公开(公告)号：US20140308793A1

公开(公告)日：2014-10-16

申请号：US14318118

申请日：2014-06-27

Applicant: Infineon Technologies AG

Inventor： Josef Dietl ,  Raimund Peichl ,  Gabriele Bettineschi

IPC: H01L29/93 ,  H01L21/326

CPC classification number: H01L29/93 ,  H01L21/326 ,  H01L29/0692

Abstract: An electrical device includes a semiconductor material. The semiconductor material includes a first region of the semiconductor material having a first conductivity type, a second region of the semiconductor material having a second conductivity type complementary to the first conductivity type and an intermediate region of the semiconductor material between the first region and the second region. The first and second regions lie next to each other the intermediate region so as to form a diode structure. A shape of the intermediate region tapers from the first region to the second region.

Abstract translation: 电气装置包括半导体材料。 半导体材料包括具有第一导电类型的半导体材料的第一区域，具有与第一导电类型互补的第二导电类型的半导体材料的第二区域和第一区域与第二导电类型之间的半导体材料的中间区域 地区。 第一和第二区域彼此相邻地形成中间区域，以便形成二极管结构。 中间区域的形状从第一区域逐渐变细到第二区域。

公开(公告)号：US20140167272A1

公开(公告)日：2014-06-19

申请号：US13716004

申请日：2012-12-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Stefan Martens ,  Berthold Schuderer ,  Mathias Vaupel ,  Raimund Peichl

IPC: H01L23/544 ,  H01L21/48

CPC classification number: H01L23/544 ,  H01L23/3171 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip.

Abstract translation: 半导体器件包括芯片，布置在芯片的前侧上的接触焊盘和布置在接触焊盘上的识别标记。 识别标记包括关于芯片的属性的信息。

公开(公告)号：US20140124893A1

公开(公告)日：2014-05-08

申请号：US13667996

申请日：2012-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Josef Dietl ,  Raimund Peichl ,  Gabriele Bettineschi

IPC: H01L29/93 ,  H01L21/04 ,  H01L27/06

CPC classification number: H01L29/93 ,  H01L21/326 ,  H01L29/0692

Abstract: An electrical device includes a semiconductor material. The semiconductor material includes a first region of the semiconductor material having a first conductivity type, a second region of the semiconductor material having a second conductivity type complementary to the first conductivity type and an intermediate region of the semiconductor material between the first region and the second region. The first and second regions lie next to each other the intermediate region so as to form a diode structure. A shape of the intermediate region tapers from the first region to the second region.

公开(公告)号：US09312226B2

公开(公告)日：2016-04-12

申请号：US13716004

申请日：2012-12-14

Applicant: Infineon Technologies AG

Inventor： Stefan Martens ,  Berthold Schuderer ,  Mathias Vaupel ,  Raimund Peichl

IPC: H01L23/485 ,  H01L23/544 ,  H01L23/31

CPC classification number: H01L23/544 ,  H01L23/3171 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip.

Abstract translation: 半导体器件包括芯片，布置在芯片的前侧上的接触焊盘和布置在接触焊盘上的识别标记。 识别标记包括关于芯片的属性的信息。

公开(公告)号：US20150087131A1

公开(公告)日：2015-03-26

申请号：US14032223

申请日：2013-09-20

Applicant: Infineon Technologies AG

Inventor： Stefan Martens ,  Raimund Peichl

IPC: H01L21/78 ,  H01L23/544

CPC classification number: H01L21/78 ,  H01L21/6835 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for processing a chip is provided. The method may include: providing a chip having a front side and a back side; and forming an orientation marker on the back side of the chip by forming a hole into the chip from the front side of the chip, the hole forming the orientation marker.

Abstract translation: 提供了一种处理芯片的方法。 该方法可以包括：提供具有前侧和后侧的芯片; 以及通过从所述芯片的前侧向所述芯片形成孔而形成所述芯片背面的取向标记，所述孔形成所述取向标记。