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公开(公告)号：US09706294B2
公开(公告)日：2017-07-11
申请号：US14661429
申请日：2015-03-18
Applicant: Infineon Technologies AG
Inventor： Andreas Kopetz , Andreas Wiesbauer , Roland Helm , Christian Mandl , Arnaud Walther
CPC classification number: H04R3/00 , H04R19/005 , H04R19/04
Abstract: According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.
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公开(公告)号：US20160003698A1
公开(公告)日：2016-01-07
申请号：US14323306
申请日：2014-07-03
Applicant: Infineon Technologies AG
Inventor： Andreas Wiesbauer , Christian Mandl , Andreas Kopetz , Roland Helm
CPC classification number: G01L13/025 , G01L15/00 , H04R19/04 , H04R23/00 , H04R2201/003
Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.
Abstract translation: 根据实施例，感测运动的方法包括从第一压力传感器接收第一信号和从第二压力传感器接收第二信号，比较第一信号和第二信号，以及基于比较来表征运动。
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公开(公告)号：US20170280237A1
公开(公告)日：2017-09-28
申请号：US15620354
申请日：2017-06-12
Applicant: Infineon Technologies AG
Inventor： Andreas Kopetz , Andreas Wiesbauer , Roland Helm , Christian Mandl , Arnaud Walther
CPC classification number: H04R3/00 , H04R19/005 , H04R19/04
Abstract: According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.
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公开(公告)号：US09673785B2
公开(公告)日：2017-06-06
申请号：US14961186
申请日：2015-12-07
Applicant: Infineon Technologies AG
Inventor： Christian Herzum , Martin Wurzer , Roland Helm , Michael Kropfitsch , Stefan Barzen
CPC classification number: H03K3/01 , B81C1/0023 , B81C99/0045 , H01L2924/16151 , H01L2924/16152 , H03G3/3005 , H04R19/005 , H04R19/04 , H04R29/006 , H04R2201/003
Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.
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公开(公告)号：US09945746B2
公开(公告)日：2018-04-17
申请号：US15461771
申请日：2017-03-17
Applicant: Infineon Technologies AG
Inventor： Andreas Wiesbauer , Christian Mandl , Andreas Kopetz , Roland Helm
CPC classification number: G01L13/025 , G01L15/00 , H04R19/04 , H04R23/00 , H04R2201/003
Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.
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Patent Agency Ranking
公开(公告)号：US20170191894A1
公开(公告)日：2017-07-06
申请号：US15461771
申请日：2017-03-17
Applicant: Infineon Technologies AG
Inventor： Andreas Wiesbauer , Christian Mandl , Andreas Kopetz , Roland Helm
CPC classification number: G01L13/025 , G01L15/00 , H04R19/04 , H04R23/00 , H04R2201/003
Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.
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公开(公告)号：US09309105B2
公开(公告)日：2016-04-12
申请号：US14198645
申请日：2014-03-06
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Roland Helm
CPC classification number: B81B7/04 , B81B7/0041 , B81B2201/0257 , B81B2201/0264 , G01L1/14 , G01L9/0041 , G01L9/0042 , G01L9/0072 , G01L9/0073 , G01L13/025 , H04R19/005 , H04R23/00 , H04R2201/003
Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
Abstract translation: 在各种实施例中，提供传感器结构。 传感器结构可以包括第一导电层; 电极元件; 以及布置在电极元件的与第一导电层相对的一侧的第二导电层。 第一导电层和第二导电层可以形成室。 室中的压力可以低于室外的压力。
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公开(公告)号：US20160087606A1
公开(公告)日：2016-03-24
申请号：US14961186
申请日：2015-12-07
Applicant: Infineon Technologies AG
Inventor： Christian Herzum , Martin Wurzer , Roland Helm , Michael Kropfitsch , Stefan Barzen
CPC classification number: H03K3/01 , B81C1/0023 , B81C99/0045 , H01L2924/16151 , H01L2924/16152 , H03G3/3005 , H04R19/005 , H04R19/04 , H04R29/006 , H04R2201/003
Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.
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公开(公告)号：US10028052B2
公开(公告)日：2018-07-17
申请号：US15620354
申请日：2017-06-12
Applicant: Infineon Technologies AG
Inventor： Andreas Kopetz , Andreas Wiesbauer , Roland Helm , Christian Mandl , Arnaud Walther
Abstract: According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.
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公开(公告)号：US09670059B2
公开(公告)日：2017-06-06
申请号：US15077925
申请日：2016-03-23
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Roland Helm
CPC classification number: B81B7/04 , B81B7/0041 , B81B2201/0257 , B81B2201/0264 , G01L1/14 , G01L9/0041 , G01L9/0042 , G01L9/0072 , G01L9/0073 , G01L13/025 , H04R19/005 , H04R23/00 , H04R2201/003
Abstract: In various embodiments, a sensor structure is provided. The sensor structure may include a first conductive layer; an electrode element; and a second conductive layer arranged on an opposite side of the electrode element from the first conductive layer. The first conductive layer and the second conductive layer may form a chamber. The pressure in the chamber may be lower than the pressure outside of the chamber.
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