公开(公告)号：US11646259B2

公开(公告)日：2023-05-09

申请号：US17159012

申请日：2021-01-26

Applicant: Industrial Technology Research Institute

Inventor： Shu-Wei Kuo ,  Chen-Tsai Yang ,  Wei-Yuan Cheng ,  Chien-Hsun Chu ,  Shau-Fei Cheng

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/18161

Abstract: Provided is a forming method of a redistribution structure including: forming a first redistribution layer and a first compensation circuit layer on a substrate, wherein the first compensation circuit layer surrounds the first redistribution layer, and the first compensation circuit layer and the first redistribution layer are electrically insulated from each other; forming a first dielectric layer on the first redistribution layer and the first compensation circuit layer; and forming a second redistribution layer and a second compensation circuit layer on the first dielectric layer, wherein the second compensation circuit layer surrounds the second redistribution layer, the second compensation circuit layer and the second redistribution layer are electrically insulated from each other, the second compensation circuit layer is connected to the first compensation circuit layer, and the second redistribution layer is connected to the first redistribution layer.

公开(公告)号：US12021018B2

公开(公告)日：2024-06-25

申请号：US17694445

申请日：2022-03-14

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Wei Huang ,  Shau-Fei Cheng

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49816

Abstract: This disclosure provides a conductive circuit carrier module including a carrier and a conductive circuit film layer. The conductive circuit film layer is disposed on the carrier. The conductive circuit film layer has at least one conductive circuit structure including a vertical wire part and at least four horizontal wire parts. The vertical wire part extends along a thickness direction of the conductive circuit film layer. The at least four horizontal wire parts are connected to one another via the vertical wire part and extend along a direction substantially perpendicular to the vertical wire part. The at least four horizontal wire parts are symmetrically arranged or asymmetrically arranged with respect to the vertical wire part.

公开(公告)号：US10366965B2

公开(公告)日：2019-07-30

申请号：US15856065

申请日：2017-12-28

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Shu-Wei Kuo ,  Wei-Yuan Cheng ,  Shau-Fei Cheng

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/498 ,  H01L23/544 ,  H01L21/67 ,  H01L21/48 ,  H01L23/31

Abstract: A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.

公开(公告)号：US20180294202A1

公开(公告)日：2018-10-11

申请号：US15856069

申请日：2017-12-28

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Wei-Yuan Cheng ,  Cheng-Chung Lee ,  Shau-Fei Cheng ,  Wen-Lung Chen

IPC: H01L23/31 ,  H01L23/538 ,  H01L23/60 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A chip package structure and a manufacturing method thereof are provided. The chip package structure includes a frame disposed around a chip, a filling material filled in the space between the chip and the frame, and a protection layer covering the chip, the frame, and the filling material. The Young's modulus of the filling material is respectively smaller than the Young's modulus of the chip, the Young's modulus of the frame, and the Young's modulus of the protection layer.

公开(公告)号：US20220130744A1

公开(公告)日：2022-04-28

申请号：US17159012

申请日：2021-01-26

Applicant: Industrial Technology Research Institute

Inventor： Shu-Wei Kuo ,  Chen-Tsai Yang ,  Wei-Yuan Cheng ,  Chien-Hsun Chu ,  Shau-Fei Cheng

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48

Abstract: Provided is a forming method of a redistribution structure including: forming a first redistribution layer and a first compensation circuit layer on a substrate, wherein the first compensation circuit layer surrounds the first redistribution layer, and the first compensation circuit layer and the first redistribution layer are electrically insulated from each other; forming a first dielectric layer on the first redistribution layer and the first compensation circuit layer; and forming a second redistribution layer and a second compensation circuit layer on the first dielectric layer, wherein the second compensation circuit layer surrounds the second redistribution layer, the second compensation circuit layer and the second redistribution layer are electrically insulated from each other, the second compensation circuit layer is connected to the first compensation circuit layer, and the second redistribution layer is connected to the first redistribution layer.

公开(公告)号：US20190131271A1

公开(公告)日：2019-05-02

申请号：US15856065

申请日：2017-12-28

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Shu-Wei Kuo ,  Wei-Yuan Cheng ,  Shau-Fei Cheng

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/544 ,  H01L21/67 ,  H01L21/48

CPC classification number: H01L24/75 ,  H01L21/4853 ,  H01L21/67144 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2224/16165 ,  H01L2224/75753 ,  H01L2224/75756 ,  H01L2224/81121 ,  H01L2224/81136

Abstract: A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.