公开(公告)号：US20160290734A1

公开(公告)日：2016-10-06

申请号：US14673584

申请日：2015-03-30

Applicant: Infinera Corporation

Inventor： John W. OSENBACH ,  Jie TANG ,  S. Eugene MESSENGER ,  John CORONATI

IPC: F28D15/02 ,  B23P15/26

CPC classification number: F28D15/02 ,  B23P15/26 ,  B23P2700/09 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  H01L21/4882 ,  H01L23/427

Abstract: A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.

Abstract translation: 制造热管的方法可以包括提供作为主体部分的第一材料。 该方法可以包括冲压或蚀刻主体部分以包括空腔。 身体部分的一部分可以构成腔的壁。 该方法可以包括冲压或蚀刻空腔的壁以在腔的壁的一部分上提供一组波纹。 该方法可以包括在腔的壁中形成开口。 该方法可以包括将盖附接到空腔上。 所述盖构成所述空腔的气密密封件的至少一部分。 该方法可以包括将壳体附接到与腔体中的开口大致相邻的主体部分。 该方法可以包括将阀门大致在空腔的开口处附接到主体部分。

公开(公告)号：US20160178861A1

公开(公告)日：2016-06-23

申请号：US14689571

申请日：2015-04-17

Applicant: Infinera Corporation

Inventor： John W. OSENBACH ,  Timothy Butrie ,  Fred A. Kish, JR. ,  Michael Reffle

IPC: G02B6/42 ,  G02B6/13 ,  G02B6/12

CPC classification number: G02B6/4251 ,  G02B6/12004 ,  G02B6/13 ,  G02B6/136 ,  G02B6/4215 ,  G02B6/4219 ,  G02B6/423 ,  G02B6/4257 ,  G02B6/4273 ,  G02B6/4274 ,  G02B2006/12035 ,  G02B2006/12061 ,  G02B2006/12078

Abstract: A device may include a first substrate. The device may include an optical source. The optical source may generate light when a voltage or current is applied to the optical source. The optical source may be being provided on a first region of the first substrate. The device may include a second substrate. A second region of the second substrate may form a cavity with the first region of the first substrate. The optical source may extend into the cavity. The device may include an optical interconnect. The optical interconnect may be provided on or in the second substrate and outside the cavity. The optical interconnect may be configured to receive the light from the optical source.

Abstract translation: 器件可以包括第一衬底。 该装置可以包括光源。 当向光源施加电压或电流时，光源可以产生光。 光源可以设置在第一基板的第一区域上。 该装置可以包括第二基板。 第二基板的第二区域可以与第一基板的第一区域形成空腔。 光源可以延伸到空腔中。 该装置可以包括光学互连。 光学互连可以设置在第二基板上或第二基板中并且在空腔外部。 光学互连可以被配置为接收来自光源的光。