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1.发明申请公开(公告)号：US20250069964A1
公开(公告)日：2025-02-27
申请号：US18802657
申请日：2024-08-13
Applicant: Infineon Technologies AG
Inventor： Marco Ludwig , Roman Lennart Tschirbs
IPC: H01L23/10 , H01L21/50 , H01L23/04 , H01L23/538 , H01L25/00
Abstract: A housing for a semiconductor module includes a first housing member and a second housing member. In an unmounted state of the housing, the first housing member and the second housing member are separate and distinct from each other. In an assembled state of the housing, the first housing member and the second housing member are attached to each other and together form a closed frame. The closed frame formed by the first housing member and the second housing member includes a mounting section for mounting the housing to a substrate such that the closed frame extends around the substrate.
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公开(公告)号：US20210358820A1
公开(公告)日：2021-11-18
申请号：US17319131
申请日：2021-05-13
Applicant: Infineon Technologies AG
Inventor： Marco Ludwig
Abstract: A power semiconductor module includes: at least one semiconductor substrate having a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; at least one semiconductor body arranged on the first metallization layer; at least one end stop element arranged either on the semiconductor substrate or on one of the at least one semiconductor body and extending from the semiconductor substrate or the respective semiconductor body in a vertical direction that is perpendicular to a top surface of the semiconductor substrate; and a housing at least partly enclosing the semiconductor substrate, the housing including sidewalls and a cover. The housing further includes at least one press-on pin extending from the cover of the housing towards one of the at least one end stop element, and exerting a pressure on the respective end stop element.
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3.发明公开公开(公告)号：US20230253291A1
公开(公告)日：2023-08-10
申请号：US18101608
申请日：2023-01-26
Applicant: Infineon Technologies AG
Inventor： Matthias Lassmann , Andre Arens , Marco Ludwig , Guido Bönig
IPC: H01L23/42 , H01L23/373 , H01L23/31 , H01L23/498 , H01L25/07 , H01L21/56
CPC classification number: H01L23/42 , H01L23/3737 , H01L23/3121 , H01L23/49811 , H01L23/315 , H01L25/072 , H01L23/49833 , H01L23/49844 , H01L21/56 , H01L2924/182 , H01L2924/13055 , H01L2224/32225 , H01L24/48
Abstract: A power semiconductor module arrangement includes a housing, a substrate arranged inside the housing, a printed circuit board arranged inside the housing distant from and in parallel to the substrate, an encapsulant at least partly filling the interior of the housing and covering the substrate and the printed circuit board, and a heat protective layer arranged inside the housing between the substrate and the printed circuit board, and extending in a plane that is parallel to the substrate and the printed circuit board. A thermal resistance of the heat protective layer is greater than a thermal resistance of the encapsulant.
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公开(公告)号：US20230180400A1
公开(公告)日：2023-06-08
申请号：US18070849
申请日：2022-11-29
Applicant: Infineon Technologies AG
Inventor： Alexander Herbrandt , Philipp Bräutigam , Andre Arens , Marco Ludwig
CPC classification number: H05K5/0026 , H05K5/0247 , H01L25/072
Abstract: An arrangement includes a housing and a printed circuit board (PCB) arranged vertically above the housing. The housing includes: at least one protrusion attached to sidewalls and arranged on an outside of the housing at a lower end with at least one first through hole provided in the protrusion; holding devices each arranged inside a first through hole and/or between the PCB and the first through hole; and fastening elements configured to attach the housing to a heat sink or base plate. Each holding device is configured to clamp a corresponding fastening element such that the fastening elements are secured in defined positions, and to align each fastening element with a different first through hole. The PCB includes second through holes each arranged vertically above and aligned with a different fastening element. A diameter of each second through hole is less than the largest diameter of the respective fastening element.
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公开(公告)号：US11615994B2
公开(公告)日：2023-03-28
申请号：US17201239
申请日：2021-03-15
Applicant: Infineon Technologies AG
Inventor： Johannes Uhlig , Sven Hagebusch , Marco Ludwig , Ulrich Nolten
Abstract: A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.
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Patent Agency Ranking
公开(公告)号：US20230077384A1
公开(公告)日：2023-03-16
申请号：US17942317
申请日：2022-09-12
Applicant: Infineon Technologies AG
Inventor： Marco Ludwig , Guido Boenig
IPC: H01L23/16 , H01L25/065 , H01L25/18
Abstract: A power semiconductor module arrangement includes at least one substrate comprising a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; at least one semiconductor body arranged on the first metallization layer; a housing at least partly enclosing the substrate, the housing comprising sidewalls; and at least one press-on pin, wherein each press-on pin is arranged either on the substrate or on one of the at least one semiconductor body and extends from the substrate or the respective semiconductor body in a vertical direction that is perpendicular to a top surface of the substrate, and each press-on pin is mechanically coupled to at least one sidewall of the housing by means of a bar, each bar extending horizontally between the respective press-on pin and sidewall, and parallel to the top surface of the substrate.
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公开(公告)号：US11856718B2
公开(公告)日：2023-12-26
申请号：US18070849
申请日：2022-11-29
Applicant: Infineon Technologies AG
Inventor： Alexander Herbrandt , Philipp Bräutigam , Andre Arens , Marco Ludwig
CPC classification number: H05K5/0026 , H01L23/4006 , H05K5/0247 , H05K7/209 , H01L23/49811 , H01L24/48 , H01L25/072 , H01L2224/48225
Abstract: An arrangement includes a housing and a printed circuit board (PCB) arranged vertically above the housing. The housing includes: at least one protrusion attached to sidewalls and arranged on an outside of the housing at a lower end with at least one first through hole provided in the protrusion; holding devices each arranged inside a first through hole and/or between the PCB and the first through hole; and fastening elements configured to attach the housing to a heat sink or base plate. Each holding device is configured to clamp a corresponding fastening element such that the fastening elements are secured in defined positions, and to align each fastening element with a different first through hole. The PCB includes second through holes each arranged vertically above and aligned with a different fastening element. A diameter of each second through hole is less than the largest diameter of the respective fastening element.
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公开(公告)号：US20230197542A1
公开(公告)日：2023-06-22
申请号：US18108984
申请日：2023-02-13
Applicant: Infineon Technologies AG
Inventor： Johannes Uhlig , Sven Hagebusch , Marco Ludwig , Ulrich Nolten
Abstract: A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.
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公开(公告)号：US11581230B2
公开(公告)日：2023-02-14
申请号：US17319131
申请日：2021-05-13
Applicant: Infineon Technologies AG
Inventor： Marco Ludwig
Abstract: A power semiconductor module includes: at least one semiconductor substrate having a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; at least one semiconductor body arranged on the first metallization layer; at least one end stop element arranged either on the semiconductor substrate or on one of the at least one semiconductor body and extending from the semiconductor substrate or the respective semiconductor body in a vertical direction that is perpendicular to a top surface of the semiconductor substrate; and a housing at least partly enclosing the semiconductor substrate, the housing including sidewalls and a cover. The housing further includes at least one press-on pin extending from the cover of the housing towards one of the at least one end stop element, and exerting a pressure on the respective end stop element.
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公开(公告)号：US20210305109A1
公开(公告)日：2021-09-30
申请号：US17201239
申请日：2021-03-15
Applicant: Infineon Technologies AG
Inventor： Johannes Uhlig , Sven Hagebusch , Marco Ludwig , Ulrich Nolten
Abstract: A module includes an electronic component, an enclosure at least partially enclosing the electronic component and defining a module interface at which the module is configured to be mounted on a mounting base, and a gas flow-inhibiting sealing at the module interface and configured to inhibit gas from propagating from an exterior of the module towards the electronic component. An electronic device that includes the module and a method of manufacturing the module are also described.
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