer present on the first electron-transporting layer, wherein a second electron-transporting layer is on the metal oxide layer, wherein the second hole-transporting layer is on the second electron-transporting layer, or the second hole transporting layer has a first p-doped hole-transporting surface present on the first electron-transporting, layer and a second p-doped hole-transporting surface facing away from the first p-doped hole-transporting surface, or the first electron-transporting layer is on a top surface and on sidewalls of the first hole-transporting layer.
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公开(公告)号：US12214580B2
公开(公告)日：2025-02-04
申请号：US17834413
申请日：2022-06-07
Applicant: IMEC VZW , Katholieke Universiteit Leuven, KU LEUVEN R&D
Inventor： Boshen Liang , Dominika Wysocka , David Cheyns
Abstract: The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.
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公开(公告)号：US11313489B2
公开(公告)日：2022-04-26
申请号：US17135192
申请日：2020-12-28
Applicant: IMEC VZW
Inventor： Lei Zhang , Tim Stakenborg , Chengxun Liu , David Cheyns
IPC: F16K31/128 , F16K7/10 , F16K7/12 , F16K31/00 , F16K11/24
Abstract: Example embodiments relate to microfluidic devices for controlling pneumatic microvalves. One embodiment includes a microfluidic device for independently controlling a plurality of pneumatic microvalves. The microfluidic device is couplable to a pressure source. The microfluidic device includes a first substrate. The microfluidic device also includes a flexible membrane covering the first substrate. Additionally, the microfluidic device includes a second substrate covering the flexible membrane. Further, the microfluidic device includes one or more fluidic channels at least partially defined in the first substrate. In addition, the microfluidic device includes a pressure couplable to the pressure source and branching into a plurality of pressure channels. Still further, the microfluidic device includes at least one pressure control switch per pressure channel.
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公开(公告)号：US20210134886A1
公开(公告)日：2021-05-06
申请号：US17081829
申请日：2020-10-27
Applicant: IMEC vzw , Katholieke Universiteit Leuven
Inventor： Yunlong Li , Epimitheas Georgitzikis , David Cheyns
Abstract: An aspect comprising an optical sensor is disclosed. The optical sensor comprises stacked layers comprising: a window layer configured to allow the passage of photons; a sensing layer configured to generate charges upon impinging of the photons through the window layer; and a bottom electrode layer comprising at least one bottom electrode for receiving charges generated in the sensing layer. The sensing layer is sandwiched between the window layer and the bottom electrode layer. The at least one bottom electrode of the bottom electrode layer comprises conductive material with reflectivity higher than 0.7 to reflect back received photons into the sensing layer; and the at least one bottom electrode is obtained by semiconductor device fabrication techniques.
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