公开(公告)号：US20180358287A1

公开(公告)日：2018-12-13

申请号：US16007154

申请日：2018-06-13

Applicant: Infineon Technologies AG

Inventor： Jia Yi Wong ,  Kar Meng Ho

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49548 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49575 ,  H01L23/49579

Abstract: An electronic device and method is disclosed. In one example, the electronic device includes a semiconductor chip and a leadframe. The leadframe includes a first class of leads and a second class of leads. The leads of the second class of leads are thinner than leads of the first class of leads.

公开(公告)号：US11107754B2

公开(公告)日：2021-08-31

申请号：US16007154

申请日：2018-06-13

Applicant: Infineon Technologies AG

Inventor： Jia Yi Wong ,  Kar Meng Ho

IPC: H01L25/16 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: An electronic device and method is disclosed. In one example, the electronic device includes a semiconductor chip and a leadframe. The leadframe includes a first class of leads and a second class of leads. The leads of the second class of leads are thinner than leads of the first class of leads.

公开(公告)号：US10431526B2

公开(公告)日：2019-10-01

申请号：US15727725

申请日：2017-10-09

Applicant: Infineon Technologies AG

Inventor： Kar Meng Ho ,  Chiew Li Tai ,  Jia Yi Wong ,  Sanjay Kumar Murugan

IPC: H01L23/492 ,  H01L21/48 ,  H01L23/14 ,  H01L23/047 ,  H01L23/31 ,  H01L23/367

Abstract: A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an outer peripheral region of the heat slug such that the first and second leads are vertically separated from and electrically insulated from the heat slug. The central die attach region is exposed from the first and second fastening mechanisms after adhering the first and second fastening mechanisms to the upper surface of the heat slug.

公开(公告)号：US20190109070A1

公开(公告)日：2019-04-11

申请号：US15727725

申请日：2017-10-09

Applicant: Infineon Technologies AG

Inventor： Kar Meng Ho ,  Chiew Li Tai ,  Jia Yi Wong ,  Sanjay Kumar Murugan

IPC: H01L23/492 ,  H01L23/14 ,  H01L21/48

CPC classification number: H01L23/492 ,  H01L21/481 ,  H01L21/4814 ,  H01L23/047 ,  H01L23/14 ,  H01L23/315 ,  H01L23/367 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/49111 ,  H01L2924/00014

Abstract: A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an outer peripheral region of the heat slug such that the first and second leads are vertically separated from and electrically insulated from the heat slug. The central die attach region is exposed from the first and second fastening mechanisms after adhering the first and second fastening mechanisms to the upper surface of the heat slug.