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公开(公告)号:US20170140938A1
公开(公告)日:2017-05-18
申请号:US15348245
申请日:2016-11-10
Applicant: Infineon Technologies AG
IPC: H01L21/265 , H01L21/266 , H01L21/324
CPC classification number: H01L21/2652 , H01L21/263 , H01L21/26513 , H01L21/26586 , H01L21/266 , H01L21/324
Abstract: A method of forming a semiconductor device includes irradiating a semiconductor body with particles. Dopant ions are implanted into the semiconductor body such that the dopant ions are configured to be activated as donors or acceptors. Thereafter, the semiconductor body is processed thermally.
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公开(公告)号:US20180269872A1
公开(公告)日:2018-09-20
申请号:US15921893
申请日:2018-03-15
Applicant: Infineon Technologies AG
Inventor: Thomas BASLER , Roman BABURSKE , Johannes Georg LAVEN , Franz-Josef NIEDERNOSTHEIDE , Hans-Joachim SCHULZE
IPC: H03K17/567 , H03K17/687 , H01L27/06 , H01L27/088 , H01L29/78 , H01L29/739 , H01L29/778 , H01L29/165 , H01L29/16 , H01L29/808
CPC classification number: H03K17/567 , H01L27/0635 , H01L27/088 , H01L29/1608 , H01L29/165 , H01L29/7393 , H01L29/7787 , H01L29/78 , H01L29/808 , H01L2924/10272 , H01L2924/13055 , H01L2924/13091 , H03K17/12 , H03K17/687 , H03K2217/0036
Abstract: Transistor devices are described that include a first transistor and a second transistor coupled in parallel between a first terminal and a second terminal. The second transistor is based on a wide bandgap semiconductor material. The second transistor has a breakthrough voltage lower than a breakthrough voltage of the first transistor over a predetermined operating range. The predetermined operating range comprises at least an operating range for which the transistor device is specified.
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