公开(公告)号：US10008392B2

公开(公告)日：2018-06-26

申请号：US15424995

申请日：2017-02-06

申请人： Infineon Technologies AG

发明人： Alexander Hoehn ,  Georg Borghoff

IPC分类号： H01L21/48 ,  H01L21/52 ,  H01L23/053 ,  H01L23/08 ,  H01L23/373 ,  H01L23/498 ,  H05K5/00

CPC分类号： H01L23/053 ,  H01L21/4817 ,  H01L21/4853 ,  H01L21/4885 ,  H01L21/52 ,  H01L23/08 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/0603 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H05K5/0008 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module is produced by: providing an electrically conductive terminal block having a screw thread, a connecting conductor having first and second sections, a module housing, a circuit carrier having a dielectric insulation carrier and an upper metallization layer on an upper side of the insulation carrier, and a semiconductor component; fitting the semiconductor component on the circuit carrier; producing a firm and electrically conductive connection between the terminal block and the connecting conductor at the first section; producing a material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section; and arranging the terminal block and the circuit carrier fitted with the semiconductor component on the module housing so the semiconductor component is arranged in the module housing and the screw thread is accessible from an outer side of the module housing.

公开(公告)号：US20170148644A1

公开(公告)日：2017-05-25

申请号：US15424995

申请日：2017-02-06

申请人： Infineon Technologies AG

发明人： Alexander Hoehn ,  Georg Borghoff

IPC分类号： H01L21/48 ,  H01L23/053 ,  H01L23/373 ,  H01L23/498 ,  H01L23/08 ,  H05K5/00 ,  H01L21/52

CPC分类号： H01L23/053 ,  H01L21/4817 ,  H01L21/4853 ,  H01L21/4885 ,  H01L21/52 ,  H01L23/08 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/0603 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H05K5/0008 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module is produced by: providing an electrically conductive terminal block having a screw thread, a connecting conductor having first and second sections, a module housing, a circuit carrier having a dielectric insulation carrier and an upper metallization layer on an upper side of the insulation carrier, and a semiconductor component; fitting the semiconductor component on the circuit carrier; producing a firm and electrically conductive connection between the terminal block and the connecting conductor at the first section; producing a material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section; and arranging the terminal block and the circuit carrier fitted with the semiconductor component on the module housing so the semiconductor component is arranged in the module housing and the screw thread is accessible from an outer side of the module housing.

公开(公告)号：US20160126154A1

公开(公告)日：2016-05-05

申请号：US14925274

申请日：2015-10-28

申请人： Infineon Technologies AG

发明人： Alexander Hoehn ,  Georg Borghoff

IPC分类号： H01L23/053 ,  H05K5/00 ,  H01L21/52 ,  H01L21/48 ,  H01L23/498 ,  H01L23/08

CPC分类号： H01L23/053 ,  H01L21/4817 ,  H01L21/4853 ,  H01L21/4885 ,  H01L21/52 ,  H01L23/08 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/0603 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H05K5/0008 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module includes a module housing and a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied onto an upper side of the dielectric insulation carrier. A semiconductor component is arranged on the circuit carrier. The power semiconductor module also has an electrically conductive terminal block connected firmly and electrically conductively to the circuit carrier and/or to the semiconductor component. The terminal block has a screw thread that is accessible from an outer side of the module housing. A method for producing such a power semiconductor module is also provided.

摘要翻译： 功率半导体模块包括模块壳体和电路载体，该电路载体具有施加到介电绝缘载体的上侧上的介电绝缘载体和上金属化层。 半导体元件布置在电路载体上。 功率半导体模块还具有导电端子块，其牢固且导电地连接到电路载体和/或连接到半导体部件。 接线端子具有可从模块外壳的外侧接近的螺纹。 还提供了一种用于制造这种功率半导体模块的方法。

公开(公告)号：US20130221513A1

公开(公告)日：2013-08-29

申请号：US13778604

申请日：2013-02-27

申请人： Infineon Technologies AG

发明人： Georg Borghoff

IPC分类号： H01L23/36

CPC分类号： H01L23/36 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor module system includes a first semiconductor module and a second semiconductor module. The first semiconductor module has a first housing and a first base plate. The second semiconductor module has a second housing and a second base plate. The first base plate includes a first fitting segment fitted with a semiconductor component, and a first adjustment segment separated from the first fitting segment. The first adjustment segment also has a first adjustment device. The second base plate has a second adjustment device. The first semiconductor module and the second semiconductor module are configured to be positioned relative to one another using the first adjustment device and the second adjustment device so as to form at least one undercut connection. The first fitting segment and the first adjustment segment are connected to the first housing in a captive manner even when the undercut connection is not formed.

摘要翻译： 半导体模块系统包括第一半导体模块和第二半导体模块。 第一半导体模块具有第一壳体和第一基板。 第二半导体模块具有第二壳体和第二基板。 第一基板包括装配有半导体部件的第一配件段和与第一配件段分离的第一调节段。 第一调整段还具有第一调节装置。 第二基板具有第二调节装置。 第一半导体模块和第二半导体模块被配置为使用第一调整装置和第二调整装置相对于彼此定位，以便形成至少一个底切连接。 即使没有形成底切连接，第一装配段和第一调节段以捕获方式连接到第一壳体。

公开(公告)号：US09991609B2

公开(公告)日：2018-06-05

申请号：US14941349

申请日：2015-11-13

申请人： Infineon Technologies AG

发明人： Alexander Hoehn ,  Georg Borghoff

IPC分类号： H01R4/00 ,  H05K5/00 ,  H01R4/30 ,  H01R4/34 ,  H01L23/48 ,  H01L21/50 ,  H01L25/07 ,  H01R12/70

CPC分类号： H01R4/301 ,  H01L21/50 ,  H01L23/48 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/48139 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01R4/34 ,  H01R12/7088 ,  H05K5/00 ,  H01L2224/45099

摘要： An electrical connection module system includes a first connection plate with a first connection end and at least one first foot section, a first screw nut, and a dielectric holder. The dielectric holder has a first reception region for receiving the first screw nut. The first connection plate can, when the first screw nut is placed in the first reception region, be pushed onto the dielectric holder and be brought into a first target position such that the first screw nut is arranged between the dielectric holder and the first connection end and is held by the first connection end in the first reception region in such a way that the first screw nut cannot fall out.

公开(公告)号：USD762597S1

公开(公告)日：2016-08-02

申请号：US29516507

申请日：2015-02-03

申请人： Infineon Technologies AG

设计人： Andras Bertalan ,  Georg Borghoff ,  Alexander Hoehn

公开(公告)号：US20160141770A1

公开(公告)日：2016-05-19

申请号：US14941349

申请日：2015-11-13

申请人： Infineon Technologies AG

发明人： Alexander Hoehn ,  Georg Borghoff

IPC分类号： H01R4/30 ,  H01R43/20 ,  H05K3/28 ,  H05K5/00 ,  H01R4/34 ,  H05K3/30

CPC分类号： H01R4/301 ,  H01L21/50 ,  H01L23/48 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/48139 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01R4/34 ,  H01R12/7088 ,  H05K5/00 ,  H01L2224/45099

摘要： An electrical connection module system includes a first connection plate with a first connection end and at least one first foot section, a first screw nut, and a dielectric holder. The dielectric holder has a first reception region for receiving the first screw nut. The first connection plate can, when the first screw nut is placed in the first reception region, be pushed onto the dielectric holder and be brought into a first target position such that the first screw nut is arranged between the dielectric holder and the first connection end and is held by the first connection end in the first reception region in such a way that the first screw nut cannot fall out.

摘要翻译： 电连接模块系统包括具有第一连接端和至少一个第一脚部的第一连接板，第一螺母和电介质保持器。 电介质保持器具有用于接收第一螺母的第一接收区域。 当第一螺母被放置在第一接收区域中时，第一连接板可以被推到电介质保持器上并进入第一目标位置，使得第一螺母位于介质保持器和第一连接端 并且以第一螺母不能脱落的方式被第一接收区域中的第一连接端保持。

公开(公告)号：US10020237B2

公开(公告)日：2018-07-10

申请号：US14925274

申请日：2015-10-28

申请人： Infineon Technologies AG

发明人： Alexander Hoehn ,  Georg Borghoff

IPC分类号： H01L23/02 ,  H01L23/15 ,  H01L23/053 ,  H01L21/48 ,  H01L23/498 ,  H05K5/00

CPC分类号： H01L23/053 ,  H01L21/4817 ,  H01L21/4853 ,  H01L21/4885 ,  H01L21/52 ,  H01L23/08 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/0603 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H05K5/0008 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module includes a module housing and a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied onto an upper side of the dielectric insulation carrier. A semiconductor component is arranged on the circuit carrier. The power semiconductor module also has an electrically conductive terminal block connected firmly and electrically conductively to the circuit carrier and/or to the semiconductor component. The terminal block has a screw thread that is accessible from an outer side of the module housing. A method for producing such a power semiconductor module is also provided.

公开(公告)号：USD748595S1

公开(公告)日：2016-02-02

申请号：US29516506

申请日：2015-02-03

申请人： Infineon Technologies AG

设计人： Andras Bertalan ,  Georg Borghoff ,  Alexander Hoehn

公开(公告)号：US09024433B2

公开(公告)日：2015-05-05

申请号：US13778604

申请日：2013-02-27

申请人： Infineon Technologies AG

发明人： Georg Borghoff

IPC分类号： H01L23/10 ,  H01L23/36 ,  H01L25/07

CPC分类号： H01L23/36 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor module system includes a first semiconductor module and a second semiconductor module. The first semiconductor module has a first housing and a first base plate. The second semiconductor module has a second housing and a second base plate. The first base plate includes a first fitting segment fitted with a semiconductor component, and a first adjustment segment separated from the first fitting segment. The first adjustment segment also has a first adjustment device. The second base plate has a second adjustment device. The first semiconductor module and the second semiconductor module are configured to be positioned relative to one another using the first adjustment device and the second adjustment device so as to form at least one undercut connection. The first fitting segment and the first adjustment segment are connected to the first housing in a captive manner even when the undercut connection is not formed.

摘要翻译： 半导体模块系统包括第一半导体模块和第二半导体模块。 第一半导体模块具有第一壳体和第一基板。 第二半导体模块具有第二壳体和第二基板。 第一基板包括装配有半导体部件的第一配件段和与第一配件段分离的第一调节段。 第一调整段还具有第一调节装置。 第二基板具有第二调节装置。 第一半导体模块和第二半导体模块被配置为使用第一调整装置和第二调整装置相对于彼此定位，以便形成至少一个底切连接。 即使没有形成底切连接，第一装配段和第一调节段以捕获方式连接到第一壳体。