公开(公告)号：US11646479B2

公开(公告)日：2023-05-09

申请号：US16743134

申请日：2020-01-15

Applicant: Infineon Technologies AG

Inventor： Markus Josef Lang

IPC: H01P3/12 ,  H05K1/18 ,  H05K3/00 ,  H01P11/00 ,  G01S7/03 ,  G01S7/35

CPC classification number: H01P3/121 ,  G01S7/032 ,  G01S7/35 ,  H01P11/002 ,  H05K1/181 ,  H05K3/0026 ,  H05K3/0044 ,  H05K2201/10098

Abstract: A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

公开(公告)号：US11482771B2

公开(公告)日：2022-10-25

申请号：US17248167

申请日：2021-01-12

Applicant: Infineon Technologies AG

Inventor： Thomas Lampersberger ,  Reinhard Feger ,  Markus Josef Lang ,  Juergen Minichshofer ,  Ernst Seler ,  Andreas Stelzer

IPC: H01Q1/22 ,  H01Q21/00 ,  H01Q9/04 ,  H01Q5/371

Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.

公开(公告)号：US12248088B2

公开(公告)日：2025-03-11

申请号：US17541687

申请日：2021-12-03

Applicant: Infineon Technologies AG

Inventor： Rainer Findenig ,  Bernhard Greslehner-Nimmervoll ,  Grigory Itkin ,  Markus Josef Lang ,  Ulrich Moeller ,  Martin Wiessflecker

IPC: G01S7/35 ,  G01S13/02

Abstract: A radar semiconductor chip includes a radar circuit component configured to generate at least part of a frequency-modulated ramp signal or process at least part of a reflected frequency-modulated ramp signal according to a control parameter; a memory configured to store a sequencing program associated with regulating the control parameter, wherein the sequencing program specifies a first data source, external to the sequencing program, that is configured to provide a first data value corresponding to the control parameter; and a decoder configured to read the sequencing program, access the first data value from the first data source specified by the sequencing program, derive a first control value for the control parameter from the first data value, and provide the first control value to the radar circuit component. The radar circuit component regulates a controlled circuit function in accordance with the control parameter based on the first control value.

公开(公告)号：US11668796B2

公开(公告)日：2023-06-06

申请号：US16950287

申请日：2020-11-17

Applicant: Infineon Technologies AG

Inventor： Philipp Scherz ,  Markus Josef Lang ,  Roland Vuketich

IPC: G01S7/40 ,  G01S7/35

CPC classification number: G01S7/4021 ,  G01S7/352 ,  G01S7/4008 ,  G01S7/4017

Abstract: A method is proposed for determining at least one calibration parameter for a radar system having a first radar transceiver and a second radar transceiver. The method includes performing a first calibration measurement and a second calibration measurement. The first calibration measurement and the second calibration measurement both include generating a first frequency-modulated oscillation signal and a second frequency-modulated oscillation signal, and combining the first oscillation signal received via the second terminal with the second oscillation signal, in order to generate a first difference signal for the first calibration measurement and a second difference signal for the second calibration measurement, both having a frequency difference between the first oscillation signal and the second oscillation signal. The method also includes determining the at least one calibration parameter based on the two difference signals generated for the first calibration measurement and for the second calibration measurement.

公开(公告)号：US12014998B2

公开(公告)日：2024-06-18

申请号：US18312800

申请日：2023-05-05

Applicant: Infineon Technologies AG

Inventor： Ernst Seler ,  Markus Josef Lang ,  Maciej Wojnowski

IPC: H01L23/66 ,  G01S13/08 ,  G01S13/931 ,  H01L23/00 ,  H01L23/498 ,  H01Q1/22

CPC classification number: H01L23/66 ,  G01S13/08 ,  H01L23/49816 ,  H01L24/16 ,  H01Q1/2283 ,  G01S13/931 ,  H01L2223/6622 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

公开(公告)号：US11658135B2

公开(公告)日：2023-05-23

申请号：US16747971

申请日：2020-01-21

Applicant: Infineon Technologies AG

Inventor： Ernst Seler ,  Markus Josef Lang ,  Maciej Wojnowski

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H01Q1/22 ,  G01S13/08 ,  G01S13/931

CPC classification number: H01L23/66 ,  G01S13/08 ,  H01L23/49816 ,  H01L24/16 ,  H01Q1/2283 ,  G01S13/931 ,  H01L2223/6622 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225

Abstract: A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.

公开(公告)号：US11435437B2

公开(公告)日：2022-09-06

申请号：US16719119

申请日：2019-12-18

Applicant: Infineon Technologies AG

Inventor： Philipp Scherz ,  Markus Josef Lang ,  Roland Vuketich

IPC: G01S7/03 ,  G01S13/931 ,  H01Q1/32 ,  H01Q3/36

Abstract: The present disclosure relates to a transmission apparatus, including at least one first RF signal connection for an RF signal having a first phase, a ring coupler having a plurality of antenna connections for coupling a plurality of antennas in the first RF signal connection, wherein the ring coupler is configured to cause, at each of different antenna connections of the ring coupler, a constructive superposition of components of the RF signal that propagate from the first RF signal connection to the respective antenna connections in different directions in the ring coupler, wherein RF signals having different phases are obtained at the different antenna connections.