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公开(公告)号:US10804354B2
公开(公告)日:2020-10-13
申请号:US15933998
申请日:2018-03-23
Applicant: Infineon Technologies AG
Inventor: Hans Taddiken , Martin Bartels , Andrea Cattaneo , Henning Feick , Christian Kuehn , Anton Steltenpohl
IPC: H01L23/66 , H01L49/02 , H01L27/06 , H01L23/522
Abstract: A radio frequency resistor element comprises a resistive polysilicon trace, an isolation component and a semiconductor substrate. The resistive polysilicon trace is located above the isolation component. The isolation component is laterally at least partially surrounded by a modified semiconductor region located above the semiconductor substrate and having a higher charge carrier recombination rate than the semiconductor substrate.
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公开(公告)号:US20190013806A1
公开(公告)日:2019-01-10
申请号:US15644435
申请日:2017-07-07
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Winfried Bakalski , Andrea Cattaneo , Bernd Schleicher , Anton Steltenpohl , Hans Taddiken , Danial Tayari
IPC: H03K17/16
CPC classification number: H03K17/162
Abstract: In accordance with an embodiment, a circuit includes an RF switch, a leakage compensation circuit having a bias port and a reference port, a replica resistor coupled between a reference node and the reference port of the leakage compensation circuit, and a bias resistor coupled between the bias port of the leakage compensation circuit and a load path of the RF switch. The leakage compensation circuit configured to mirror a current from the bias port to the reference port, and apply a voltage from the reference port to the bias port.
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公开(公告)号:US11139813B1
公开(公告)日:2021-10-05
申请号:US17028452
申请日:2020-09-22
Applicant: Infineon Technologies AG
Inventor: Andrea Cattaneo , Valentyn Solomko
IPC: H03K3/012 , H03K17/16 , H03K17/687
Abstract: An RF switch includes serially coupled RF cells coupled between a first switch node and a second switch node, wherein each of the serially coupled RF cells include at least one transistor; and a varactor circuit coupled to at least one node of a transistor in an RF cell, and coupled between the RF cell and an adjacent RF cell, wherein the varactor circuit is configured for equalizing a voltage of the RF cell and a voltage of the adjacent RF cell during an off mode of the RF switch.
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公开(公告)号:US20200321957A1
公开(公告)日:2020-10-08
申请号:US16872829
申请日:2020-05-12
Applicant: Infineon Technologies AG
Inventor: Semen Syroiezhin , Pablo Araujo Do Nascimento , Winfried Bakalski , Andrea Cattaneo , Jochen Essel , Oguzhan Oezdamar , Johannes Klaus Rimmelspacher , Valentyn Solomko , Danial Tayari , Andreas Wickmann
Abstract: A radio frequency switch includes a first transistor and a second transistor coupled together to establish a switchable RF path, and a first compensation network coupled between the body terminal of the first transistor and the drain terminal of the second transistor, wherein the first compensation network establishes a path for current flowing between the body terminal of the first transistor and the drain terminal of the second transistor in a first direction and blocks current flowing in a second direction opposite to the first direction.
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公开(公告)号:US10734987B2
公开(公告)日:2020-08-04
申请号:US16506343
申请日:2019-07-09
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Carsten Ahrens , Winfried Bakalski , Andrea Cattaneo , Bernd Schleicher
IPC: H03K17/687 , H03K17/06
Abstract: A radio frequency, RF, switch device includes a plurality of switch units, wherein the switch units are coupled in series between a first series terminal and a second series terminal to establish a switchable RF path; and a plurality of ballasting capacitor units, wherein each ballasting capacitor unit is coupled in parallel to a respective switch unit, to provide a selectable capacitance in parallel to a signal path of the respective switch unit, wherein each ballasting capacitor unit includes at least one ballasting capacitor switch element to switch the capacitance of the ballasting capacitor unit between a first capacitance value and a second capacitance value, wherein the second capacitance value is larger than the first capacitance value.
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公开(公告)号:US10931275B2
公开(公告)日:2021-02-23
申请号:US16872829
申请日:2020-05-12
Applicant: Infineon Technologies AG
Inventor: Semen Syroiezhin , Pablo Araujo Do Nascimento , Winfried Bakalski , Andrea Cattaneo , Jochen Essel , Oguzhan Oezdamar , Johannes Klaus Rimmelspacher , Valentyn Solomko , Danial Tayari , Andreas Wickmann
Abstract: A radio frequency switch includes a first transistor and a second transistor coupled together to establish a switchable RF path, and a first compensation network coupled between the body terminal of the first transistor and the drain terminal of the second transistor, wherein the first compensation network establishes a path for current flowing between the body terminal of the first transistor and the drain terminal of the second transistor in a first direction and blocks current flowing in a second direction opposite to the first direction.
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公开(公告)号:US10680599B1
公开(公告)日:2020-06-09
申请号:US16374139
申请日:2019-04-03
Applicant: Infineon Technologies AG
Inventor: Semen Syroiezhin , Pablo Araujo Do Nascimento , Winfried Bakalski , Andrea Cattaneo , Jochen Essel , Oguzhan Oezdamar , Johannes Klaus Rimmelspacher , Valentyn Solomko , Danial Tayari , Andreas Wickmann
Abstract: A radio frequency switch includes a first transistor and a second transistor coupled together to establish a switchable RF path, and a first compensation network coupled between the body terminal of the first transistor and the drain terminal of the second transistor, wherein the first compensation network establishes a path for current flowing between the body terminal of the first transistor and the drain terminal of the second transistor in a first direction and blocks current flowing in a second direction opposite to the first direction.
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公开(公告)号:US20200028504A1
公开(公告)日:2020-01-23
申请号:US16506343
申请日:2019-07-09
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Carsten Ahrens , Winfried Bakalski , Andrea Cattaneo , Bernd Schleicher
IPC: H03K17/06
Abstract: A radio frequency, RF, switch device includes a plurality of switch units, wherein the switch units are coupled in series between a first series terminal and a second series terminal to establish a switchable RF path; and a plurality of ballasting capacitor units, wherein each ballasting capacitor unit is coupled in parallel to a respective switch unit, to provide a selectable capacitance in parallel to a signal path of the respective switch unit, wherein each ballasting capacitor unit includes at least one ballasting capacitor switch element to switch the capacitance of the ballasting capacitor unit between a first capacitance value and a second capacitance value, wherein the second capacitance value is larger than the first capacitance value.
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公开(公告)号:US10333510B2
公开(公告)日:2019-06-25
申请号:US15644435
申请日:2017-07-07
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Winfried Bakalski , Andrea Cattaneo , Bernd Schleicher , Anton Steltenpohl , Hans Taddiken , Danial Tayari
IPC: H03K17/16
Abstract: In accordance with an embodiment, a circuit includes an RF switch, a leakage compensation circuit having a bias port and a reference port, a replica resistor coupled between a reference node and the reference port of the leakage compensation circuit, and a bias resistor coupled between the bias port of the leakage compensation circuit and a load path of the RF switch. The leakage compensation circuit configured to mirror a current from the bias port to the reference port, and apply a voltage from the reference port to the bias port.
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公开(公告)号:US20180286941A1
公开(公告)日:2018-10-04
申请号:US15933998
申请日:2018-03-23
Applicant: Infineon Technologies AG
Inventor: Hans Taddiken , Martin Bartels , Andrea Cattaneo , Henning Feick , Christian Kuehn , Anton Steltenpohl
CPC classification number: H01L28/20 , H01L23/5228 , H01L23/66 , H01L27/0641 , H01L2924/1421
Abstract: A radio frequency resistor element comprises a resistive polysilicon trace, an isolation component and a semiconductor substrate. The resistive polysilicon trace is located above the isolation component. The isolation component is laterally at least partially surrounded by a modified semiconductor region located above the semiconductor substrate and having a higher charge carrier recombination rate than the semiconductor substrate.
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