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    Molded lead frame sensor package
    2.
    发明授权
    Molded lead frame sensor package 有权

    公开(公告)号：US10781095B2

    公开(公告)日：2020-09-22

    申请号：US16222589

    申请日：2018-12-17

    Applicant: Infineon Technologies AG

    Inventor： Jochen Dangelmaier ,  Manfred Schindler ,  Horst Theuss ,  Mathias Vaupel

    IPC: B81B7/00 ,  B81C1/00

    Abstract: Examples provided herein are associated with a molded lead frame of a sensor package. An example sensor package may include a molded lead frame that includes an opening in the molded lead frame, wherein the opening extends from a mount-side of the molded lead frame to a chip-side of the molded lead frame, wherein the chip-side of the molded lead frame is opposite the mount-side; and a sensor mounted to the chip-side of the molded lead frame.

    Pressure sensor package with integrated sealing
    4.
    发明授权
    Pressure sensor package with integrated sealing 有权
    压力传感器封装，集成密封

    公开(公告)号：US09366593B2

    公开(公告)日：2016-06-14

    申请号：US14039706

    申请日：2013-09-27

    Applicant: Infineon Technologies AG

    Inventor： Mathias Vaupel ,  Horst Theuss ,  Helmut Wietschorke

    IPC: G01L9/00 ,  B81B7/00 ,  B81C1/00 ,  G01L19/00

    CPC classification number: G01L9/0045 ,  B81B7/0048 ,  B81B2201/0264 ,  B81C1/00325 ,  G01L9/0042 ,  G01L9/0054 ,  G01L19/0007 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

    Abstract: A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.

    Abstract translation: 压力传感器封装包括引线和与引线间隔开的半导体管芯，并且包括设置在管芯第一侧的端子和隔膜。 模具被配置成响应于横跨隔膜的压差而改变电参数。 该封装还包括将端子连接到引线的电导体，封装电导体，模具和引线的一部分的模制化合物，暴露隔膜的模制化合物中的空腔，以及设置在该导体的侧面上的密封环 与空腔成型。 密封环围绕腔体并具有比模塑料更低的弹性模量。 或者，密封环可以是模制化合物的脊，其从模制化合物与空腔的侧面突出并且包围空腔。 还提供了一种封装制造方法。

    Semiconductor dies having opposing sides with different reflectivity
    7.
    发明授权
    Semiconductor dies having opposing sides with different reflectivity 有权
    具有不同反射率的相对侧的半导体管芯

    公开(公告)号：US09147639B2

    公开(公告)日：2015-09-29

    申请号：US14015353

    申请日：2013-08-30

    Applicant: Infineon Technologies AG

    Inventor： Mathias Vaupel ,  Günther Ruhl

    IPC: H01L21/66 ,  H01L23/48 ,  H01L21/56 ,  H01L21/673 ,  H01L23/29 ,  H01L23/31

    CPC classification number: H01L23/48 ,  H01L21/56 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/12 ,  H01L23/291 ,  H01L23/3171 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of processing semiconductor dies is provided. Each semiconductor die has a first side with one or more terminals, a second side opposite the first side and sidewalls extending between the first and the second sides. The semiconductor dies are processed by placing the semiconductor dies on a support substrate so that the first side of each semiconductor die faces the support substrate and the second side faces away from the support substrate. A coating is applied to the semiconductor dies placed on the support substrate. The coating has a lower reflectivity than the first side of the semiconductor dies. The coating covers the second side and at least a region of the sidewalls nearest the second side of each semiconductor die. The semiconductor dies are removed from the support substrate after applying the coating for further processing as loose dies such as taping.

    Abstract translation: 提供一种处理半导体管芯的方法。 每个半导体管芯具有具有一个或多个端子的第一侧面，与第一侧面相对的第二侧面和在第一和第二侧面之间延伸的侧壁。 通过将半导体管芯放置在支撑衬底上，使得每个半导体管芯的第一侧面向支撑衬底并且第二侧面远离支撑衬底来处理半导体管芯。 将涂层施加到放置在支撑基板上的半导体管芯。 涂层具有比半导体管芯的第一侧更低的反射率。 涂层覆盖最靠近每个半导体管芯的第二侧的第二侧和至少一个侧壁的区域。 在将涂层施加作为进一步加工的松散模具如胶带之后，将半导体管芯从支撑基板上移除。

    Semiconductor Dies Having Opposing Sides with Different Reflectivity
    8.
    发明申请
    Semiconductor Dies Having Opposing Sides with Different Reflectivity 有权
    半导体模具具有不同反射率的反面

    公开(公告)号：US20150061113A1

    公开(公告)日：2015-03-05

    申请号：US14015353

    申请日：2013-08-30

    Applicant: Infineon Technologies AG

    Inventor： Mathias Vaupel ,  Günther Ruhl

    IPC: H01L23/48 ,  H01L21/66 ,  H01L21/673 ,  H01L21/56

    CPC classification number: H01L23/48 ,  H01L21/56 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/12 ,  H01L23/291 ,  H01L23/3171 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of processing semiconductor dies is provided. Each semiconductor die has a first side with one or more terminals, a second side opposite the first side and sidewalls extending between the first and the second sides. The semiconductor dies are processed by placing the semiconductor dies on a support substrate so that the first side of each semiconductor die faces the support substrate and the second side faces away from the support substrate. A coating is applied to the semiconductor dies placed on the support substrate. The coating has a lower reflectivity than the first side of the semiconductor dies. The coating covers the second side and at least a region of the sidewalls nearest the second side of each semiconductor die. The semiconductor dies are removed from the support substrate after applying the coating for further processing as loose dies such as taping.

    Abstract translation: 提供一种处理半导体管芯的方法。 每个半导体管芯具有具有一个或多个端子的第一侧面，与第一侧面相对的第二侧面和在第一和第二侧面之间延伸的侧壁。 通过将半导体管芯放置在支撑衬底上，使得每个半导体管芯的第一侧面向支撑衬底并且第二侧面远离支撑衬底来处理半导体管芯。 将涂层施加到放置在支撑基板上的半导体管芯。 涂层具有比半导体管芯的第一侧更低的反射率。 涂层覆盖最靠近每个半导体管芯的第二侧的第二侧和至少一个侧壁的区域。 在将涂层施加作为进一步加工的松散模具如胶带之后，将半导体管芯从支撑基板上移除。

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