摘要:
A metal oxide semiconductor field effect transistor (MOSFET) with source side punch-through protection implant. Specifically, the MOSFET comprises a semiconductor substrate, a gate stack formed above the semiconductor substrate, source and drain regions, and a protection implant. The semiconductor substrate comprises a first p-type doping concentration. The source and drain regions comprise an n-type doping concentration, and are formed on opposing sides of the gate stack in the semiconductor substrate. The protection implant comprises a second p-type doping concentration, and is formed in the semiconductor substrate under the source region and surrounds the source region in order to protect the source region from the depletion region corresponding to the drain region.
摘要:
A flash memory cell of the present invention comprises a floating gate, having a charge trapping region and a fin region. A source region and a drain region is formed proximate the floating gate. A control gate is formed above the charge trapping region of the floating gate. The fin region advantageously reduces leakage current, thereby allowing further scaling of the cell.
摘要:
A flash memory cell and a method of forming the same are described. The flash memory cell may include a substrate having a source and a drain, a gate element, and a dielectric layer between the substrate and the gate element. The dielectric layer includes a dielectric material having a dielectric constant that is greater than that of silicon dioxide.
摘要:
A bit line selector for a virtual ground non-volatile read only memory (“NROM”) cell array is disclosed. The selector transistors are oriented such that the channel length is perpendicular to the bit line and the channel width is parallel to the bit line. Subsequent reduction in the bit line pitch does not affect the channel width of the select transistors or their drive current.
摘要:
A reference cell transistor with a series resistance to improve reliability in reading cells in an associated memory array. The reference cell transistor is coupled in series with a resistive element such that a reference current flows therethrough to reduce a voltage between a gate and a source of the reference cell transistor. This bends the Ids versus Vgate curve of the reference cell downward and compensates for irregularities in the resistance seen in series with the memory cell transistors. In this fashion, the margin when reading memory cells is improved and the reference current is more reliable. The resistive element may be external to a region having the reference cell transistor. Alternatively, the resistive element may be internal to a region with the memory array and reference cell. For example, it may be formed by extending the source region of the reference cell transistor.
摘要:
A memory cell that includes a substrate that has a first region and a second region with a channel therebetween. The memory cell further includes a gate above the channel and a charge trapping region that contains a first amount of charge, wherein the first region is doped to such an extent that electric fields are reduced at the locations in the substrate where impact ionization occurs during programming.
摘要:
A method and apparatus for coupling to a source line. Specifically, embodiments of the present invention disclose a memory device comprising an array of flash memory cells with a source line connection that facilitates straight word lines, and a method for producing the same. The array is comprised of a plurality of non-intersecting shallow trench isolation (STI) regions that isolate a plurality of memory cell columns. A source column implanted with n-type dopants is also isolated between an adjoining pair of STI regions. The source column is coupled to a plurality of common source lines that are coupled to a plurality of source regions in the array. A source contact is coupled to the source column for providing electrical coupling with the plurality of source regions. The source contact is located along a row of drain contacts that are coupled to drain regions of a row of memory cells.
摘要:
A new method for improving the accuracy of read-write operations in a multi-level flash memory cell is disclosed. The method reduces the read margin disturbance caused by the accumulation of holes at a tunneling oxide or tunneling oxide-silicon interface underneath a floating gate of the cell by applying a positive stress to the word line after a program-erase cycle.
摘要:
A semiconductor component having a memory cell coupled to a trench line and a method for manufacturing the semiconductor component. Trenches having sidewalls are formed in a semiconductor substrate and a trench line is formed in each trench. A polysilicon insert is formed between the trench line and each sidewall of the trench. A column of memory cells is formed between the trenches where each memory cell of the column of memory cells has a gate structure, a source region, and a drain region. The source regions of the column of memory cells are electrically coupled to the trench line on one side of the column of memory cells via one of the polysilicon inserts. The drain regions of the column of memory cells are electrically coupled to the trench line adjacent the opposite side of the column of memory cells via another of the polysilicon inserts.
摘要:
Accurately programming a memory cell. A voltage is applied to a drain of the memory cell to program the cell. After applying the voltage, the cell is verified as to whether it is programmed to a desired level. The magnitude of the programming voltage is increased and applied to the drain, and the memory cell is re-verified for the desired level. This is repeated until the memory cell is programmed to the desired level. Additional memory cells are programmed in this fashion in order to program multiple memory cells in a narrow distribution around the desired level. The programming can be done one memory cell at a time or many cells can be programmed in parallel. Further a ramped programming voltage can applied to the gate of the memory cell(s), such that the ramped voltage to the gate and the ramped voltage to the drain both program the memory cell.